From the world of hype to the Embedded World of “real” things, last month in Nuremberg was where the IoT rubber met the road. Displays of smart manufacturing, smart home, autonomous vehicles seemed like more of a backdrop than eye candy. What embedded design engineers were looking for at Embedded World 2018 was a different […]
4G LTE-M development platform includes STM IoT board
Avnet announced the availability of the AT&T IoT Starter Kit (LTE-M, STM32L4), the latest in a series of AT&T IoT Starter Kits engineered by Avnet in collaboration with AT&T. This LTE-M iteration of the AT&T IoT Starter Kit, with IoT Discovery board from STMicroelectronics, reduces the complexity of LTE-M device development by bringing together all the elements required to develop and prototype highly […]
Directly modulated laser diodes handle 25 Gbps rates for 4.9G and 5G LTE base stations
Renesas Electronics Corporation today announced the RV2X6376A Series of directly modulated laser (DML) diodes. The DML diodes deliver 25 Gbps x four wavelengths as the light source in 100 Gbps optical transceivers that enable high-speed communications inside 4.9G and 5G LTE base stations, and between data center routers and servers. The RV2X6376A Series are the […]
Dev kit for Samsung ARTIK IoT platform features compatibility with “maker” hardware
Seeed announced Eagleye 530s, a high-performance, pre-tested, cost-effective and production-ready development kit for the Samsung ARTIK IoT platform. Eagleye 530s is pin-compatible with many “maker” hardware accessories, further expanding options for enterprise developers looking to create feature-rich proof-of-concepts (PoC) or production-ready products. Eagleye 530s incorporates the Samsung ARTIK™ 530s, a 1GB system-on-module (SoM) on a […]
Integrated chipset offers mobile wallet security and eSIM capabilities
NXP Semiconductors N.V. announced the new NXP SN100U, said to be the world’s first, single-die chipset featuring an embedded Secure Element (SE), Near Field Communications (NFC), and eSIM for added advanced functionality, cellular connectivity, and security. The company also introduced the SU070 standalone eSIM solution, which offers the industry’s smallest footprint and is ideal for smartphones, tablets, […]
5G silicon quad core ICs enable 3GPP-compliant base stations
Anokiwave today announced the first product in a new family of second generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 39 GHz AWMF-0156 IC. The second-generation IC family is part of Anokiwave’s on-going strategy to enable the commercialization of 5G mmW systems with silicon ICs. […]
Toolkit reference design speeds connection to enterprise clouds
Renesas Electronics Corporation announced the new Renesas Synergy Enterprise Cloud Toolbox v1.1 — a software Application Project that together with the Synergy AE-CLOUD1 kit provides a reference design and starting point for users to connect in 10 minutes or less to enterprise clouds such as Microsoft Azure, Amazon Web Services, and Google Cloud Platform. The Enterprise Cloud Toolbox saves embedded […]
Universal flash storage design incorporates MIPI M-PHY v4.1
Synopsys, Inc. announced the availability of the industry’s first complete Universal Flash Storage (UFS) IP solution, compliant with the latest JEDEC UFS v3.0 standard. The high-throughput, low-latency DesignWare UFS 3.0 IP solution doubles the bandwidth to 11.6 Gbps per lane for a faster interface between SoCs and storage ICs, compared to UFS 2.1. The power-efficient MIPI M-PHY […]
RZ/N1 evaluation kit targets remote IO, comms, networked drive designs
Ethernet-based industrial network development requires system manufacturers to select external components, contact various software providers to select the proper protocol stack, and set up the development environment. All these steps make it difficult for system manufacturers to quick start Ethernet-based industry network developments, delaying time-to-market of their application. The new RZ/N1L Solution Kit announced by […]
High-precision modules bring positioning to centimeter level
u‑blox has announced the u‑blox F9 technology platform, delivering high precision positioning solutions for mass market industrial and automotive applications. The platform combines multi‑band Global Navigation Satellite System (GNSS) technology with dead reckoning, high precision algorithms, and compatibility with a variety of GNSS correction data services to achieve precision down to the centimeter level. u‑blox F9 […]
- 1
- 2
- 3
- …
- 25
- Next Page »
@MicroContrlTips
EE World Online