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Automotive MCUs emphasize safety, security in next-gen domain/zone architectures

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STMicroelectronics has revealed further details of its innovative Stellar automotive microcontrollers (MCUs) to show how the devices ensure the reliable and deterministic execution of multiple independent real-time applications. This is one of the toughest challenges facing manufacturers in today’s automotive sector as the complexity of new car architectures leads to the consolidation of independent applications into a single powerful Integration MCU and typically involves choosing either determinism or virtualization. Stellar delivers both.

Pioneering this new class of controllers, Stellar Integration MCUs are designed with exceptional computing power to significantly simplify the concurrent and deterministic execution of multiple-sourced software while guaranteeing the highest levels of safety and performance. These capabilities meet system requirements in the electrics/electronics (E/E) architecture of the next generation of connected cars. To do this, Stellar introduces features that include a state-of-the-art processor with hardware support for virtualization, quality of service settings, the ability to firewall peripherals and perform resource separation at interconnect levels. These features allow independent applications, or Virtual ECUs, to coexist in the same physical MCU by guaranteeing freedom from interference and secure compartmentalization of software functions while supporting concurrent multiple ASIL safety levels.

ST has developed this new technology with Bosch, the well-known tier-one automotive electronic module supplier, to meet future OEM integration demands.

Stellar embeds multiple Arm Cortex-R52 cores — some operating in lockstep and some in Split/Lock – and features a 2-level Memory Protection Unit and a low-latency Generic Interrupt Controller. The MCU is suited to hard real-time applications up to the highest safety integrity level, ASIL-D, specified in the automotive functional safety standard, ISO 26262. There are also multiple powerful accelerators for secure data routing, processing, and mathematical functions, with advanced security support and extensive communication command and control.

The Integration MCU offers comprehensive virtualization at multiple levels using a Virtual Machine ID (VMID) at the network-on-chip and memory levels. Firewalls ensure complete separation at all interconnect levels including the peripherals. These firewalls allow Stellar to manage Virtual Machines (VMs) accesses and privileges to peripherals, ensuring the isolation of entire mission-critical functions.

With its unique architecture and hardware-based virtualization capabilities, Stellar assures safety through freedom from interference. It also provides significant advantages over software virtualization, including offloading of processor cores and reducing virtualization’s impact on memory.

At the same time, Stellar manages increasing software complexity and integration with better utilization of its hardware resources. This reduces the total overhead of multiple separate ECUs performing their own housekeeping and managing communication-stack-related latency. In fact, Stellar can support several real-time operating systems (OSes) running independently, without interference. These OSes can separately manage applications with different functional-safety levels and superior processing capabilities for encrypted communication over Ethernet or CAN[1] buses with dedicated AES[2] accelerators to offload the main Hardware Security Modules (HSM) for MACSec[3], IPSec[4], and CAN authentication.

Stellar Integration MCUs feature non-volatile Phase-Change Memory (PCM), offering fast read access times, and single-bit alterability that is not available in Flash memory. PCM ensures Over-The-Air (OTA) updates with zero downtime, even for full-sized memory updates. In addition to increasing flexibility and erase/write cycles, single-bit alterability at runtime (no erase required) extends safety setup by refreshing bits to eliminate single-bit failures and extend the memory’s lifetime.

ST’s embedded-PCM technology has been developed and tested to operate within the most stringent automotive requirements for robust high-temperature operation, radiation hardening, cycling, and data retention. ePCM achieves automotive requirements for AEC-Q100 Grade 0 with an operating temperature up to +165°C.

To date, ST has delivered more than 3000 samples to customers and samples have been running in vehicles for about a year.

Dual-core multi-protocol MCUs boost Bluetooth LE 5.0, Zigbee 3.0, Thread connectivity

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STMicroelectronics has expanded the STM32WB portfolio of dual-core multi-protocol microcontrollers (MCUs) by introducing the STM32WB35 and STM32WB30 Value Line, giving designers more flexibility to target cost-conscious market opportunities.

The extremely low-power MCUs integrate a 2.4GHz radio managed by a dedicated Arm Cortex-M0+ core, with a 64MHz Arm Cortex-M4 for the main application, to permit uninterrupted real-time performance. They support Bluetooth Low Energy 5.0, Zigbee 3.0, OpenThread (IEEE 802.15.4) protocols, and concurrent modes, with built-in security features. All stacks are fully certified, supported, and handled by ST and available free of charge. The new devices are suited to large-scale IoT applications such as fleet and resource management, as well as asset monitoring and tracking.

Packaged in QFN48, the new devices are pin-compatible with existing STM32WB5x devices and share common MCU features, giving users the flexibility to easily scale and migrate their designs. The MCUs integrate the radio balun, USB2.0 Full Speed device with crystal-less oscillator, embedded capacitors for 32MHz crystal, and DC/DC step-down converter to minimize the Bill of Materials (BoM) and platform footprint. Outstanding RF performance, with programmable output power up to +6dBm and with a 102dBm link budget, ensures reliable connectivity over longer distances, while ultra-low power consumption extends battery runtime.

All STM32WB products are supported in the market-proven STM32Cube ecosystem, an exhaustive software development suite offering a combination of embedded software libraries and software tools addressing all the needs of a complete project development cycle, thus ensuring a consistent user experience across the whole portfolio.

The STM32WB35 and STM32WB30 Value Line devices are available with up to 512 KBytes of integrated Flash memory and up to 96 KBytes of SRAM, with a Quad-SPI interface for connecting to external high-speed memory. They also provide a rich selection of analog peripherals, digital interfaces, and fast I/Os, many of which are 5V tolerant.

With a focus on security, the STM32WB MCUs integrate Secure firmware installation (SFI), hardware encryption for the application and radio stacks, hardware public-key Authority (PKA), hardware accelerators for state-of-the-art cryptographic algorithms, and support for secure Over-The-Air (OTA) firmware updates.

The STM32WB35 and STM32WB30 Value line are in production now, in the QFN48 package. Prices start from $1.57 for the STM32WB30CEU5A for orders in volume.

Display shield leverages 32-bit MCUs for HMI designs

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The new STM32 Nucleo display shield from STMicroelectronics leverages the affordability of STM32G0 microcontrollers (MCUs). The new X-NUCLEO- GFX01M1 SPI shield is supported in the latest TouchGFX software, version 4.15.0, which introduces additional new features including support for low-cost non-memory-mapped SPI Flash ICs.

Designing with STM32G0 and TouchGFX lets developers target a bill of materials as low as $5 to add a small graphical display to any project. Simple devices such as timers, controllers, and home appliances can thus offer a smartphone-like user experience.

The new X-Nucleo-GFX01M1 shield is supported by a new X-cube-display package that offers simple “hello world” example. The shield contains a 2.2-inch QVGA (320×240) SPI display, 64-Mbit SPI NOR Flash, and a joystick and is ready to use with various STM32 MCU development boards such as the NUCLEO-G071RB. The STM32G071RB is a mainstream Arm Cortex-M0+ MCU that integrates up to 128kBytes Flash, 36kBytes SRAM, extensive communication interfaces, analog peripherals, fast I/Os, hardware security ID, and a USB Type-C Power Delivery controller

The latest TouchGFX software builds on the TouchGFX Engine’s partial framebuffer, which can reduce the GUI RAM footprint by up to 90% and allow a simple user interface in as little as 16-20KB of internal MCU RAM. A new rendering algorithm enhances GUI performance by realizing partial screen updates in an optimized order to allow extra updates and avoid visually distracting tearing effects. Also new, support for non-memory-mapped SPI Flash allows more complex GUIs to use low-cost off-chip storage for memory-hungry graphics assets such as images and fonts.

To ease user-interface prototyping, an optimized application template for the STM32G071 Nucleo board and display kit is available in TouchGFX Designer. It is also possible to introduce an RTOS to the setup if required and use TouchGFX Generator to change to other hardware.

All elements are available now, including the X-cube-display package and TouchGFX 4.15.0 with code examples for running the G071RB. The X-NUCLEO- GFX01M1 and STM32G0 products are in mass production and available through the normal ST distribution channels.

In addition, a new graph widget simplifies showing sequential data using lines, bars, area plots, histograms, or combined visualizations. The widget works smoothly with any STM32 MCU and developers can customize aspects such as colors and layout using TouchGFX Designer.

Also new in TouchGFX 4.15.0, full out-of-the-box support for the STM32H725 lets developers run microprocessor-class graphics on ST’s Cortex-M7 MCUs. With 550MHz core frequency, ST’s Chrom-ART Accelerator™ for faster graphics performance, an Octal-SPI interface for high-speed connections to external Flash and RAM, and an XGA TFT-LCD controller, the STM32H725 is the new graphics flagship for the STM32 family. TouchGFX Designer contains sample source code and a demonstration video is available here.

Bluetooth 5.2-certified SoC extends range, throughput, reliability and security

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STMicroelectronics has revealed its latest BlueNRG-LP Bluetooth LE System-on-Chip (SoC), which leverages the latest Bluetooth features to increase communication range, raise throughput, strengthen security, and save power. The ultra-low-power radio is optimized to consume as little as 3.4mA in receive mode, just 4.3mA when transmitting, and less than 500nA quietly waiting for wake-up events, cutting by half the size of battery needed in most applications and prolonging runtime.

BlueNRG-LP, the 3rd-generation Bluetooth SoC from ST, is the world’s first Bluetooth LE 5.2-certified SoC to support concurrent connections up to 128 nodes, enabling seamless low-latency control and monitoring large numbers of connected devices, for instance from a stylish and intuitive smartphone app.

Combined with high RF-output power, which is programmable up to +8dBm, and excellent RF sensitivity of up to -104dBm, the BlueNRG-LP radio SoC can now natively cover a much larger area in beacons, smart lighting, gaming, building automation, industrial and tracking applications. Furthermore, the communication range can be extended without limit by seamlessly adding Bluetooth LE Mesh, now fully certified and available as part of the comprehensive BlueNRG software and hardware ecosystem.

In addition, BlueNRG-LP supports Bluetooth Long Range mode, which uses coded physical layers (Coded PHY) with Forward Error Connection (FEC) to extend radio-communication range up to hundreds of meters and increase reliability, as well as GATT (generic attribute) caching to connect quickly and efficiently.

BlueNRG-LP comes with ST’s third-generation Bluetooth Low Energy protocol stack certified to Core Specification 5.2 and designed to match its ultra-low-power architecture. The stack is provided as a free-of-charge and compiler-independent linkable library supported by multiple Integrated Development Environments (IDEs) and is optimized for small footprint, modularity, low latency, interoperability, and lifetime over-the-air upgradability. It supports features such as extended advertising and scanning, high-duty-cycle non-connectable advertising, extended packet length, and 2Mbit/s throughput.

In addition, BlueNRG-LP supports L2CAP Connection-Oriented Channel (CoC), which eases large bidirectional data transfers, multi-role simultaneous connectivity, and Channel Selection Algorithm #2 (CSA #2), which permits robust connections in noisy environments such as home, building, or industrial networks.

Enhanced security mechanisms included in the integrated Arm Cortex-M0+ microcontroller (MCU) comprise a secure bootloader, readout protection for the entire 256KB embedded flash, a 48-bit unique ID, as well as customer key storage, true Random-Number Generator (RNG), hardware public-key accelerator (PKA), and a 128-bit AES cryptographic co-processor. The highly efficient processing unit executes code at up to 64MHz, consuming an amazingly tiny 18µA/MHz, and features industry-standard digital interfaces, multi-channel 12-bit ADC, an analog microphone interface with a programmable gain amplifier, user and system timers and watchdog, and up to 31 5V-tolerant user-programmable I/O pins.

The BlueNRG-LP SoC also integrates an embedded RF balun, DC/DC converter, and capacitors for the HSE (High-Speed External) oscillator and internal low-speed ring oscillator, minimizing bill-of-materials (BOM) costs and simplifying circuit design.

BlueNRG-LP is available in a choice of 5mm x 5mm QFN32, 6mm x 6mm QFN48, and a miniature 3.14mm x 3.14mm WLCSP49 wafer-level package. With 32KB or 64KB RAM and a choice of temperature range up to 85°C or 105°C, designers get extra flexibility to choose a configuration that best meets their needs. The devices are covered by ST’s 10-year industrial longevity commitment, assuring users of long-term parts availability.

BlueNRG-LP SoCs are in production now, in QFN48, priced from below $1.00 for volume orders.

MCUs with embedded flash target rich graphics, AI, secure apps

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STMicroelectronics has revealed record-breaking STM32* microcontrollers (MCUs) with embedded Flash that bring high-end features such as rich graphics, AI, and state-of-the-art cyber-protection to cost-sensitive new products.

The new STM32H7 MCUs build on the Arm Cortex-M7 core and operate at 550 MHz, the fastest core speed in the market among MCUs that integrate Flash storage on-chip to run deeply embedded applications. These single-core devices, which are available with up to 1 Mbyte of Flash, deliver increased performance with affordability for cost-conscious applications.

At the same time, the devices can interact with off-chip storage while ensuring full execution performance and security. Their benchmark performance figures of 2778 CoreMark[1] and 1177 DMIPS are realized whether working from internal or external memory, aided by features such as the Flexible Memory Controller (FMC) and Octal SPI memory interface. This lets designers tackle memory-hungry applications, such as high-resolution, full-color graphics, and video that demand a large frame buffer, to create new products that deliver more sophisticated and immersive user experiences.

Further assisting the creation of full-color user interfaces, the TouchGFX graphic framework STM32Cube Expansion Package (X-CUBE-TOUCHGFX) and TouchGFX Designer programming tool are available free of charge.

Advanced features powered by AI technology can be developed thanks to STM32Cube ecosystem and STM32Cube.AI (X-CUBE-AI) to port neural networks and leverage computer vision through the parallel camera interface. By connecting the STM32H7 to one or multiple sensors, condition monitoring and other machine learning techniques will also help bringing added value to the STM32-based product.

As part of the STM32Trust security suite, cyber-protection is enhanced with support for on-the-fly decryption (OTFDEC) and secure firmware install (SFI). OTFDEC enables encrypted code to be executed from external memory. SFI lets OEMs order standard products anywhere in the world, to be programmed only with encrypted code. These two solutions effectively safeguard OEM intellectual property in Flash memory. Out-of-the-box security features include support for secure boot, symmetric (by hardware or software library) encryption, and cryptographic key provisioning. Asymmetric encryption (by software library) is also available. Cryptographic processing is handled with a true random number generator, hardware acceleration for AES-128, AES-192, and AES-256 encryption, and support for GCM and CCM[2], Triple DES, and hash (MD5, SHA-1, and SHA-2) algorithms.

Several key features deliver important advantages in industrial applications, including an integrated switched-mode power supply (SMPS) that overcomes dissipation constraints to allow extended-temperature operation up to 125°C. In addition, fault-resilience is provided through error correction (ECC) for all memories.

ST has updated the STM32 development ecosystem to let users get started quickly with the new devices. Flexible prototyping and demonstrations can leverage the STM32H735G-DK Discovery kit, while the NUCLEO-H723ZG Nucleo-144 board provides an affordable option for quickly building prototypes and proof-of-concept models. The latest STM32H7 MCUs are also supported in the STM32Cube ecosystem, which comprises tools, embedded software, and middleware including graphics libraries, communication stacks, and application-code examples such as motor control, AI, and advanced security.

The MCUs’ capabilities can also be exercised using appropriate software tools for application and security development published by Arm Keil and IAR Systems.

The new STM32H7 devices introduced are the STM32H723/733, STM32H725/735, and STM32H730 Value-Line MCUs, which are available in various package options. Prices start from $2.83 for the STM32H730VBT6, for orders of 10,000 pieces.

Software implements ultra-low-power wireless KNX nodes

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STMicroelectronics has released KNX software for the S2-LP ultra-low-power radio transceiver to enable energy-saving standardized wireless connectivity for smart-building controls.

Ready to run on an STM32* microcontroller (MCU) or alternatively on a BlueNRG-2 Bluetooth Low Energy System-on-Chip (SoC) that embeds an Arm Cortex-M0 core running at 32MHz and a comprehensive set of I/O peripherals, the software contains a certified KNX-RF stack, RF adaptation layer, and S2-LP library needed to connect the transceiver to create an ultra-low-power wireless KNX node. Operating in the 868.3MHz band at only 10mA with +10dBm output, the S2-LP delivers market-leading energy efficient, secure and robust wireless connectivity prolonging battery run-time and reducing the overall cost of the solution.

Combining the S2-LP radio and BlueNRG-2 SoC enables a unique hybrid and low-power optimized KNX/Bluetooth solution in two chips, allowing a smartphone to access KNX-based networks and provide an intuitive and stylish interface for conveniently monitoring, controlling, configuring, provisioning, and updating the KNX nodes.

Whether hosted on the BlueNRG-2 or STM32 MCU, ST’s KNX-RF software enables innovation and power savings for push-buttons, light switches, occupancy sensors, roller-shutter controls, dimmer actuators, and other devices for lighting, heating, HVAC, and energy-harvesting systems.

The software meets the latest KNX-RF Multi specification, which supports secure (S mode), encrypted communications, and frequency agility with five channels to help avoid interference and permit fast and slow communication modes to save power. Further features of KNX-RF Multi boost reliability and allow larger numbers of KNX devices to coexist on the network, including listen before talk (LBT), fast acknowledge with auto-retry, and support for repeaters.

To create the new KNX-RF Multi software, ST teamed with its Authorized Partners, Tapko for the certified KNX stack and Actimage for the RF adaptation layer.

The S2-LP package joins ST’s STKNX highly integrated transceiver for KNX TP communication over twisted-pair cable and extends the Company’s portfolio of certified solutions for smart-building communication, which comprehensively covers the major industry standards. In addition to enabling both wired and wireless KNX specifications with these solutions, ST provides embedded software, evaluation tools, and mobile apps to accelerate the development of Bluetooth Low Energy Mesh and 6LoWPAN networking solutions for smart-building and industrial applications. Both S2-LP and BlueNRG-2 devices belong to the ST 10-year longevity program.

As a Gold Sponsor of the KNXperience online tradeshow running September 28 to October 2, ST will present demonstrations during the event that leverage the KNX RF Multi software package with interoperability using legacy KNX-TP and ETS to configure and control light switches adjust LED color and dimming, and setup KNX devices with a smartphone connected through the BlueNRG-2 Bluetooth SoC.

Network coprocessor includes BLE 5.0 capabilities

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STMicroelectronics has unveiled the BlueNRG-2N Bluetooth 5.0-certified network processor, lowering power consumption and adding support for the latest Bluetooth features that increase data throughput and enhance privacy and security.

The BlueNRG-2N network coprocessor comes pre-programmed, ready for connecting to a host controller to provide Bluetooth connectivity. Not only simplifying product manufacture, the co-processor allows scaling the performance, features, and cost of the host system independently. Designers of products such as smart medical wearables, PC peripherals, remote controls, lighting, industrial and home automation can thus optimize their choice of microcontroller (MCU) to meet specific model requirements.

The latest Bluetooth enhancements featured in BlueNRG-2N include support for Data Length Extension, which accelerates over-the-air (OTA) firmware updates by as much as 2.5 times and raises data transfers to 700kbit/s at the application level. In addition, with support for Bluetooth LE Privacy 1.2, BlueNRG-2N changes address frequently without host-processor involvement to prevent unwanted tracking with minimal impact on system power consumption.

BlueNRG-2N is programmed with a digitally signed Bluetooth LE stack, which saves manufacturing costs while still allowing the flexibility to upgrade OTA. Built-in image authentication technology enhances cyber-security by always checking the stack before starting to allow only signed firmware images to run.

Power consumption is lower compared with previous BlueNRG generations, with low transmit and receive current and drawing just 900nA in shutdown mode with the BLE stack running. At the same time, the device maintains robust and reliable radio performance, with +8dBm programmable RF output power and up to a 96dB link budget.

BlueNRG-2N is the latest member in ST’s BlueNRG family of Bluetooth Low Energy chips that cater to various approaches when designing wireless systems. It shares key features with the BlueNRG-2 Bluetooth 5.0-certified System-on-Chip (SoC), which also contains a programmable Arm Cortex-M0 MCU to host the main application and Bluetooth connectivity on the same device. Developers working with BlueNRG chips can take advantage of the powerful and user-friendly STM32* online development environment (ODE), which includes the STM32CubeMX GUI plugin, to kick-start their projects.

As the dedicated network co-processor within the BlueNRG family, BlueNRG-2N is in full production and is included in ST’s 10-year industrial product-longevity program. Devices are available in a 2.66mm x 2.56mm WLCSP34 chip-scale packages: BlueNRG-234N or 5mm x 5mm QFN32: BlueNRG-232N, from $1.21 for orders of 1000 pieces.

World’s first LoRa-enabled SoC comes in 48-pin package

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STMicroelectronics has added a QFN48 package to the STM32WLE5 wireless System-on-Chip (SoC) portfolio, bringing the device’s extensive feature integration, power efficiency, and multi-modulation flexibility to a wider variety of industrial wireless applications.

The STM32WLE5 combines ST’s STM32L4 ultra-low-power microcontroller technology and Semtech SX126x sub-GHz radio IP optimized to meet local radio-equipment regulations worldwide. Its unique single-silicon-die integration helps save bill-of-materials (BOM) costs and simplifies the design of connected, smart devices for applications in metering, city management, agriculture, retail, logistics, smart buildings, and environmental management. Long-term availability is assured through ST’s rolling 10-year longevity commitment for industrial products.

With its low power consumption and small footprint, the STM32WLE5 enables energy-efficient, compact, and lightweight new products for burgeoning IoT markets. Now, the new 7mm x 7mm QFN48 package option makes it suited to a simplified two-layer board design that further eases manufacturing and reduces BOM costs.

As the world’s first LoRa-enabled SoC, the STM32WLE5 supports multiple RF-modulation schemes including LoRa spread-spectrum modulation as well as the (G)FSK, (G)MSK, and BPSK used by various sub-GHz long-range protocols including proprietary protocols. Users have flexibility to apply their desired protocol stack, whether created in-house, sourced externally, or chosen from off-the-shelf software such as the LoRaWAN and wM-Bus stacks that are available from ST and authorized partners.

ST has engineered the integrated RF stage to address global markets while improving performance and easing manufacture. Features include dual low-power (14dBm) and high-power (22dBm) transmitter modes with highly linear performance from 150MHz to 960MHz, spanning the sub-1GHz unlicensed frequency range, which ensures technical compatibility with RF regulations in all world markets. Sensitivity down to -148dBm helps to maximize RF range. Only a single crystal is needed to synchronize the high-speed external (HSE) clock and the radio, delivering a further saving in BOM.

The new QFN48 package extends the STM32WLE5 portfolio, which also includes devices in 5mm x 5mm BGA73. Three different Flash-memory density options are available per package, offering a choice of 64KB, 128KB, or 256KB, and all devices feature a high proportion of user-assignable GPIOs. All feature ST’s ultra-low-power microcontroller technologies, including dynamic voltage scaling and proprietary adaptive real-time ART Accelerator™ that allows zero-wait execution from Flash.

STM32WLE5 SoCs, including STM32WLE5J BGA73 and the latest STM32WLE5C QFN48 devices, are in production now. Please contact your local ST office for pricing information and sample requests.

Software function pack helps deploy intelligent edge devices for industrial condition monitoring

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STM32 software function packSTMicroelectronics has released a free STM32 software function pack that lets users quickly build, train, and deploy intelligent edge devices for industrial condition monitoring using a microcontroller Discovery kit.

Developed in conjunction with machine-learning expert and ST Authorized Partner Cartesiam, the FP-AI-NANOEDG1 software pack contains all the necessary drivers, middleware, documentation, and sample code to capture sensor data, integrate, and run Cartesiam’s NanoEdge libraries. Users without specialist AI skills can quickly create and export custom machine-learning libraries for their applications using Cartesiam’s NanoEdge™ AI Studio tool running on a Windows 10 or Ubuntu PC. The function pack simplifies complete prototyping and validation free of charge on STM32 development boards, before deploying on customer hardware where standard Cartesiam fees apply.

The straightforward methodology established with Cartesiam uses industrial-grade sensors on-board a Discovery kit such as the STM32L562E-DK to capture vibration data from the monitored equipment both in normal operating modes and under induced abnormal conditions. Software to configure and acquire sensor data is included in the function pack. NanoEdge AI Studio analyzes the benchmark data and selects pre-compiled algorithms from over 500 million possible combinations to create optimized libraries for training and inference. The function-pack software provides stubs for the libraries that can be easily replaced for simple embedding in the application. Once deployed, the device can learn the normal pattern of the operating mode locally during the initial installation phase as well as during the lifetime of the equipment, as the function pack permits switching between learning and monitoring modes.

Using the Discovery kit to acquire data, generate, train, and monitor the solution, leveraging free tools and software, and the support of the STM32 ecosystem, developers can quickly create a proof-of-concept model at low cost and easily port the application to other STM32 microcontrollers. As an intelligent edge device, unlike alternatives that rely on AI in the cloud, the solution allows equipment owners greater control over potentially sensitive information by processing machine data on the local device.

The FP-AI-NANOEDG1 function pack is available now at www.st.com, free of charge.
The STM32L562E-DK Discovery kit contains an STM32L562QEI6QU ultra-low-power microcontroller, an iNEMO™ 3D accelerometer and 3D gyroscope, as well as two MEMS microphones, a 240×240 color TFT-LCD module, and on-board STLINK-V3E debugger/programmer. The budgetary price for the Discovery kit is $76.00, and it is available from www.st.com or distributors.

New software development tools speed STM32 projects

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STM32Cube software-development toolSTMicroelectronics has released enhancements to the STM32Cube software-development ecosystem, letting users more easily filter and choose software examples, gather and apply development tools, and customize, use, and share STM32Cube Expansion Packages.

The updates introduce new features in the MCU configuration and project setup tool (STM32CubeMX version 6.0) and the STM32CubeIDE v1.4 multi-OS C/C++ development platform. Both tools now allow direct access to the latest STM32Cube MCU and Expansion Packages that contain software useful to run STM32® devices and peripherals, as well as external components such as sensors or connectivity. Also, users can now start their projects directly from any of the large number of software examples, which are easy to browse using the tools.

The STM32Cube MCU Packages dedicated to specific products and series contain peripheral drivers, middleware, application examples, and Board Support Packages (BSPs) that can help exercise device features and peripherals. STM32Cube Expansion Packages can be implemented by ST or third parties, allowing flexibility to include new features such as a BSP or middleware while maintaining the integrity of the STM32Cube ecosystem.

With a powerful new utility in STM32CubeMX 6.0 called STM32PackCreator, users can now create and share their own STM32Cube Expansion Packages. STM32PackCreator guides users through expansion-pack development and helps ensure all packages created are enhanced to be opened and configured in STM32CubeMX and STM32CubeIDE tools.

STM32CubeMX version 6.0 now also helps users find all development tools available in the STM32Cube ecosystem, as well as other ST design tools such as AlgoBuilder, the graphical algorithm-design tool for STM32 microcontrollers and MEMS sensors, and ST-MC-SUITE for motor control. In addition, users can launch STM32PackCreator and eDesignSuite, which helps design associated system functions including signal conditioning, power conversion, and RF circuitry, from within STM32CubeMX 6.0.

A series of short video tutorials available within STM32CubeMX version 6.0 helps users take full advantage of the tool and learn more about the new features.

All elements of the STM32Cube ecosystem including tools and embedded software components are available free of charge. For more information and to download the latest releases, please visit www.st.com/stm32cube.