The conga-TCRP1 from congatec is a COM Express Type 6 Compact module built on AMD Ryzen™ AI Embedded P100 Series processors, combining up to 6 Zen5/Zen5c CPU cores, a Radeon™ RDNA™ 3.5 GPU and an XDNA2 NPU delivering up to 50 TOPS for edge AI workloads. The module supports up to 96 GB DDR5-5600 memory […]
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Compact module targets edge systems requiring on-device AI processing
congatec has introduced its first COM-HPC Mini computer-on-module based on Qualcomm Dragonwing IQ-X Series processors. The conga-HPC/mIQ-X uses the Qualcomm Oryon CPU and an integrated Hexagon NPU to support local AI workloads, including machine learning inference and large language model execution. The module delivers up to 45 TOPS of AI performance and is intended for […]
Visual programming interface added to computer-on-module management tools
Congatec has released aReady.IOT, a software package that extends its Computer-on-Module (COM) platform with IoT connectivity tools. The package implements OPCUA, MQTT, and REST protocols for machine-to-cloud communication, enabling data transfer between embedded systems and cloud services including AWS, Azure, and Telekom Cloud. The COM Manager component provides remote management capabilities for Computer-on-Modules, while the […]
COM Express modules offer up to 39 TOPS for AI inference
congatec introduces new COM Express Compact Computer-on-Modules with AMD Ryzen Embedded 8000 Series processors. Based on the dedicated computing cores of the new Ryzen processors featuring up to eight ‘Zen 4’ cores, innovative XDNA NPU, and powerful Radeon RDNA 3 graphics, the new modules deliver impressive performance of up to 39 tera operations per second […]
SMARC modules boost performance for industrial and AI applications
Congatec has introduced new high-performance computer-on-modules (COMs) featuring i.MX 95 processors from NXP. This addition expands Congatec’s module portfolio, which includes low-power NXP i.MX Arm processors. The new modules offer straightforward scalability and reliable upgrade paths for energy-efficient edge AI applications with high security requirements. These modules provide up to three times the GFLOPS computing […]
Small processor board power handheld and DIN-rail computing
Congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3 / booth 241). The portfolio now ranges from high-performance COM-HPC server-on-modules to ultra-compact and brand-new COM-HPC client-on-modules that are hardly larger than a credit card. Together with the accompanying tailored cooling solutions, carrier boards, and design-in services, Congatec now provides […]
Computer-on-modules boost performance with new processors
congatec announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. congatec expects series production of OEM designs based on these new modules to ramp up quickly and massively as the new processors with long-life availability offer vast improvements in many features yet are fully […]
COM Express 3.1 boards host 12th Gen Intel Core processors
congatec has launched 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake). The modules will be equipped with the new updated 16 Gbps COM Express connector and support high-speed interfaces such as PCIe 4.0 and USB 3.2. As upgrades of the already existing family of COM Express Type 6 modules, […]
Modular micro-ATX compliant carrier board features COM-HPC interface
congatec introduces its first modular Micro-ATX compliant carrier board with a COM-HPC interface. The board is designed for embedded long-term availability of at least seven years, which eliminates the design risks, revision requirements, and supply chain uncertainties of standard or semi-industrial-grade motherboards that are usually only deliverable for three to five years. As it is […]
COM-HPC and COM express boards feature Intel P-cores, E-cores
congatec introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each. Featuring the new Intel hybrid architecture with its mix of performance cores (P-cores) and efficient cores (E‑cores), the BGA-solderable processor variants consume just 15 to 28 W […]
