Silicon Labs has announced the release of a conforming Thread mesh networking stack that has successfully passed testing based on the Thread 1.1 technical specification. Developers using the new Thread 1.1-conforming stack running on Silicon Labs’ wireless SoCs and wireless modules can submit their Thread-enabled products for conformance testing using Thread test resources to ensure conformance […]
Connectivity
Wireless development platform helps devise Wi-Fi, Bluetooth, and combo designs
Cypress Semiconductor Corp. today announced a new version of its development platform for the Internet of Things (IoT) that enables wireless connectivity in minutes. The Wireless Internet Connectivity for Embedded Devices (WICED®) Studio 4 platform provides a single development environment for multiple wireless technologies, including Cypress’s world-class Wi-Fi®, Bluetooth® and combo solutions, with an easy-to-use […]
BLE SiP module facilitates compact IoT designs
Silicon Labs has introduced the industry’s smallest Bluetooth® low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete, cost-effective connectivity solution with no compromises in performance. Available in a tiny 6.5 mm x 6.5 mm package, the BGM12x Blue Gecko SiP module enables developers to miniaturize IoT designs by minimizing the PCB […]
VPX3 SBC supports safety certified RTOS
Curtiss-Wright’s Defense Solutions division today announced that it is collaborating with Green Hills Software to support the RTCA/DO-178C certified multi-core INTEGRITY-178 tuMP (Time-Variant Unified Multi Processing) real-time operating system (RTOS) on its safety certifiable COTS single board computers (SBC). The first Curtiss-Wright product to support Green Hills Software’s safety certified multi-core RTOS is the recently […]
ARINC-429 Interface carries 16 TX channels
United Electronic Industries (UEI) today announced that its new high-performance ARINC-429 interface I/O board, the DNx-429-516, is available for purchase. This 16-channel board is fully compliant with the ARINC-429 specifications and supports both high speed (100 kHz) and low speed (12.5 kHz) operation. The DNx-429-516 is compatible with all of UEI’s family of I/O chassis. […]
High-speed RS-485/RS-422 transmitters include ±15 kV ESD protection
Exar Corporation today announced a family of high-speed RS-485/RS-422 transmitters that combine low power, high performance, small packaging and high ±15kV ESD protection. This family is best suited for industrial applications such as multi-drop clock distribution, telecom networking, robotic control, process automation and local area network applications. The XR33193, XR33194 and XR33195 operate from a 3.3V supply and draw only […]
Embedded Wi-Fi/BLE modules work stand-alone or with controllers
LSR, a Laird business and a global leader in certified modules and design services for wireless product development, is introducing two new solutions that help companies design and certify wirelessly-connected products quickly and successfully. Practical applications might include security and building automation, making enterprise or personal devices “wireless” to connect to the internet, medical devices, […]
Buffers speed design of clock trees, eliminate need for level shifters
Microsemi Corporation today announced the availability of its ZL40250-ZL40253 miSmartBuffer™ devices. The highly flexible feature rich products reduce the complexity of designing clock trees for communications, enterprise switches and data center equipment by offering an innovative approach to traditional buffers. “The introduction of our new miSmartBuffer devices provide a competitive advantage to Microsemi’s robust clock management buffer portfolio and enhances our reach within the […]
Power-saving IP targets wireless apps in 55-nm IC technology
Faraday Technology Corporation, a leading ASIC design service and IP provider, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced the availability of Faraday’s PowerSlash™ fundamental IP on UMC’s 55nm ultra-low-power process (55ULP) technology. The combination of PowerSlash™ with UMC’s process technology, both engineered for very low-power wireless applications, is optimized to serve […]
HDK targets wearable market with RTOS, Bluetooth, GNSS support
MediaTek today announced the availability of the LinkIt™ 2523 Hardware Development Kit (HDK) for developers looking to create advanced wearable products. Based on the MediaTek MT2523G chipset, the HDK – produced by Silicon Application Corp (SAC) – offers dual-mode Bluetooth, comprehensive GNSS standards support and industry leading performance in terms of time-to-first-fix, accuracy and power consumption. […]
