Renesas introduced the RA6W1 dual-band Wi-Fi 6 wireless MCU (datasheet) and announced the RA6W2 variant integrating Wi-Fi 6 + Bluetooth LE for always-connected IoT designs in smart home, industrial, medical, and consumer devices. Based on an Arm Cortex-M33 at 160 MHz with 704 KB SRAM, the devices support 2.4/5 GHz operation and low-power modes down to 200 nA–4 […]
Medical
Low-voltage BLE SoC targets glucose monitors and biosensor wearables
Nordic Semiconductor has introduced the nRF54LV10A, a Bluetooth LE system-on-chip designed for low-voltage, space-constrained healthcare wearables such as biosensors and continuous glucose monitors. The device operates from a 1.2 V to 1.7 V supply range and can be powered directly from a single silver-oxide coin cell, supporting compact power architectures for body-worn designs. The nRF54LV10A […]
Compact module targets edge systems requiring on-device AI processing
congatec has introduced its first COM-HPC Mini computer-on-module based on Qualcomm Dragonwing IQ-X Series processors. The conga-HPC/mIQ-X uses the Qualcomm Oryon CPU and an integrated Hexagon NPU to support local AI workloads, including machine learning inference and large language model execution. The module delivers up to 45 TOPS of AI performance and is intended for […]
AI accelerator supports on-chip learning for embedded devices
BrainChip Holdings has announced the AKD1500 co-processor capable of delivering up to 800 giga operations per second (GOPS) while operating below 300 milliwatts, providing a power-efficient solution for edge AI tasks. This makes it suitable for use in battery-powered or thermally constrained systems such as wearable electronics, smart sensors, and compact embedded devices. The co-processor […]
Real-time software environment supports multiple industrial protocols
TeleCANesis has introduced an embedded software environment designed for development teams working on industrial, medical, and mobility systems. The environment enables rapid interconnection of distributed system nodes through standard communication interfaces and protocols. It is built on the QNX Operating System, a real-time platform widely used in embedded control systems such as robotics, medical instrumentation, […]
82 mm x 50 mm SOM supports MXM3 connector standard
Virtium Embedded Artists has released the RZ/G3E SOM, a system-on-module based on the Renesas RZ/G3E application processor. The module provides compute, connectivity, and graphics capabilities for industrial and medical equipment human-machine interfaces. The SOM integrates interfaces, memory, and storage to support the RZ/G3E compute engine, which includes quad Arm Cortex-A55 CPU cores and a single […]
Embedded compute modules enable Windows with ARM architecture transition for industrial automation
Tria has introduced a family of embedded compute modules featuring Qualcomm Dragonwing processors with multi-operating system support. The modules support Android, Windows 11 IoT Enterprise, and Yocto Linux, enabling deployment across industrial, medical, agriculture, and construction sectors where edge computing, machine learning, and AI capabilities provide operational advantages. The modules utilize Qualcomm Dragonwing processors designed […]
Type 4 NFC tag features dual NFC and I2C interfaces with ISO/IEC 14443-4 compliance
NXP Semiconductors has announced the NTAG X DNA, a Type 4 secure connected NFC tag designed for product authentication and Digital Product Passport applications. The device features 16KB of memory and operates according to ISO/IEC 14443-4 standards, supporting both NFC and I2C communication interfaces. The NTAG X DNA incorporates secure, unique NFC authentication and operates […]
FPGAs devices integrate quad-core 64-bit RISC-V processing capability
Microchip Technology is releasing PolarFire Core Field-Programmable Gate Arrays (FPGAs) and System on Chips (SoCs). The new devices are a derivative of the base PolarFire families and reduce customer costs by up to 30 percent by optimizing features and removing integrated transceivers. Offering the same industry-leading, low-power consumption, and proven security and dependability of classic PolarFire technology, […]
MPU features dual-layer PCB compatibility and 2D graphics engine for HMI systems
Renesas Electronics Corporation introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM, and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The RZ/A3M drives video and camera […]
