3D NAND is poised to become the dominant NAND flash technology and promises both enhanced performance and capacity. The Innodisk 3D NAND solid state drive (SSD) series is designed to fulfill the more stringent requirements for ruggedness and endurance seen in the industrial market. The series uses pure industrial-grade Toshiba 3D TLC NAND flash with a rated […]
New 5 M-pixel CMOS image sensor excels at high-speed scanning, embedded vision apps
Teledyne e2v, a Teledyne Technologies company, announces the expansion of its Snappy family of image sensors with a new 5 MP device. The Snappy 5M is designed for barcode reading, 2D scanning and other demanding applications. Available in both monochrome and color, the Snappy 5M has a small 1/1.8 inch optical format, containing a 2.8μm, low-noise, […]
Processors handle multiprotocol gigabit, time-sensitive networking
Texas Instruments announced the industry’s first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new, highly integrated Sitara AM6x processor family provides industrial-grade reliability, with quad and dual Arm Cortex-A53 core variants built to meet the rapidly evolving needs of Industry 4.0 in factory automation, motor drives and grid infrastructure. By supporting gigabit throughput rates […]
SBC in Pico-ITX form factor support diverse packaging solutions
WinSystems today announced its Intel E-3800 processor-based computing platform in the Pico-ITX form factor. Measuring a mere 3.9 inches by 2.8 inches (100 mm by 72 mm), the ITX-P-3800 delivers low-power performance, endurance and versatility. The proven design of this rugged single board computer (SBC) accelerates time to market for new products while assuring that they will perform […]
80-MHz Arm Cortex-M4 MCUs include 64Kbyte/128Kbyte Flash, energy management
With a focused feature set and compact package options, STMicroelectronics’ STM32L412 and STM32L422 microcontrollers (MCUs) bring ultra-low power technologies and high performance to budget-conscious consumer, industrial, and medical applications. Whether the squeeze is on core performance, energy, physical space, or bill of materials, the new MCUs give more freedom to beat the constraints. Combining economical 64Kbyte or […]
Sifox-verified RF SiP now CE-certified, expanding long-range wireless applications
ON Semiconductor has achieved CE certification for its AX-SIP-SFEU System in Package (SiP) solution. This means that the device conforms to health, safety and environmental protection standards for products sold within the European Economic Area. The AX-SIP-SFEU provides ready-to-use Sigfox connectivity (uplink and downlink) for industrial IoT applications including building and home automation as well as sensor and asset […]
Vision controller drives demanding multi-camera applications on factory floor
Matrox Imaging today announces the new Matrox 4Sight EV6, the latest installment to the vision controller lineup. An enhancement of its immediate predecessor, the Matrox 4Sight GPm, the Matrox 4Sight EV6 integrates a seventh-generation Intel Core processor to power ever-more demanding multi-camera applications. Matrox 4Sight EV6 possesses the ingrained power to handle multi-camera inspections with […]
New core targets a wide range of embedded applications in Industrial IoT
Renesas Electronics Corporation announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018. The new MCUs are designed to address the real-time performance and enhanced stability required by motor control […]
Wireless IIoT: Moving to the next generation of industrial connectivity
by Matt Maupin, Senior Product Manager, Silicon Labs The operational and environmental conditions found in industrial sectors such as manufacturing, distribution, and utilities (gas, electricity, water) have always presented a challenge to connectivity. Wired connections would be used where a clear and definite network existed, giving the assurance of reliability for mission-critical systems. Wireless would […]
Single Board Computer incorporates Trusted Platform Module 2.0 technology and USB 3.1
WinSystems has introduced its next-generation computing platform in the Nano-ITX form factor. The ITX-N-3900 provides a complete system that can be readily expanded and configured for diverse applications requiring an extended product life and high reliability under extreme operating temperatures. The 4.27 inch (120 mm) square footprint features an onboard Trusted Platform Module (TPM) 2.0-compliant […]
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