MegaChips today introduced the eDSP™, a low-power, high-performance sensor processing platform that performs high-end arithmetic processing in real time at a fraction of the power compared to the microcontroller-based solutions on the market today. It meets customer needs for the highest flexibility in hardware design with right-sized horsepower to run their most computationally challenging algorithms […]
IoT
64-bit MCUs in 4 mm x 4 mm packages offer 256 KB Flash
The new PIC24 “GA7” family of microcontrollers (MCU) is now available from Microchip Technology Inc. As the lowest-cost 256 KB Flash memory 16-bit MCUs available today, these PIC24 devices enable extremely cost-effective designs for Internet of Things (IoT) sensor nodes, portable medical devices and industrial control applications. The PIC24 “GA7” family enables developers to cut […]
Multi-core processor SoC Integrates 24 ARM CortexTM-A53 cores on a single die
Socionext Inc., an emerging leader in SoC-based solutions for today’s computing needs, today introduced a new ARM®-based multi-core processor “SC2A11A”. The SoC Integrates 24 cores of ARM CortexTM-A53 on a single die, and provides optimum solution for growing applications such as data center servers for online service providers and edge computing in IoT (Internet of […]
Dual Ethernet SBCs feature Intel Atom Processor E3900 Series
WinSystems today announced a new line of single board computers with dual Ethernet that feature the Intel® Atom™ Processor E3900 Series for high-performance industrial IoT and other embedded systems. The leading manufacturer of industrial embedded computer modules designed its PX1-C415 SBCs to capitalize on the latest-generation PCle/104® OneBank® expansion to support rugged applications. Not only do they […]
Thread 1.1-Conforming Software for wireless SoCs and modules
Silicon Labs has announced the release of a conforming Thread mesh networking stack that has successfully passed testing based on the Thread 1.1 technical specification. Developers using the new Thread 1.1-conforming stack running on Silicon Labs’ wireless SoCs and wireless modules can submit their Thread-enabled products for conformance testing using Thread test resources to ensure conformance […]
Wireless development platform helps devise Wi-Fi, Bluetooth, and combo designs
Cypress Semiconductor Corp. today announced a new version of its development platform for the Internet of Things (IoT) that enables wireless connectivity in minutes. The Wireless Internet Connectivity for Embedded Devices (WICED®) Studio 4 platform provides a single development environment for multiple wireless technologies, including Cypress’s world-class Wi-Fi®, Bluetooth® and combo solutions, with an easy-to-use […]
Modules incorporate single-mode LTE Cat 1 modem, GNSS positioning engine for IoT/M2M devices
u-blox, a global leader in wireless and positioning modules and chips, today announced the LARA-R3121, a new module comprising a single-mode LTE Category 1 modem and a GNSS (Global Navigation Satellite System) positioning engine specifically designed for IoT and M2M devices. LTE modem, GNSS and module technology were all developed in-house at u-blox. The versatile LARA-R3121 […]
Ultra-low-power SoC development platform targets IoT applications
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced the Uranus™ 55nm ultra-low-power SoC development platform for IoT applications. As the latest member of its MCU-based SoC development platform series, UranusTM features Faraday’s PowerSlash™ IP, USB 2.0 interface, 12-bit 8-channel ADC, 10-bit DAC, embedded flash memory, and comprehensive SDK support, demonstrating the […]
Power-saving IP targets wireless apps in 55-nm IC technology
Faraday Technology Corporation, a leading ASIC design service and IP provider, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced the availability of Faraday’s PowerSlash™ fundamental IP on UMC’s 55nm ultra-low-power process (55ULP) technology. The combination of PowerSlash™ with UMC’s process technology, both engineered for very low-power wireless applications, is optimized to serve […]
Processor IP core streamlines design of cellular-enabled low data rate loT devices
CEVA introduced a new lightweight, multi-purpose, processor IP core to streamline the design of cellular-enabled low data rate industrial and consumer loT devices. The CEVA-X1 IoT processor deploys a single-core DSP+CPU architecture, specifically designed to address the severe size, power and cost limitations demanded for deploying the latest LTE Cat-M1 (formerly eMTC) and Cat-NB1 (formerly […]
