Teledyne e2v announces engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs). LX2160-Space can be used in many heavy computing applications in Space, from Earth Observation Satellites […]
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Quad-core ARM processor boosts space, edge, AI computing apps
Teledyne e2v announces the delivery of qualified flight models (FMs) of its advanced, space-qualified, quad-core Cortex-A72 edge processing platform – the LS1046-space. Targeting compute-intensive space applications, including high-throughput satellites, data compression, as well as artificial intelligence, and imaging, this processor outperforms existing alternatives by a factor of 30x. This timely addition to Teledyne e2v’s portfolio […]
MIPI optical modules feature links to embedded processing boards
Teledyne e2v announces the release of its 2-Megapixel Optimom, the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones, or laboratory equipment. Optimom 2M features a native MIPI CSI-2 protocol and […]
Industrial CMOS vision sensors carry 2 MP, 1.5 MP resolution
Teledyne e2v has introduced its Topaz series of industrial CMOS sensors with new 2MP and 1.5MP resolution devices. These new 1920 x 1080 and 1920 x 800-pixel format sensors use state-of-the-art low noise, global-shutter pixel technology to offer powerful solutions and enable compact mobile designs for many applications. Housed in a tiny 4.45 mm wide Chip […]
CMOS vision sensors provide 2k and 4k resolution
Teledyne e2v introduces Tetra, a low-cost, high-performance quad linear CMOS sensor family. The Tetra sensors are ideal for food sorting, recycling, logistics, pick-and-place, document scanning, and other machine vision applications that require cost-effective mono, color, and multispectral imaging. Tetra sensors are available in a 2k resolution with a 14 μm x 14 μm pixel size, […]
Rad-tolerant quad ARM Cortex space processor passes 100krad TID testing
Teledyne e2v has announced that its popular LS1046-Space processor has now passed stringent total ionizing dose (TID) radiation tests, achieving 100krad resilience. This multi-core device, which features four 64-bit Arm Cortex A72 processing cores, was able to operate as normal after the TID tests had been undertaken. These results complement those previously obtained in terms […]
2-MP optical module includes pre-focused, industrial-grade scanning optic
Teledyne e2vannounces that it has expanded its product portfolio with a 2 Megapixel compact module featuring a pre-focused, industrial-grade scanning optic. This MIPI interfaced module finds a variety of uses in scanning, embedded vision and many other computer vision applications to enhance productivity and throughput in logistics, sorting, retail POS, and many other industrial sectors. The 2MP […]
High-rez time-of-flight sensor targets robotic, AGV apps
Teledyne e2v, a Teledyne Technologies company announces Hydra3D, its new Time-of-Flight (ToF) CMOS image sensor, tailored for 3D detection and distance measurement. The sensor supports the latest industrial applications, including vision-guided robotics, logistics, and automated guided vehicles. Hydra3D’s high resolution and flexible configuration, combined with its on-chip HDR, make it ideal for outdoor applications such […]
CMOS 3.2-MP image sensor targets security, drone, embedded vision apps
Teledyne e2v, a Teledyne Technologies announces its new Emerald 3.2 Megapixel CMOS image sensor, specially designed to tackle the challenges of emerging applications such as security, drones and embedded vision, as well as traditional machine vision. With its 2.8 µm global shutter pixel and innovative design, the new 3.2M sensor shares all of the characteristics of […]
New 3D CMOS image sensor enables vision-guided robotics, logistics and surveillance
Teledyne e2v, a Teledyne Technologies company, announces its new Bora Time-of-Flight CMOS image sensor, tailored for 3D detection and distance measurement to support the latest industrial applications, including vision guided robotics, logistics and surveillance. Based on an innovative 10µm pixel design and incorporating a resolution of 1280 x 1024 pixels, the Bora image sensor offers […]
