The QLC UFS 4.1 embedded memory devices from KIOXIA America, Inc. are based on 8th generation BiCS FLASH™ 3D technology, using 4-bit-per-cell QLC to deliver higher storage density in JEDEC®-standard packages. Available in 512 GB and 1 TB capacities, the devices support the UFS 4.1 specification and provide higher sequential and random performance compared to […]
Memory
DDR5 memory module supports up to 6400 MT/s
Penguin Solutions’SMART Modular DDR5 ECC CSODIMM is a 262-pin, 1.1 V clocked SODIMM (CKD-equipped) memory module specified up to 6400 MT/s (PC5-44800) with capacities of 16 GB, 32 GB, and 64 GB. It’s positioned for space-constrained systems such as industrial control, embedded/edge computing, and networking/telecom equipment where ECC and signal integrity at higher data rates […]
Non-transparent bridging isolates multiple host domains in switches
Microchip Technology introduced its Switchtec Gen 6 PCIe switches, manufactured using a 3 nm process. The switches support PCIe 6.0 specifications with up to 160 lanes for AI system connectivity and feature a hardware root of trust with post-quantum safe cryptography compliant with Commercial National Security Algorithm Suite 2.0. PCIe 6.0 delivers 64 GT/s per […]
PCIe switch moves data directly from memory to GPU
HighPoint Technologies has announced the launch of the Rocket 7638D, a revolutionary PCIe Gen5 switch adapter engineered to solve the most critical bottleneck in modern AI/ML workflows: data starvation. The adapter’s groundbreaking hardware architecture provides a foundational platform for GPU-Direct NVMe storage, enabling NVIDIA GPUs to directly access massive datasets without the performance penalties of […]
16 GB DDR4 memory operates at 2400 MT/s with 100 krad TID tolerance for satellites
Teledyne e2v announced the immediate availability of Engineering Models for its new 16GB radiation-tolerant DDR4 memory. This high-density addition expands Teledyne e2v’s space-grade DDR4 portfolio—already the most deployed in the industry—with hundreds of 4GB and 8GB flight models delivered to date. The 16GB DDR4 device maintains the compact form factor of the existing family—just 15mm […]
Memory modules consolidate dual-channel memory in compact form factor
Innodisk has released DDR5 CAMM2 and LPDDR5X CAMM2 memory modules designed for industrial applications requiring compact form factors. The modules reduce space requirements by 60% compared to traditional SODIMM configurations while delivering transfer rates of 6400 MT/s and 8533 MT/s, respectively. The CAMM2 architecture consolidates dual channels onto a single module, effectively combining the capacity […]
Chip delivers 800 GbE connectivity with 4X I/O bandwidth for GPU server applications
Enfabrica Corporation announced the availability of its Elastic Memory Fabric System “EMFASYS”, a transformative hardware and software solution designed to dramatically improve the compute efficiencies in large-scale, distributed, memory-bound AI inference workloads. EMFASYS is the first commercially available system that integrates high-performance Remote Direct Memory Access (RDMA) Ethernet networking with an abundance of parallel ComputeExpressLink (CXL) based […]
Enhanced product DDR4-3200 module targets embedded platforms
Teledyne HiRel Semiconductors announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C. The TDD416Y12NEPBM01 is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint – smaller than a postage stamp. Packaged […]
RAID storage system supports PCIe Gen 5 and Gen 4 connectivity
HighPoint Technologies introduces its next-generation NVMe RAID storage solutions, engineered to meet the demanding data ingestion and processing requirements of AI, autonomous systems, and professional media applications. Combining industry-leading PCIe switching architecture with advanced RAID technologies, these solutions deliver unparalleled speed, reliability, and scalability for high-volume data capture, real-time analytics, and long-term storage. HighPoint’s proprietary […]
SRAM recovers 15% silicon area on 2 nm process with 6 gigabit memory capacity
Marvell Technology, Inc. expanded its custom technology platform with the launch of the industry’s first 2nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI clusters. Combining advanced custom circuitry and software from Marvell with core SRAM and cutting-edge 2nm process technology, Marvell […]
