• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Microcontroller Tips

Microcontroller engineering resources, new microcontroller products and electronics engineering news

  • Products
    • 8-bit
    • 16-bit
    • 32-bit
    • 64-bit
  • Applications
    • 5G
    • Automotive
    • Connectivity
    • Consumer Electronics
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Security
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Resources
    • Design Guide Library
    • LEAP Awards
    • Podcasts
    • White Papers
  • Videos
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

Die-to-die, electrical-to-optical IP speeds chiplet design

June 16, 2022 By Aimee Kalnoskas

Alphawave IP announced the availability of two new interconnect IPs to their product portfolio. AresCORE16 is a Die-to-Die parallel interface that enables a new generation of chiplet products. OptiCORE100 is a 112Gbps PAM4 optical Serialiser-Deserialiser (“SerDes”) that enables direct drive of optics and includes advanced DSP techniques for receiving optical waveforms.

Alphawave IP’s portfolio of connectivity IPs, including PCIe Gen6, CXL 3.0 and 800G Ethernet PHYs, are available for licensing and delivery now on TSMC N12, N7, N6, N5, N4 and N3 processes. Alphawave IP’s newest IP offerings, AresCORE16 and OptiCORE100 are available now for design starts on TSMC N5 and N4 processes.

You may also like:


  • Packaging options and advances for digital ICs

Filed Under: Applications, Telecommunications Tagged With: alphawaveip

Primary Sidebar

Featured Contributions

Edge AI without the guesswork: designing for real battery life, real performance, and real workloads

Designing for functional safety in robotics: key considerations for engineers

Can chiplets save the semiconductor supply chain?

Navigating the EU Cyber Resilience Act: a manufacturer’s perspective

The intelligent Edge: powering next-gen Edge AI applications

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Sensors
In this Tech Toolbox, we cover some of those technologies driving the next generation of connected systems, including ultra-low-power sensing strategies that extend node battery life, and 60 GHz CMOS radar for contactless health and presence detection.

EE Learning Center

EE Learning Center

EE ENGINEERING TRAINING DAYS

engineering
“bills
“microcontroller
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Footer

Microcontroller Tips

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

Microcontroller Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy