Congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3 / booth 241). The portfolio now ranges from high-performance COM-HPC server-on-modules to ultra-compact and brand-new COM-HPC client-on-modules that are hardly larger than a credit card. Together with the accompanying tailored cooling solutions, carrier boards, and design-in services, Congatec now provides […]
congatec
Computer-on-modules boost performance with new processors
congatec announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. congatec expects series production of OEM designs based on these new modules to ramp up quickly and massively as the new processors with long-life availability offer vast improvements in many features yet are fully […]
COM Express 3.1 boards host 12th Gen Intel Core processors
congatec has launched 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake). The modules will be equipped with the new updated 16 Gbps COM Express connector and support high-speed interfaces such as PCIe 4.0 and USB 3.2. As upgrades of the already existing family of COM Express Type 6 modules, […]
Modular micro-ATX compliant carrier board features COM-HPC interface
congatec introduces its first modular Micro-ATX compliant carrier board with a COM-HPC interface. The board is designed for embedded long-term availability of at least seven years, which eliminates the design risks, revision requirements, and supply chain uncertainties of standard or semi-industrial-grade motherboards that are usually only deliverable for three to five years. As it is […]
COM-HPC and COM express boards feature Intel P-cores, E-cores
congatec introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each. Featuring the new Intel hybrid architecture with its mix of performance cores (P-cores) and efficient cores (E‑cores), the BGA-solderable processor variants consume just 15 to 28 W […]
New COM-HPC server modules target rugged environments with extended temperature ranges
congatec announces the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D. The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver workloads […]
Dev boards comply with new PICMG COM-HPC specs
Congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a full specification compliant ecosystem for engineers of COM-HPC Client and Server module-based designs. From now on, engineers can dive right in and start to develop fully compliant designs by picking their […]
COMs carry 11th-Gen Intel Core vPro, Xeon W-11000E, Celeron MCUs
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications. Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU […]
Intel-based CoMs feature soldered RAM for high shock/vibration resistance
congatec introduces new 11th Gen Intel Core processor-based Computer-on-Modules with soldered RAM for the highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. For more price-sensitive […]
Starter set helps accelerate AI vision applications
Congatec extends its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilization of the new processor integrated NXP Neural Processing Unit (NPU). Delivering up to 2.3 TOPS of performance for deep learning-based artificial intelligence, it can run inference […]
