NVIDIA unveiled the NVIDIA A100 80GB GPU — the latest innovation powering the NVIDIA HGX AI supercomputing platform — with twice the memory of its predecessor, providing researchers and engineers unprecedented speed and performance to unlock the next wave of AI and scientific breakthroughs. The new A100 with HBM2e technology doubles the A100 40GB GPU’s high-bandwidth memory […]
Industry News
Curved, side-mounted capacitive sensor optimized for mobile devices
Fingerprint Cards AB announces the launch of a new, slim and curved capacitive touch sensor for biometric authentication. Following the success of the FPC1540 sensor, the uniquely curved FPC1542 sensor is set to enable innovation in the latest borderless smartphone designs. As demand for side-mounted touch sensors grows, the curved sensor offers OEMs enhanced design […]
Secured platform-enabled Wi-Fi MCU module pre-provisioned for cloud platforms
As the Internet of Things (IoT) expands beyond home automation and drives deeper into home control – including Heating, Ventilation and Air Conditioning (HVAC), garage doors, and fans – and grows in building and industrial automation, the need for highly integrated, reliable and secured Industrial IoT (IIoT) connectivity is greater than ever. Microchip Technology announced the […]
BLE chips drive first Wi-Fi 6-enabled gaming consoles
NXP Semiconductors N.V. announced it’s family of 2×2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE solutions that are driving a new phase of connectivity innovation for advanced gaming, audio, industrial, and IoT markets. Enabling the world’s first Wi-Fi 6 enabled gaming console, NXP’s optimized IW62X family of products will provide increased capacity, efficiency, and performance for […]
World’s First 16-Gb DDR5 DRAM supports transfer rates up to 5,600 Mbps
SK hynix Inc. announced to launch the world’s first DDR5 DRAM. It is a high-speed and high-density product optimized for Big Data, Artificial Intelligence (AI), and machine learning (ML) as a next generation standard of DRAM. Since SK hynix announced the development of the World’s First 16 Gigabit (Gb) DDR5 DRAM in November 2018, the […]
Standardized data exchange/TSN combo delivers real-time QoS for critical traffic flows
Connext DDS is now integrated into the Relyum portfolio of DDS-TSN products which provides determinism, reliability, scalability and availability for critical systems. Combined, DDS and TSN allow connectivity networks to converge towards a single commodity hardware solution for real-time exchange of all data. Connext DDS provides a standardized data exchange between applications built from separate […]
Trusted Computing Group spec combats sophisticated cyber threats
Cybersecurity is taking a huge stride forward, as the Trusted Computing Group (TCG) today released its TPM 2.0 Library specification Revision 1.59 – providing necessary updates to the previously published TPM specification to combat the growing sophistication of cybersecurity threats worldwide. The challenges facing the cybersecurity industry are unprecedented, with technological advances creating a greater risk than ever before […]
Open-source spec enables acceleration of 2D vector graphics API by OpenGL ES 2.0-compatible GPUs
The Khronos Group, an open consortium of industry-leading companies creating graphics and compute interoperability standards, publicly releases the OpenVG 1.1 Lite Provisional Specification for advanced 2D vector and raster graphics, with conformance tests placed into open source under the Apache 2.0 license. OpenVG 1.1 Lite enables this high-quality 2D vector graphics API to be fully […]
OpenRoaming spec aims to simplify public-guest Wi-Fi connections
The Wireless Broadband Alliance (WBA) today invited all organisations in the Wi-Fi ecosystem to join WBA OpenRoaming and become part of a globally available Wi-Fi federation that offers an automatic and secure connection of billions of devices to millions of Wi-Fi networks. WBA OpenRoaming provides a new global standards-led approach, removing public-guest Wi-Fi connectivity barriers […]
MIPI v3.0 enables more rapid and dynamic configuration changes for RF front-end subsystems
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the release of MIPI RF Front End Control Interface (MIPI RFFE) v3.0. The latest version of the world’s de facto standard interface for control of radio frequency (RF) front-end (FE) subsystems, MIPI RFFE v3.0 is designed to deliver the tighter timing […]
