Infineon Technologies’ annual half-day business and technology briefing, OktoberTech2021, goes virtual this year and with a first-ever look into the combined technologies of Infineon and Cypress, a strong portfolio of product and system solutions for the world’s next innovations. In addition to keynote and technical presentation, the on-demand, virtual, half-day event will highlight advanced technologies. […]
Infineon garners 2021 LEAP Award in Embedded Computing
The first memory solution to combine security and functional safety in a single NOR Flash device has earned Infineon Infineon’s Semper Secure NOR Flash an Embedded Computing LEAP Award. LEAP Awards honor innovative products across 12 categories. More than 100 entrants were received for the annual competition which celebrates the most innovative and forward-thinking products […]
Sequans honored with LEAP Award in Embedded Computing
Sequans’ Monarch 2 GM02S, the only cellular IoT module supporting a certifiable EAL5+ secure enclave for integrated SIM9 (ieUICC) capability that is compliant with GSMA standards, is the recipient of a coveted LEAP Award in Embedded Computing. LEAP Awards honor innovative products across 12 categories. More than 100 entrants were received for the annual competition […]
Maxim captures LEAP Award in Embedded Computing
Executing AI inferences at less than 1/100th the energy of other embedded solutions to dramatically improve run-time for battery-powered AI applications, helped earn Maxim Integrated’s MAX78000 low-power, neural network, accelerated MCU a LEAP Award in Embedded Computing. More than 100 entries were received for the annual competition which celebrates the most innovative and forward-thinking products […]
LoRa portal provides key resources for LoRaWAN device connection
Semtech Corporation announced the upgraded launch of the LoRa® Developer Portal, which makes it easier for developers, regardless of experience level, to quickly build Internet of Things (IoT) devices connected with the LoRaWAN standard. The updated portal gives developers low-risk avenues for building with LoRa. With kits and tutorials, developers can create prototypes quickly and cost effectively to […]
SDK supports NXP MCUs
MikroElektronika has announced that its multi-architectural software development kit, mikroSDK 2.0, now supports 147 MCUs from NXP. mikroSDK is a collection of open-source software libraries with unified API and software development tools that makes application code portable and reusable on many different platforms and architectures, with virtually no code changes. The addition of NXP’s Kinetis family […]
3U, 6U VPX boards follow SOSA technical standard
Abaco Systems announced the production release of five products designed to align to the Sensor Open Systems Architecture (SOSA) technical standard demonstrating Abaco’s position as the market leader in 3U and 6U VPX boards and board sets. The VP431, SWE440S, SBC6511, VP831 and IPN254 align to the SOSA standard and support DOD goals for technology […]
2U server optimized for battlefield AI applications
General Micro Systems today launched its Velocity 4×4 quad GPGPU artificial intelligence (AI) server designed for battlefield applications like command posts, tactical operation centers (TOCs) and protected platforms such as autonomous vehicles, wide body airborne sensor fusion, surveillance, data mining, synthetic vision and any platform than needs massive computational resources from a small, air-cooled rackmount […]
3U OpenVPX SBCs carry Intel 11th gen Tiger Lake-H 8-core CPU
General Micro Systems today launched two MOSA-inspired 3U OpenVPX single board systems with more processing, storage and I/O than is available in 6U-sized boards twice the size. Based on an Intel 11th gen Tiger Lake-H 8 core Core i7 CPU with 64GB of memory, X9 SPIDER VPX boards are available in conduction- and air-cooled versions. […]
Extended-temperature NAND Flash comes in 1 Gb – 4 Gb densities
SkyHigh Memory Limited is introducing 3.0V 1Gb-4Gb densities 4KB page and 2KB page ML-3 products to its family of NAND Flash memories. The new 1Gb-4Gb ML-3 SLC NAND Flash product family devices are designed on 1xnm, the industry’s most advanced technology node for SLC NAND products. Available with different interfaces, SkyHigh Memory first-generation Serial (SPI) […]
