Acromag’s new XMC-7AWP and XMC-7KWP modules, with a user-programmable Xilinx Artix-7 or Kintex-7 FPGA, feature write-protected flash memory to secure the configuration files. These modules are well-suited for a broad range of applications such as; hardware simulation, communications, signal intelligence, adaptive filtering, and image processing. High-speed interfaces are provided for PCIe, 10GbE, LVDS, serial, and other I/O signals. User-configurable […]
Memory
New 112-layer SSDs hit 8 TB capacity for U.2, 4 TB for M.2 formats
Innodisk announces its industrial-grade 112-Layer 3D TLC SSDs along with the world’s highest capacity up to 8TB. The 112-layer SSDs introduce a complete product line including the SATA 3TG6-P and 3TE7 series, as well as the PCIe Gen3x4 and Gen4x4 series. The new TLC SSD Series marks Innodisk’s continued development with 3D NAND design, bringing […]
Resistive RAM handles unclonable cryptographic keys
CrossBar Inc. announced a new application of its Resistive RAM (ReRAM) technology for use as a physical unclonable function (PUF) in order to generate cryptographic keys in secure computing applications. While historically utilized as a non-volatile semiconductor memory, CrossBar’s ReRAM technology is now being introduced for use in hardware security applications utilizing its ReRAM based cryptographic […]
SDK supports latest Andes RISC-V extension and devices
IAR Systems presented a new version of its professional development tools for RISC-V. With the latest release, the complete development toolchain IAR Embedded Workbench for RISC-V adds support for the latest Andes RISC-V extension and devices, enabling maximized performance in RISC-V-based applications. Through its excellent optimization technology, IAR Embedded Workbench for RISC-V helps developers ensure […]
FPGA modules feature write-protected configuration memory for enhanced security
Acromag’s new XMC-7AWP and XMC-7KWP modules with a user-programmable Xilinx Artix-7 or Kintex-7 FPGA feature write-protected flash memory to secure the configuration files. These modules are well-suited for a broad range of applications such as hardware simulation, communications, signal intelligence, adaptive filtering, and image processing. High-speed interfaces are provided for PCIe, 10GbE, LVDS, serial, and other I/O signals. […]
Industrial-Grade DDR5 DRAM modules emphasize low power consumption
Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules. The new standard touts a host of crucial performance improvements and power savings over its predecessor, and anticipation has been high since the official announcement of its release. Boasting a bucketload of benefits, including the obligatory speed and storage increases, DDR5 will eventually […]
FPGA modules feature write-protected flash memory
Acromag’s new XMC-7AWP and XMC-7KWP modules with a user-programmable Xilinx Artix-7 or Kintex-7 FPGA feature write-protected flash memory to secure the configuration files. These modules are well-suited for a broad range of applications such as hardware simulation, communications, signal intelligence, adaptive filtering, and image processing. High-speed interfaces are provided for PCIe, 10GbE, LVDS, serial, and […]
Ruggedized storage is engineered for data-intensive automotive systems
Micron announced that it is sampling 128GB and 256GB densities of its 96-layer NAND as part of its new portfolio of UFS 3.1 managed NAND products for automotive applications. With infotainment systems evolving to include high-resolution displays and human-machine interface capabilities based on artificial intelligence (AI), Micron’s UFS 3.1 portfolio provides much-needed high-throughput and low-latency […]
Chip verification, Spice tools now work with advanced nanometer processes
Siemens Digital Industries Software announced that its Calibre nmPlatform tools and Analog FastSPICE platform are now both qualified for TSMC’s advanced N3 and N4 processes. Now certified for TSMC’s N3 and N4 processes, Siemens’ Analog FastSPICE platform provides leading-edge verification for nanometer analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits. In addition, multiple […]
SoC/RAM combo targets IoT hi-rez display apps
Winbond Electronics Corporation announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low-power system solutions for IoT endpoints and wearables. Several customers are in design with Ambiq’s Apollo4 SoC and Winbond 256Mbx8 HyperRAM Hybrid Sleep Mode (HSM), with volume production expected in 2022. HSM power consumption is about 50% if comparing to normal standby […]
