Lattice Semiconductor Corporation announced the first FPGA developed on its new Lattice Nexus FPGA platform, CrossLink-NX. This new FPGA provides the low power, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for communications, compute, industrial, automotive, and consumer systems. FPGAs are a compelling hardware platform for […]
GPGPU processor modules geared to handle intelligence/surveillance/reconnaissance and EW apps
Curtiss-Wright’s Defense Solutions division announced that, through its Reseller Agreement with WOLF Advanced Technology, it has expanded its family of open architecture high performance embedded computing (HPEC) processors designed for demanding ISR applications with the addition of three new NVIDIA Quadro Turing (TU104/6) GPU/inference engine-based OpenVPX modules. Curtiss-Wright also announced the availability of a new AMD Radeon (E9171) […]
Starter kit simplifies AI system development tasks
Congatec and the Japanese AI experts at Hacarus today unveiled the world’s first embedded computing kit for Artificial Intelligence (AI) that uses Sparse Modeling technology. Sparse Modeling needs little training data to make highly accurate predictions. This is an advantage for vision-based inspection systems, among others, because the reject rate is naturally lower when manufacturing […]
CUDA-X parallel computing platform and API libraries now available on ARM-based server processors
NVIDIA today announced its support for Arm CPUs, providing the high performance computing industry a new path to build extremely energy-efficient, AI-enabled exascale supercomputers. NVIDIA is making available to the Arm ecosystem its full stack of AI and HPC software — which accelerates more than 600 HPC applications and all AI frameworks — by year’s […]
Microchip Technology’s next-gen-ready Serial Memory Controller captures 2019 LEAP Award
The votes are in. Business-to-Business publisher WTWH Media, LLC, has announced the winners of the second-year Leadership in Engineering Achievement Program (LEAP) Awards, a design engineering product competition honoring the most exciting new products in a host of technology areas: Additive Manufacturing, Advanced Materials, Analog Electronics, Connectivity, Embedded Computing, Fastener Technology, Hydraulics, Industrial Automation, Mechanical, […]
FPGA-based PCIe accelerator board optimized for AI, ML, high-bandwidth tasks
Achronix Semiconductor Corporation and BittWare announced a new class of FPGA accelerator card targeting high-performance compute and data acceleration applications. The VectorPath S7t-VG6 accelerator card features the 7nm Speedster7t AC7t1500 FPGA and offers the industry’s highest performance interfaces available on a PCIe FPGA accelerator card. The card includes 1x400GbE and 2x100GbE ports and 8 banks of GDDR6 […]
DSP processing IP accelerates highly parallel automotive, sensor fusion, comm apps
Synopsys announced the new DesignWare ARC VPX5 DSP and VPX5FS DSP Processor IP that is based on an extended ARCv2DSP instruction set and optimized for a broad range of high-performance signal processing applications, such as RADAR/LiDAR, sensor fusion, and baseband communications processing. The new ARC VPX5 DSP processors implement a configurable, energy-efficient very long instruction word […]
Development kit speeds embedded AI, vision computing tasks
Stepping into AI generation, all industries are trying to intellectualize their application into AI applications. But it always costs money and time to do so. GPGPU and edge AI computing platform provider Aetina Corporation announced its new MXM development kits. These development tools including an MXM motherboard and an MXM to PCIe carrier that can […]
Computing module includes cinema-grade video capture, AI platform
Intrinsyc Technologies Corporation announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50mm x 25mm), production-ready embedded module, ideal for powering the most advanced […]
Software machine learning development environment targets ADAS, next-gen auto apps
NXP Semiconductors N.V. has expanded its eIQ software machine learning (ML) development environment with its automotive-grade deep learning toolkit, eIQ Auto. The toolkit aims to help customers move quickly from a development environment to AI application implementations that meet stringent automotive standards. eIQ Auto enables the application of deep learning-based algorithms to vision, driver replacement, […]
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