• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Microcontroller Tips

Microcontroller engineering resources, new microcontroller products and electronics engineering news

  • Products
    • 8-bit
    • 16-bit
    • 32-bit
    • 64-bit
  • Applications
    • 5G
    • Automotive
    • Connectivity
    • Consumer Electronics
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Security
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Resources
    • Design Guide Library
    • LEAP Awards
    • Podcasts
    • White Papers
  • Videos
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

tdkcorpororation

Redundant angle sensors support ASIL D requirements

June 30, 2020 By Aimee Kalnoskas Leave a Comment

TAD4140 sensor

TDK Corporation has announced the expansion of its tunnel-magnetoresistance (TMR) angle sensor portfolio with the new digital TAD4140 sensor. Designed for demanding automotive and industrial applications, compared to TDK’s existing digital angle sensor – the TAD2141 – the new TAD4140 features full redundancy with two signal processor units and 2×2 TMR bridges in a single […]

Filed Under: Applications, Automotive, Industrial, Sensor modules Tagged With: tdkcorpororation

Ultrasonic sensor disks offer serial resonance frequency of 2000 kHz

September 19, 2019 By Aimee Kalnoskas Leave a Comment

ultrasonic sensor disks

TDK Corporation presents a new series of ceramic-based EPCOS ultrasonic sensor disks, comprising two standard types. The B59050Z0206A030 sensor disk has a diameter of 5.0 mm and thickness of 1.02 mm. With a serial resonance frequency of 2000 kHz it features thickness oscillation mode (axial), making is suitable for use in liquid media. The B59070Z0285D12* […]

Filed Under: Applications, Automotive, Sensor modules Tagged With: tdkcorpororation

Time-of-Flight sensor combines ultrasonic transducer with DSP on mixed-signal ASIC

June 25, 2019 By Aimee Kalnoskas Leave a Comment

Chirp CH-101

TDK announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight (ToF) sensor. This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the ToF, the sensor can determine the location of an […]

Filed Under: Sensor modules Tagged With: tdkcorpororation

SoC development kits boost endpoint AI and Machine Learning efforts

March 26, 2019 By Aimee Kalnoskas Leave a Comment

SoC development kits

QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced the launch of its Merced EOS S3AI Hardware Development Kit (HDK) to enable quick development of applications for endpoint Artificial Intelligence (AI) and Machine Learning (ML). The Merced HDK is an evaluation platform for QuickLogic’s EOS S3AI SoC […]

Filed Under: Applications, Artificial intelligence/ML, Machine learning, microcontroller, Tools Tagged With: tdkcorpororation

Smart linear Hall effect sensor handles SENT protocol transmissions

March 26, 2019 By Aimee Kalnoskas Leave a Comment

Smart linear Hall effect sensor

TDK Corporation expands its Micronas linear Hall-effect sensor portfolio with the programmable HAL 1890 supporting the latest SENT protocol according to SAE J2716 Rev. 4. The HAL 1890 now comes with digital output signal supervision and is as small, robust, and cost-effective as the already existing HAL 188x variants. The HAL 1890 is an optimal […]

Filed Under: microcontroller Tagged With: tdkcorpororation

MEMS motion sensor optimized for consumer image stabilization apps

January 8, 2019 By Aimee Kalnoskas Leave a Comment

Chirp SonicTrack

TDK announces the newest additions to the InvenSense CORONA premium motion sensor product family, the world’s only 6-axis IMUs optimized for the most demanding optical and computational image stabilization requirements. The new InvenSense ICM-42622 6-axis IMU excels in OIS and CIS applications due to its industry-leading sensor performance and features: Up to 40% lower noise […]

Filed Under: Applications, Connectivity, microcontroller Tagged With: tdkcorpororation

Primary Sidebar

Featured Contributions

Designing for functional safety in robotics: key considerations for engineers

Can chiplets save the semiconductor supply chain?

Navigating the EU Cyber Resilience Act: a manufacturer’s perspective

The intelligent Edge: powering next-gen Edge AI applications

Engineering harmony: solving the multiprotocol puzzle in IoT device design

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Electronic Design Automation
This Tech ToolBox helps to clear the path to faster time-to-market by digging into AI-enhanced design, hardware-assisted verification, parasitic extractions, PCB-to-harness integration, and more.

EE Learning Center

EE Learning Center

EE ENGINEERING TRAINING DAYS

engineering
“bills
“microcontroller
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Footer

Microcontroller Tips

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

Microcontroller Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy