Inuitive Ltd. announced the launch of its new NU4100, an expansion of its Vision and AI IC portfolio. Based on Inuitive’s unique architecture and advanced 12nm process technology, the new NU4100 IC supports integrated dual-channel 4K ISP, enhanced AI processing, and depth sensing in a single-chip, low-power design, setting the new industry standard for Edge-AI […]
Processors
AI processors boost rugged edge computers
Premio Inc. now offers Hailo-8 modules for its RCO-6000-CFL AI edge inference computers. The Hailo-8 processor is a compact edge AI accelerator that provides up to 26 tera operations per second (TOPS) and only uses a typical power consumption of fewer than 2.5 watts. Edge AI deployments can integrate a low-power Hailo-8 module with an industrial-grade […]
RISC-V processor portfolio addresses evolving digital automotive applications
SiFive, Inc. announced three products as part of the first phase of a long-term roadmap and portfolio designed to meet the specific needs of automotive manufacturers and their suppliers. SiFive Automotive E6-A, X280-A, and S7-A solutions address critical needs for current and future applications like infotainment, cockpit, connectivity, ADAS, and electrification, as the market transitions […]
MIPI optical modules feature links to embedded processing boards
Teledyne e2v announces the release of its 2-Megapixel Optimom, the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones, or laboratory equipment. Optimom 2M features a native MIPI CSI-2 protocol and […]
MIPI UniPro v2.0 doubles peak data rate
The MIPI Alliance announced a significant update to its versatile, application-agnostic MIPI UniPro transport layer for chip-to-chip/interprocessor communication (IPC) applications in traditional and modular device architectures. Version 2.0 of the specification adds key features to double the data rate while offering greater throughput and reduced latency particularly required by today’s most demanding flash storage applications. First introduced in […]
Real-time hypervisor targets mixed-critical workloads based on x86 multicore CPUs
Real-Time Systems (RTS) announces the upcoming availability of its new RTS Safe Hypervisor. The RTS Safe hypervisor will be an OS-independent functional safety-certified Type 1 hypervisor to target mixed-critical workloads based on x86 multicore processor technologies and will be available worldwide. The new RTS Safe Hypervisor will be delivered as a complete OEM package, bundling […]
Fanless industrial computers feature Intel Alder Lake-P CPUs for AI acceleration
ASRock Industrial presents the leading-edge NUC 1200 BOX/iBOX 1200 Series enabled by 12th Generation Intel Core Processors (Alder Lake-P) for AI accelerations across industries. Featuring performance hybrid architecture up to 12 cores/16 threads and Intel Iris Xe Architecture up to 96 graphics execution units, the Series is ready to carry out high-caliber AI inference capabilities […]
SBC hosts NXP S32G3 vehicle network processor
MicroSys Electronics officially announced support for the new NXP Semiconductors S32G3 vehicle network processor at embedded world 2022 (booth 4-108), thereby extending the scalability of the NXP S32G-based miriac System-on-Modules family with massively higher real-time data processing power for mixed-critical safety applications. The new miriac MPX-S32G399A System-on-Module surpasses its NXP S32G2-based predecessor with 2.5 times […]
SoM combines multi-core processor with Wi-Fi 5, Bluetooth 5
Laird Connectivity announced the launch of the newest addition to their system-on-module (SOM) portfolio, the Summit SOM 8M Plus. This new SOM is a highly-integrated and comprehensive hardware and software solution that combines NXP Semiconductors multi-core applications processing with dual-band 2×2 Wi-Fi 5 and Bluetooth 5.3 connectivity. The Summit SOM 8M Plus is Laird Connectivity’s most versatile, feature-rich, and […]
COM-HPC and COM express boards feature Intel P-cores, E-cores
congatec introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each. Featuring the new Intel hybrid architecture with its mix of performance cores (P-cores) and efficient cores (E‑cores), the BGA-solderable processor variants consume just 15 to 28 W […]
