DATA MODUL announces its cooperation with E Ink, the world’s largest manufacturer of ePaper products and technologies. DATA MODUL is thus expanding its own display portfolio with the tried-and-tested E Ink products and is adding both segment and active-matrix displays to its range for individual customer solutions. Available in sizes from 1.10” to 42.0”, the […]
GNSS/INS receiver modules handle high-accuracy positioning, 3D orientation, pitch and roll-angle apps
Septentrio announced the launch of a new product line of high-performance GNSS/INS receivers called AsteRx-i3. The AsteRx-i3 product family brings to market an array of next-generation receivers from plug-and-play navigation solutions to feature-rich receivers with raw measurement access. OEM boards are available for rapid integration as well as ruggedized receivers enclosed in a waterproof IP68 housing. Such product variety accommodates specific needs of various applications which require high accuracy positioning together with 3D orientation, heading, pitch, and roll angles. […]
Development chassis for 6U OpenVPX boards features VITA 67 RF, SOSA Interfaces
Pixus Technologies has announced a new 3-slot 6U OpenVPX development backplane and chassis platform. The open frame development chassis features the 6U OpenVPX power and ground-only backplane with 1 VPX slot and dual VITA 67.3c slots with cutouts in the P3 and P6 sections of the board. The versatile design allows both VITA 65 and […]
HSM and safety processor help develop automotive SoCs
Synopsys, Inc. announced the availability of its new DesignWare tRoot(TM) Hardware Secure Module (HSM) and ARC SEM130FS Safety and Security Processor IP solutions with integrated functional safety features to accelerate ISO 26262 certification of automotive systems-on-chips (SoCs). The ASIL B compliant tRoot HSM for Automotive adds hardware safety mechanisms for protection against permanent, transient, and latent […]
FPGA multi-debug module captures and stores waveforms
S2C announces the newly upgraded Prodigy Multi-Debug Module Pro (MDM Pro). S2C’s popular Prodigy Multi-Debug Module (MDM) has been helping FPGA prototyping customers to shorten the debug process and get their designs to market quickly with greater confidence. S2C’s MDM solution captures and stores waveforms continuously in dedicated standalone hardware removing the need to consume […]
Development software supports CMSIS-DAP operation
SEGGER’s latest J-Link software makes it possible to turn J-Link into a high-speed CMSIS-DAP debug probe. In this mode, it can be used with any toolchain or application that is compatible with this standard, such as pyOCD, KEIL MDK, and Arms Development Studio. This mode is available for J-Link BASE, J-Link PLUS, J-Link EDU, J-Link […]
Waterproof MEMS barometric pressure sensors target smartwatch apps
TDK Corporation announces worldwide availability of the InvenSense ICP-10125, part of the SmartPressureTM family of the MEMS barometric pressure sensor platform. The ICP-10125 achieves the industry’s lowest pressure noise of 0.4 Pa RMS, attains the industry’s lowest power consumption of 1.3 µA, and ensures excellent temperature stability with a temperature coefficient of ±0.5 Pa/°C. The […]
Automotive embedded flash added to 180 nm high-voltage CMOS technology line
X-FAB Silicon Foundries has introduced a new Flash memory capability for its XP018 high-voltage automotive process. This new Flash IP leverages X-FAB’s already widely proven Silicon Oxide Nitride Oxide Silicon (SONOS) technology, which offers a combination of elevated levels of performance and best-in-class reliability. Fully compliant with stringent AEC100-grade 0 automotive specification, it can withstand […]
Low-power cellular module combines MCU and modem
In conjunction with Sony Semiconductor Israel (Sony, formerly Altair Semiconductor), STMicroelectronics, and Truphone, Murata introduced the availability of the Type 1SE module, a highly integrated, miniaturized, low power cellular IoT solution featuring a low power STM32L4 MCU and an ALT1250 M1/NB modem. Measuring just 15.4 x 18.0 x 2.5 mm, it combines the key components […]
3GPP Rel. 14 compliant NB-IoT modules feature low power consumption, optional 2G fallback
Telit launched the NE310L2 series of 3GPP Rel. 14 compliant NB-IoT modules. Featuring best-in-class power consumption, optional 2G fallback, an ultra-compact footprint, and future integrated SIM support, the new modules are ideal for low-bandwidth, cost-sensitive applications that require long battery life and enhanced coverage. The Telit NE310L2 series features the new cellular IoT Chipset from Sony, the ALT1255 […]
