The second part of our Virtual Roundtable series on memories focuses on “advances in memory system architectures.” We are joined by Nando Basile (NB), Technology Marketing Manager for Memory with X-FAB, Bob Brennan (BB), Vice President of Emerging Memory at Micron. JS: What design challenges should system architects be aware of when employing persistent memory? […]

This three-part FAQ series began by considering “Memory Basics – Volatile, Non-volatile and Persistent.” Part two looked at “Memory Technologies and Packaging Options.” Recently developed persistent memory technologies, three-dimensional packaging for memories, advanced multicore processors, demands to process larger and larger datasets and databases, and artificial intelligence are driving the emergence of a new category […]

Solid-state memory devices are available in a wide variety of standard package styles that they have in common with other semiconductor devices, including DIP, TSSOP, DFN, WLCSP, and many others. And various packages are offered in plastic, glass, ceramic, and metal containing one or more devices. They are also available in hermetically-sealed packages and non-hermetic […]

Computers, gaming consoles, telecommunications, automobiles, industrial systems, and myriad electronic devices and systems rely on various forms of solid-state memory for operation. Designers need an understanding of the various options for volatile and non-volatile memory devices to optimize the performance of systems. A new form of solid-state memory called persistent memory (PMEM) has recently emerged […]