Silicon Labs announced the launch of the EFM32PG22 (PG22) 32-bit microcontroller unit (MCU), a low-cost, high-performance solution with an industry-leading combination of energy efficiency, performance, and security. With easy-to-use, cost-efficient analog capabilities, the PG22 MCU is ideally suited for the rapid development of consumer and industrial applications with demanding size constraints and low-power operation requirements. […]
Connectivity
Automotive Wi-Fi 6E modules connect in-vehicle infotainment systems
LG Innotek announced on March 2nd that it has developed the world’s first automotive Wi-Fi 6E module with next-generation Wi-Fi technology. Automotive Wi-Fi 6E modules are near-field wireless communication components connecting in-vehicle infotainment (IVI) systems, which control driving information and multimedia content, to internal smart devices and external routers. With the next-generation Wi-Fi 6E (6th […]
Field area network module connects up to 1,000 mesh nodes
ROHM Semiconductor announced its new BP35C5 Wi-SUN FAN (Field Area Network) compatible module solution capable of connecting with up to 1000 nodes in mesh networks for infrastructure applications. Wi-SUN FAN, the latest Wi-SUN international wireless communication standard, eliminates the communication costs associated with conventional LPWA. At the same time, Wi-SUN ensures superior reliability through multi-hop networks […]
Embedded PCs feature fanless motherboards hosting Intel MCUs
Review Display Systems Inc. has announced the availability of a new range of Mini-STX PCs. The CAT-S PC range includes the Jaguar, Cheetah, Tiger, and Puma, which are ideal for a wide range of embedded computing applications and offer a wide range of performance and customization options. All four models in the CAT-S line-up feature […]
Low-power NB2 chipset includes ARM Cortex-M4 MCU
Sony Semiconductor Israel announced the launch of the Altair ALT1255, a new low-power NB2 chipset. The ALT1255 is 5G ready, designed with an integrated SIM (iSIM), user MCU, rich application layer, and GSM/GPRS fallback modem. The ALT1255 chipset empowers device manufacturers to develop low-power, cost-sensitive connected devices at a global scale to monitor, manage, and […]
Automotive-grade IC interfaces resistive-bridge pressure sensors
Allegro MicroSystems, Inc. introduced the A17700, an automotive-grade interface IC for resistive bridge pressure sensors featuring top-of-the-line signal conditioning algorithms. Built on decades of automotive sensor expertise, the A17700 delivers premium performance and increased system efficiency with flexible interface options – all in a small form factor. Market-leading features include Flexible compensation algorithms for accuracy […]
eUICC enables turnkey open cellular connectivity for IoT devices
IoT application solution providers can now easily and remotely change mobile network operators with Avnet’s new GSMA 3.2 eUICC (embedded universal integrated circuit card) product family. The AVeUICC32xxBICS, developed in collaboration with BICS, the international communications enabler, and leading global IoT network connectivity provider, enables solution providers to future-proof their product without having to manually visit or recall IoT end […]
IDE handles Apple M1 ARM-based SoC work
SEGGER announces its Embedded Studio build for the newly released Apple M1, Apple’s first ARM-based system-on-chip (SoC) designed specifically for Mac. Embedded Studio is SEGGER’s cross-platform Integrated Development Environment (IDE) for ARM/Cortex and RISC-V. While the ARM-based M1 can execute applications for Intel x86-based CPUs using Apple’s Rosetta 2 translator, applications built specifically for the […]
Ecosystem speeds development for programmable power-line communication modem ICs
To accelerate G3-PLC Hybrid connectivity in smart-grid and IoT devices, STMicroelectronics has revealed a development ecosystem for its ST8500 programmable power-line communication (PLC) modem chipset. Comprising two evaluation boards targeting 868MHz and 915MHz license-free RF bands, with documented firmware, the ecosystem helps users quickly build and test nodes that comply with G3-PLC Hybrid, the industry’s first […]
Tips on designing smart home devices – Part 1
The smart home market is growing rapidly, with many developers striving to get a piece of the pie. As a result, competition is fierce. To create a highly competitive smart home device, designers want to make devices that are compatible with industry standards and easy to use. And they want to get these devices to […]
