When USB3.0 was introduced, offering theoretical data signaling rates of 5 Gbits/s compared with the 480 Mbits/s available from USB2.0, the protocol became significantly more useful across a variety of applications. The latest standard to be published, USB3.1, further increases performance to 10 Gbits/s and reduces line encoding overhead. All flavors use a Type A […]
Rugged flash drive available in new sizes
Fischer Connectors, a worldwide manufacturer in push-pull circular connectors and cable assembly solutions, launched the USB 3.0 version of its ultra-portable, miniature, lightweight and extremely tough Fischer Rugged Flash Drive. This memory stick has been specially designed for the safe transportation and storage of sensitive data in harsh environments. The USB 3.0 Fischer Rugged Flash Drive is […]
Low-power Ethernet switches
optimized for industrial IoT uses
Microsemi, a provider of semiconductor solutions differentiated by power, security, reliability and performance, announced its new Ocelot product family, a low power, feature-rich Ethernet switch family optimized for communications networking in the industrial Internet of Things (IIoT) market. Designed for the specific needs of industrial Ethernet switch applications, such as factory automation, process control, smart grid/smart […]
Reference platform speeds
connected car development efforts
Qualcomm through its subsidiary, Qualcomm Technologies, announced the Qualcomm Connected Car Reference Platform aimed at accelerating the adoption of advanced and complex connectivity into the next-generation of connected cars. As a developer in automotive connectivity with more than 340 million chips shipped so far for products for over 20 automakers, Qualcomm Technologies developed a product designed […]
SoC development environment cuts compilation time,
adds system-level profiling tools
Xilinx announced the 2016.1 release of the SDSoC development environment, enabling software defined programming for the Zynq family of SoCs and multi-processing (MP) SoCs using C and C++ languages. The new release includes support for the recently introduced 16 nm Zynq UltraScale+MPSoC. Additionally, this release enables a significant leap in productivity through system level profiling […]
1-Gbit DDR3 RAMs carry ECC
Integrated Silicon Solution, a developer of advanced memory solutions, announced it has begun sampling production units of its new 1-gigabit (1Gbit) DDR3 DRAMs with ECC. The new product has an embedded Error Correcting Code (ECC), which detects and corrects bit errors on-the-fly. It requires no monitoring, nor intervention to use, yet it is backward compatible with […]
World’s First WiGig USB Dongle
Peraso Technologies, a developer of Wireless Gigabit (WiGig) chipsets, announced the company will be demonstrating interoperability between its USB dongle reference design and a WiGig wireless AP. As several AP suppliers had announced products at CES 2016, it is critical for the WiGig ecosystem that consumers be able to enable legacy equipment into the WiGig ecosystem. […]
Chipset delivers 1 Gbps broadband over existing phone lines
Qualcomm announced at COMPUTEX 2016 that its subsidiary, Qualcomm Technologies, introduced end-to-end GigaDSL products that enable broadband operators to seamlessly transition deployments from VDSL to Gigabit access technologies. Designed to meet the requirements for the migration for existing VDSL by operators, especially in Korea and Japan, the new QCO5700 for multiple dwelling units (MDU) and […]
Ri-radio 802.11ac platforms boost Wi-Fi signals
Qualcomm announced at COMPUTEX 2016, that its subsidiary, Qualcomm Technologies, launched a new family of tri-radio 802.11ac platforms designed to boost the capacity of home networks and optimize its usage to deliver better consumer Wi-Fi experiences. The new platforms are designed to bring premium Wi-Fi features, like Multi-User MIMO (MU-MIMO) and Qualcomm Wi-Fi SON (Self-Organizing […]
Dual-band Wi-Fi chip consumes little power
Qualcomm announced at COMPUTEX 2016 that its subsidiary, Qualcomm Technologies, is extending its flagship QCA401x connectivity solutions with a new product. The new QCA4012 chip brings dual band Wi-Fi, enhanced security, low power and a small size at a price point that best supports the development of connected devices. Qualcomm Technologies also announced the expansion […]
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