• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Microcontroller Tips

Microcontroller engineering resources, new microcontroller products and electronics engineering news

  • Products
    • 8-bit
    • 16-bit
    • 32-bit
    • 64-bit
  • Applications
    • 5G
    • Automotive
    • Connectivity
    • Consumer Electronics
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Security
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Resources
    • Design Guide Library
    • LEAP Awards
    • Podcasts
    • White Papers
  • Videos
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

4Gbps, Low-voltage differential transceiver IC aggregates 37 data lines into four

February 6, 2020 By Aimee Kalnoskas Leave a Comment

THCS251 differential transceiver ICTHine announced the high-volume availability of their new GPIO / LVCMOS transceiver IC, THCS251.

This new IC allows engineers to aggregate up to 37 lines of different data rates into just 4 lines that can be received and transmitted in the same IC! With the THCS251, manufacturers can lower cost, reduce size, and improve reliability by utilizing simplified and smaller hinges/slip rings in their product implementations.

The new THCS251 IC can be used in a wide variety of applications such as laptop computers, surveillance cameras, robotics, printing machines, medical equipment, gaming, XR devices, etc.

Many electrical devices, such as laptops, use hinges between their display and keyboard. Other devices, such as surveillance cameras, use slip rings to enable 360-degree rotation. These hinges and slip rings limit the number of wires that carry signals through them due to their physical space and/or cost.

In the past, SerDes (Serializing and Deserializing) technologies such as THine’s V-by-One® HS, have solved many of these challenges. However, demand for more I/O is increasing as devices have more sensors to provide more accurate information for better user experiences. Thus, aggregation in addition to SerDes is needed to reduce the cable number of multiple different signal paths, thereby allowing more flexible implementations that can reduce product size and cost.

Using THine’s market-proven mixed-signal technologies, THCS251 serializes and aggregates up to 37 lines into a pair of 4Gbps high-speed differential signals. THCS251 also deserializes and deaggregates the differential signals back to the original 37 lines allowing implementations of both the receiver and transmit directions with only 4 lines. Thus, using THCS251 on each side of the hinge or slip ring connector can enable new applications that require higher I/O counts.

Also, the solutions using the THCS251 offer more choices for physical harnesses than hinges or slip rings. For example, it can be used with a contactless connector from Keyssa Inc. that can offer a ruggedized, low latency, detachable HD camera solution.

The high-speed differential signal path of the THCS251 is supported by 8B10B encoding and built-in adaptive equalization, allowing a distance of greater than 15 meters with standard cables.

Filed Under: Microprocessor Tagged With: thinelectronics

Reader Interactions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Primary Sidebar

Featured Contributions

Designing for functional safety in robotics: key considerations for engineers

Can chiplets save the semiconductor supply chain?

Navigating the EU Cyber Resilience Act: a manufacturer’s perspective

The intelligent Edge: powering next-gen Edge AI applications

Engineering harmony: solving the multiprotocol puzzle in IoT device design

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Electronic Design Automation
This Tech ToolBox helps to clear the path to faster time-to-market by digging into AI-enhanced design, hardware-assisted verification, parasitic extractions, PCB-to-harness integration, and more.

EE Learning Center

EE Learning Center

EE ENGINEERING TRAINING DAYS

engineering
“bills
“microcontroller
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Footer

Microcontroller Tips

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

Microcontroller Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy