AVX Corporation released a new series of embedded Wi-Fi antennas designed to satisfy steadily increasing cross-market demand for smaller and thinner wireless products with superior signal sensitivity. The new W Series Embedded Wi-Fi Antennas offer a wide range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band […]
Embedded
Embedded multimediacard PHY now runs o 22-nm IC IP
Arasan Chip Systems expands its IP offering for TSMC’s industry-leading 22nm process technology with the immediate availability of its eMMC PHY IP for SoC Designs on the TSMC 22nm process. The eMMC PHY IP on TSMC 22nm process is seamlessly integrated with Arasan’s eMMC 5.1 Host Controller IP and Software thereby providing customers a Total […]
Smartphone chipset sports 5G modem, 4K HDR video capture
MediaTek unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera, and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line […]
SBCs boast 4K graphics for handling eDP, HDMI, MIPI displays
New Yorker Electronics has introduced the newest line in the Novasom Industries M Series of CPU, the M9. The Novasom M9 joins the well-established M7 and M7Plus Single Board Computers (SBC). Based on the prestigious Rockchip 3399, this CPU offers the new Cortex A72’s performance and the multicore Quad A53. This is used to speed-up […]
High-temperature EEPROMs reduce initial data writing time by 30%
New 125°C operation-compatible I2C bus EEPROMs, BR24H-5AC series, targets applications that require data storage under harsh environments, such as factory settings for onboard cameras and sensors, airbag operating history, and data logging for always-on operating industrial automation systems and servers. The BR24H-5AC series of 125°C operation-compatible EEPROMs is the first in the industry to achieve […]
Debug interface hardware now available for Linux on ARM
SEGGER’s entire portfolio of J-Link software is now available for Linux on ARM, for both 32-bit and 64-bit platforms. This includes both the command-line programs and GUI tools such as J-Flash, J-Flash SPI, J-Scope, the J-Link Configurator, and the GUI version of the GDB Server. J-Link for Linux on ARM supports the same target devices […]
Kilohertz-range crystals come in surface-mount packages
Epson’s MC-306 will become obsolete in 2021 and Suntsu has a replacement solution: the SWS834. The SWS834 is an equivalent product to Epson’s. Featuring 32.768kHz, and the same dimension and electrical parameters as the MC-306, the SWS834 is an easy drop-in replacement. Even better, Suntsu can provide short lead times and competitive prices. Key features […]
SoC development platform handles MCVP automotive work
Renesas Electronics Corporation announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive system-on-chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP)<https://www.microsoft.com/industry/automotive/connected-vehicles>. MCVP combines a partner ecosystem with a horizontal platform of Azure cloud, AI, and edge […]
Low-power microphones inclkude wake-on-sound feature
TDK Corporation introduces the InvenSense T5838, the latest technological breakthrough in the SmartSound product family. The T5838 is the world’s lowest power Pulse Density Modulation (PDM), multi-mode MEMS microphone with high AOP and high SNR for smartphones, microphone arrays, smart speakers, IoT, and other consumer devices. The microphone offers an exceptionally efficient 130 µA ultra-low […]
ASIL-rate IMU optimized for autonomous vehicle apps
TDK Corporation announces the availability of the InvenSense IAM-20685, the latest release in the SmartAutomotive product family. The IAM-20686 is a new ASIL-B monolithic 6-axis MEMS IMU developed in compliance with ISO 26262. Taking advantage of TDK’s proprietary MEMS fabrication platform and technology, the IAM-20685 features a highly integrated single-chip 6-axis MEMS gyroscope and accelerometer […]
