• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Microcontroller Tips

Microcontroller engineering resources, new microcontroller products and electronics engineering news

  • Products
    • 8-bit
    • 16-bit
    • 32-bit
    • 64-bit
  • Applications
    • 5G
    • Automotive
    • Connectivity
    • Consumer Electronics
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Security
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Resources
    • Design Guide Library
    • LEAP Awards
    • Podcasts
    • White Papers
  • Videos
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

3U/6U OpenVPX computer boards, peripherals, ATR-style chassis target defense apps

October 11, 2022 By Redding Traiger

General Micro Systems introduced a new product family of 3U and 6U OpenVPX computer boards, peripherals, and ATR-style chassis for use in U.S. Army ground, air, communications, and weapons systems. The “X9 Venom” family of 21 products will be available by early 2023, starting first with the 3U and 6U single-board computers (SBCs) based upon Intel and NVIDIA processors and GPGPUs. All products follow ANSI/VITA 65 standards, meet the Department of Defense (DoD) requirement for modular open standards approach (MOSA) electronic systems, and are IEEE 1101.2 conduction cooled. X9 Venom products are also SOSA (Sensor Open Standard Architecture) aligned and ready to meet C4ISR/Electronic Warfare Modular Open Suite of Standards (CMOSS), two standards that increasingly are requirements in U.S. Army programs and platform upgrades.

The OpenVPX standard is a common upgrade from widely deployed legacy VME-style boards and chassis. Unlike VME, however, OpenVPX modules have limited space for electronics and input/output signals, offering little differentiation between vendors or suppliers of these modules. For system designers, OpenVPX systems have fewer functions per slot and need more boards in the chassis, require complex wiring between the slots as functions “spill over,” and generally use more power, generate more heat and cost more.

GMS’ X9 Venom product line is different, relying on GMS’ modular and super-dense X9 architecture and patented I/O, through-board and external connectors, signal conditioning, power management, and cooling to drastically increase the functionality of each X9 Venom single-board computer—better called a single-board system.

According to Sharfi, GMS accomplishes what was once deemed impossible by “folding” a larger computer board with many functions into multiple 3U-sized boards that fit into either one or two 3U slots. In addition, patented GMS connector technology and know-how routes high-speed PCI Express 4 signals (16Gbps) between the stacked boards without signal degradation. Traditional PCI Express and Ethernet data are sent to the backplane, but high-speed I/O—including 100Gbit fiber optic data and Thunderbolt 4 signals—is sent to the front panel.

GMS 3U and 6U ATR-PLUS chassis are designed to handle both backplane and front panel copper and fiber data. The 6U-sized X9 Venom boards are all single slot but essentially take the 3-board X9 architecture and place it onto a single 6U board. All boards or chassis use GMS patented “clamshell” heat sinks, wedge locks, RuggedCool or Diamond RuggedCool hot spot cooling and stiffeners, and have available LightBolt front panel connectors for copper, fiber, or fiber with up to 100W Power Delivery.

Unique to GMS’ X9 architecture, which includes the X9 Spider SFF modules and X9 Venom OpenVPX boards and chassis, is Thunderbolt 4 technology. This Intel/Apple 40Gbps interface provides USB 4/3/2, DisplayPort, PCIe, 10Gbits/s Ethernet, and up to 100W Power Delivery (when equipped). With Venom single-board systems, Thunderbolt 4 ports and 100Gb Ethernet allow data movement between cards and outside of the ATR box without loading up the limited bandwidth OpenVPX backplane. In addition, externally connected Thunderbolt 4 systems provide simple modularity, scalability, and a very easy upgrade path without having to modify an OpenVPX chassis.

Thunderbolt 4 technology and 100Gbps Ethernet provide the MOSA interoperability, scalability, and vendor independence that SOSA is trying to accomplish, without having to define the interface at the card edge all the way down to the individual pins. Any product with Thunderbolt 4 technology or Ethernet ports will interoperate and can be replaced by any other product.

Available in single-slot or dual-slot versions, in 3U or 6U sizes, and in the air- or conduction-cooled versions, X9 Venom SBCs are available with Intel’s 8-core Xeon W (Tiger Lake H), Intel’s 20-core Xeon D-2700 (formerly Ice Lake D HCC), or NVIDIA’s Jetson AGX Orin GPGPU machine image vision/AI processor. Each SBC comes fully featured, and can also be available with network-oriented functions (“NET” version), network-attached storage functions (“NAS” version), or artificial intelligence functions (“AI” version). Options are many, including up to 48TB of on-board storage, 4-6 100Gb Ethernet ports, supplemental NVIDIA RTX5000 GPGPU co-processor, and up to six Thunderbolt 4 40Gbps ports for out-of-band data movement without relying on the backplane.

You may also like:


  • Exceptions, traps, and interrupts, what’s the difference?

  • How do firmware, system software, and application software work together?

  • What do MCUs have that FPGAs don’t?

  • What is the onboard diagnostics system, OBDII?

  • What are basic logic gates?

Filed Under: Aerospace and Defense, Artificial intelligence/ML, Computer, Ethernet, Products, Single Board Computers, Telecommunications, Tools Tagged With: generalmicrosystems

Primary Sidebar

Featured Contributions

Can chiplets save the semiconductor supply chain?

Navigating the EU Cyber Resilience Act: a manufacturer’s perspective

The intelligent Edge: powering next-gen Edge AI applications

Engineering harmony: solving the multiprotocol puzzle in IoT device design

What’s slowing down Edge AI? It’s not compute, it’s data movement

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Connectivity
AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

EE Learning Center

EE Learning Center

EE ENGINEERING TRAINING DAYS

engineering
“bills
“microcontroller
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Footer

Microcontroller Tips

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

Microcontroller Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy