Synopsys, Inc. announced the new DesignWare ARC IoT Development Kit to accelerate software development and debug of ARC processor-based system-on-chip (SoC) designs. The ARC IoT Development Kit includes a silicon implementation of the ARC Data Fusion IP Subsystem as well as a rich set of peripherals commonly used in IoT designs such as USB, I3C and PWM. […]
Wearables
Color display module/touch interface ganged with Android operating system for WaRP7 development platform
Farnell element14, the Development Distributor, has introduced an integrated color display module with touch interface, along with the Android SDK (software development kit), for the WaRP7 development platform, which targets IoT and wearable applications. The WaRP7 LCD module incorporates a standard MIPI display with DSI (display serial interface) and I2C (inter-integrated circuit) interfaces and is […]
Low-energy PHY IP achieves Bluetooth 5 qualification
Synopsys, Inc. announced that the silicon-proven DesignWare Bluetooth Low Energy Link Layer IP and PHY IP in industry-standard 40-nanometer (nm) and 55-nm processes have achieved Bluetooth 5 qualification and have been declared compliant by the Bluetooth Special Interest Group. Achieving qualification ensures the robustness of the IP and that it functions as expected within a system-on-chip (SoC). […]
Low-power ARM MCUs carry up to 2 MB flash, 512 KB RAM
Silicon Labs has expanded its energy-friendly EFM32® Gecko portfolio with industrial-strength microcontrollers (MCUs) delivering higher performance, more features and lower power. The new EFM32GG11 Giant Gecko MCU family offers the most advanced feature set available in the low-power MCU market, targeting smart metering, asset tracking, industrial/building automation, wearables and personal medical applications. Giant Gecko MCUs combine […]
Dual-band Wi-Fi module supports 4k video streaming
Amp’ed RF Wireless Technology, an international provider of advanced IoT wireless modules, announces the availability of its WF61 module. A module specifically designed to make wireless streaming video supporting up to HD 4k imaging. As image processing technology improves, we’re seeing more connectivity bandwidth bottlenecks. Infrastructure needs to improve to support 4k imaging. The WF61 […]
Chips bring LTE categories M1 (eMTC) and NB1 (NB-IoT) connectivity to wearables
Qualcomm Incorporated announced at MWC Shanghai that its subsidiary, Qualcomm Technologies, Inc., is bringing LTE categories M1 (eMTC) and NB1 (NB-IoT) connectivity to the wearables industry with the launch of the new Qualcomm Snapdragon Wear 1200 platform. Snapdragon Wear 1200 takes advantage of the wide coverage provided by emerging LTE narrowband technologies, or LTE IoT, to help […]
Low-power 32-bit microcontrollers reduce run currrents by half
The latest PIC32 microcontroller family from Microchip Technology Inc. expands Microchip’s eXtreme Low Power (XLP) technology to 32-bit products. The PIC32MX1/2 XLP offers current PIC32MX customers an easy migration path to achieve higher performance at much lower power, enabling both increased functions and longer battery life in portable applications. The PIC32MX1/2 XLP family increases performance in […]
First 4×4 802.11n/ Bluetooth 5.0 SoC to sport dedicated Wi-Fi network accelerator
MediaTek Inc. today introduced the world’s first 4×4 802.11n and Bluetooth 5.0 system-on-chip featuring a dedicated Wi-Fi network accelerator. The MediaTek MT7622 was created for premium networking devices including routers and repeaters, whole home Wi-Fi, and home automation gateways that pre-integrates audio and storage features. With versatility at the core of its design, the MT7622 […]
Single-chip RF MCU incorporates sub-GHz radio in 5-mm package
The SAM R30 System in Package (SiP), a single-chip RF microcontroller (MCU), is now available from Microchip Technology Inc. (MCHP). The SAM R30 SiP incorporates an ultra-low power microcontroller with an 802.15.4 sub-GHz radio, providing multi-year battery life in a compact 5 mm package. The SAM R30 SiP delivers design flexibility and proven reliability all […]
FIPS 140-2 Level 3 compliant encryption implemented by STM reference design
STMicroelectronics and ClevX, an intellectual-property innovator and technology developer for portable storage and mobile device manufacturers, today announced the availability of a FIPS 140-2 Level 3 compliant Encryption Technology Platform reference design for security applications using commercial/industrial-, rather than military-grade chips. The STM32 microcontroller-based platform will aid designers and manufacturers to design and build highly […]
