congatec introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each. Featuring the new Intel hybrid architecture with its mix of performance cores (P-cores) and efficient cores (E‑cores), the BGA-solderable processor variants consume just 15 to 28 W […]
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New COM-HPC server modules target rugged environments with extended temperature ranges
congatec announces the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D. The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver workloads […]
Dev boards comply with new PICMG COM-HPC specs
Congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a full specification compliant ecosystem for engineers of COM-HPC Client and Server module-based designs. From now on, engineers can dive right in and start to develop fully compliant designs by picking their […]
COMs carry 11th-Gen Intel Core vPro, Xeon W-11000E, Celeron MCUs
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications. Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU […]
Intel-based CoMs feature soldered RAM for high shock/vibration resistance
congatec introduces new 11th Gen Intel Core processor-based Computer-on-Modules with soldered RAM for the highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. For more price-sensitive […]
Starter set helps accelerate AI vision applications
Congatec extends its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilization of the new processor integrated NXP Neural Processing Unit (NPU). Delivering up to 2.3 TOPS of performance for deep learning-based artificial intelligence, it can run inference […]
COM express compact computer-on-module employs AMD Ryzen embedded V2000 processor
Congatec introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module is setting a new performance per watt benchmark, which finds its sweetest spot in 15 Watt TDP designs[1]. This extraordinary low power platform performance […]
SMARC modules incorporate i.MX 8M Plus processor for AI, embedded vision processing
Congatec presents its brand new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision, and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra-low-power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for situational awareness, […]
Computer-on-module HPC board features 11th gen Intel core processor
Congatec presents a brand new COM-HPC starter set at embedded world 2021 DIGITAL. Ideal for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0, and up to ultra-fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel […]
Modules sport 11th Gen Intel Core processors for outdoor/in-vehicle apps
Congatec introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments. The value package includes […]
