Just as agile software principles are being adapted for hardware development, so secure provisioning IT practices are finding their way into the semiconductor industry — a move accelerated by the necessity of keeping the increasing number and vulnerability of connected IoT devices. While LoRa technology is sweet spot for low-power connectivity, security remains an area for […]
Connectivity
Dual interface smart card technology now sampling
NEXT Biometrics announced that it will start sampling its dual interface smart card solution (One Touch Flex CL) early in the second quarter of 2019. The solution enables NEXT’s unique technology to be used with contact and contactless smart cards, including payment cards. NEXT One Touch Flex combines the high security and accuracy levels of […]
Combo chip handles both Wi-Fi 6 and AP+Bluetooth
MediaTek today announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology — Wi-Fi 6 (802.11ax) — for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home. MediaTek’s Wi-Fi 6 […]
IoT interoperability specification fast tracks Thread product development
The Zigbee Alliance and Thread Group have reached a critical milestone in IoT interoperability with the completion of the Dotdot 1.0 specification and announcement of the Dotdot over Thread certification program. For the first time, developers of smart products can confidently use a mature, open, and certifiable interoperability language over a low-power IP network. This […]
LTE Advanced Category 20 module optimized for laptop, PC, and IIoT
Quectel Wireless Solutions announced the EM20, an LTE Advanced Category 20 module ahead of CES 2019. EM20 offers the maximum LTE throughput of 2.0Gbps Downlink and is optimized specially for laptop, PC and high-speed industrial IoT applications. Based on Qualcomm’s SDX24 chipset and fully compliant with 3GPP R13 specification, EM20 supports cutting-edge LTE wireless technologies such as up to 7 Carrier Aggregation (CA), 4×4 MIMO […]
MEMS motion sensor optimized for consumer image stabilization apps
TDK announces the newest additions to the InvenSense CORONA premium motion sensor product family, the world’s only 6-axis IMUs optimized for the most demanding optical and computational image stabilization requirements. The new InvenSense ICM-42622 6-axis IMU excels in OIS and CIS applications due to its industry-leading sensor performance and features: Up to 40% lower noise […]
Reference design eases design of Wi-Fi 6 antenna systems
Airgain, Inc. announced the development of a Wi-Fi 6 reference design with Quantenna incorporating Airgain’s Wi-Fi 6 antenna solution and Quantenna’s high-performance Wi-Fi 6 chipset, the QSR10GU-AX PLUS. “With the increases in RF system complexity that are needed to get the most performance out of Wi-Fi 6, system designers face much longer design cycles unless they […]
60 GHz Radar on Module targets industrial automation applications
Mistral Solutions announced its USB-powered, production-ready 60GHz Radar on Module [RoM] for industrial automation applications. The 60GHz RoM is a highly-integrated ultra-compact solution based on TI’s newly launched IWR6843 Antenna on Package (AoP) chipset. Mistral’s 60GHz small form factor RoM is among the first Industrial Radar Modules based on Texas Instruments IWR6843 Antenna on Package […]
Next-gen 10 Gbps automotive Ethernet includes network traffic prioritization, system scalability and security
Molex announced today the next evolution of its 10 Gbps Automotive Ethernet Network Platform designed to support OEMs in the development and design of autonomous vehicles. The solution offers a complete vehicle connectivity ecosystem delivering seamless multi-zone integration across multiple hardware, software and interconnect cabling systems, with the flexibility to incorporate legacy automotive protocols as well as […]
Pre-certified LTE-M/NB-IoT SiP module opens up cellular IoT access
Nordic Semiconductor announces that the first nRF9160 System-in-Package (SiP) member of its nRF91 Series of cellular IoT modules will be available to all customers via its global distribution network within the next 24 hours. This includes Digi-Key Electronics, Mouser Electronics, and Premier Farnell, and others. The nRF9160 has also received GCF certification—the trusted mobile communications […]