The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 and Compute Express Link (CXL), enabling higher data throughput and coherent connectivity for memory and accelerator resources in embedded systems. The revision also adds support for MIPI-CSI C-PHY, Modern Standby (S0ix) power states, expanded GPIO and I2S […]
Embedded
Open-source gateway adds MQTT for low-power mesh networks
The NeoGW gateway software from NeoCortec is an open-source multiplatform gateway that connects NeoMesh wireless networks with edge systems and cloud services using MQTT integration. The software works with a web-based Network Management Tool that allows administrators to monitor and manage individual networks or fleets from a central interface. Designed for IoT monitoring systems the […]
1.8 eTOPs NPU targets physical AI agent deployments at the edge
NXP Semiconductors has introduced the i.MX 93W, an applications processor. Purpose-built to accelerate physical AI deployment, the device integrates a dual-core Arm Cortex-A55 with a dedicated Arm Ethos NPU (up to 1.8 eTOPs) and an IW610 tri-radio module supporting Wi-Fi 6, Bluetooth LE, and 802.15.4 (Matter/Thread) in a single package, replacing up to 60 discrete […]
Cellular IoT portfolio spans LTE-M, Cat 1 bis, and satellite NTN
At Embedded World 2026, March 10 – 12, Nordic Semiconductor will showcase its three-series cellular IoT portfolio expansion. The nRF92 Series integrates an application MCU, Nordic’s Axon NPU for edge AI, multi-constellation GNSS, Wi-Fi locationing, and sensor co-processing in a single package, targeting smart meters, trackers, industrial sensors, and wearables with multi-year battery life. General […]
Radar, microphones, and MCUs address connected device security needs
Infineon takes the floor at Embedded World 2026 in Nuremberg, March 10 – 12 (Hall 4A, Booth 138) with live demonstrations spanning microcontrollers, sensors, automotive, and robotics. On the MCU side, engineers will see PSOC and AURIX devices running edge AI and robotics workloads with deterministic real-time control, alongside the TRAVEO SDV Zonal Demo, which […]
Modular edge platform spans factory floor to smart city
NEXCOM heads to Embedded World 2026 in Nuremberg next week with a lineup spanning AI-edge computing, robotics, and smart city platforms. The centerpiece is the APPC C21-01 series. These fanless panel PCs are powered by Intel Core Ultra 5 125U processors in 15.6- and 21.5-inch configurations. Built for industrial edge environments, they feature IP65-rated front […]
AI-enabled workflows support automated V&V in toolchains
TASKING will be demonstrating its enhanced toolchain at Embedded World in Nuremberg. The end-to-end “compile, debug, test” toolschain integrates AI-driven workflows into embedded software development and verification, supporting functionally safe and secure real-time applications in automotive, aerospace and defense, industrial and robotics systems. Built on the Model Context Protocol, the toolchain enables large language models to […]
Module adds wireless communications to embedded systems
The EnOcean 5 Click™ from MIKROE is a wireless connectivity Click board™ based on the EnOcean TCM 615 radio transceiver gateway module, providing bidirectional communication for EnOcean sensors, switches and actuators. Operating at 868.3 MHz using EnOcean Serial Protocol 3 (ESP3) and EnOcean Radio Protocol 1 (ERP1), it integrates a 50Ω PCB antenna, supports UART […]
Edge AI SoCs target robotics and automation under tight power budgets
Ambarella brings its edge AI SoC portfolio to Embedded World with live demos spanning robotics, industrial automation, automotive, and AIoT applications. The booth focuses on demonstrating AI performance per watt across Ambarella’s SoC lineup, with emphasis on running demanding workloads under tight power and latency constraints at the edge. Demos will cover both agentic AI, […]
COM Express 3.1 Type 6 Compact modules support -40 to +85 °C industrial temperature range
The conga-TCRP1 from congatec is a COM Express Type 6 Compact module built on AMD Ryzen™ AI Embedded P100 Series processors, combining up to 6 Zen5/Zen5c CPU cores, a Radeon™ RDNA™ 3.5 GPU and an XDNA2 NPU delivering up to 50 TOPS for edge AI workloads. The module supports up to 96 GB DDR5-5600 memory […]
