Congatec introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module is setting a new performance per watt benchmark, which finds its sweetest spot in 15 Watt TDP designs[1]. This extraordinary low power platform performance […]
Industrial
RISC-V development tools certified for functional safety use
IAR Systems announces the availability of a certified edition of its development toolchain for RISC-V. The functional safety edition of IAR Embedded Workbench for RISC-V is certified by TÜV SÜD according to the requirements of IEC 61508, the international umbrella standard for functional safety, as well as ISO 26262, which is used for automotive safety-related […]
SMARC modules incorporate i.MX 8M Plus processor for AI, embedded vision processing
Congatec presents its brand new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision, and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra-low-power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for situational awareness, […]
Computer-on-module HPC board features 11th gen Intel core processor
Congatec presents a brand new COM-HPC starter set at embedded world 2021 DIGITAL. Ideal for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0, and up to ultra-fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel […]
Five, six-junction vertical-cavity surface-emitting laser arrays target consumer, automotive LiDAR, 3D sensing apps
Lumentum Holdings Inc. announced new high-power and high-efficiency five and six junctions vertical-cavity surface-emitting laser (VCSEL) arrays for advanced consumer, automotive LiDAR, and other 3D sensing applications. The use of LiDAR and 3D sensing is expanding into new applications in the consumer electronics, automotive, and industrial markets. New applications and new functionality are driving the need for higher […]
Industrial-rated carrier provides extensive connectivity for Type 10 mini-module designs
WINSYSTEMS today introduced its first Mini-ITX form factor carrier board to complement and support its COMeT10-3900 COM Express Type 10 mini modules. The ITX-M-CC452-T10 carrier platform is designed with industrial components for testing products in development and to deliver highly reliable performance in operating environments with temperatures of -40°C to +85C°. WINSYSTEMS’s newest COM Express market entry offers the assurance […]
Applications processor enables ultra-low power processing and trusted cloud-to-edge security
NXP Semiconductors N.V. today announces the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors. The expansion includes new innovations with EdgeLock secure enclave to enhance edge security and […]
Optimized 32-bit MCU targets IoT edge applications
Silicon Labs announced the launch of the EFM32PG22 (PG22) 32-bit microcontroller unit (MCU), a low-cost, high-performance solution with an industry-leading combination of energy efficiency, performance, and security. With easy-to-use, cost-efficient analog capabilities, the PG22 MCU is ideally suited for the rapid development of consumer and industrial applications with demanding size constraints and low-power operation requirements. […]
WiFi 6/6E and Bluetooth 5.2 SoCs available as 1×1 and 2×2 devices
Infineon Technologies AG is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC brand now includes the industry’s first 1×1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise, and industrial applications, and its first 2×2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer, and automotive […]
Bluetooth PAN-to-USB device lets wireless footswitches emulate PC keystrokes, mouse clicks
Herga Technology produces a wide range of single and multipedal footswitches including those that utilize the Bluetooth secure PAN (personal area network) for wireless machine switching functions. Also available are wired USB footswitches that emulate mouse-clicks or grouped keyboard functions, facilitating foot operation for computer-controlled equipment. In its latest product offering Herga has uniquely brought […]
