Sealevel Systems announces the release of the 12009 COM Express Compact Type 6 Evaluation Board. The 12009 COM Express Compact Type 6 Evaluation Board enables accelerated development of embedded computing prototypes, dramatically expedites electrical hardware engineering, and reduces costs for new product introductions (NPIs).
Originally developed to control wearable, robotic exoskeleton systems, the board design quickly expanded in functionality while maintaining the mandated, extremely small footprint. At 95 millimeters square, the 12009 is identical in size to a Compact Type 6 COM Express module. Designed to meet a wide variety of application needs, the 12009 evaluation board supplies a diverse I/O mix and robust processing support. Standard I/O includes Gigabit Ethernet, USB 3.0, USB 2.0, GPIO, RS-232, and Mini DisplayPort. The carrier board is designed for the congatec conga-TC370 COM Express family, with support for 8th generation Intel Core processors, up to 64 GB DDR4 RAM, and TPM 2.0 support. The 12009 features a wide operating temperature range of 0ºC to 70ºC and is powered via a locking, four-position Molex Micro-Fit connector.
The complete evaluation kit (Part #12009-001-KT) includes a Type 6 module with Intel Core i3-8145UE CPU and 8 GB DDR4 RAM. Additionally, to improve the development process, the kit includes a 128GB M.2 SATA SSD module (supports Windows and Linux operating systems), a desktop power supply, and a wide variety of cables to facilitate connections to serial and Ethernet ports and optional fans. A power button and power-indicating LED are also included.
The COM Express Compact Type 6 Evaluation Board (Part #12009-001-KT) is listed at $2,299 and is available from stock as a standard product.
