Alphawave Semi introduces the industry’s first 64 Gbps Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP Subsystem to deliver unprecedented chipset interconnect data rates, setting a new standard for ultra-high-performance D2D connectivity solutions in the industry. The third generation, 64 Gbps IP Subsystem builds on the successes of the most recent Gen2 36 Gbps IP […]
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Die-to-die, electrical-to-optical IP speeds chiplet design
Alphawave IP announced the availability of two new interconnect IPs to their product portfolio. AresCORE16 is a Die-to-Die parallel interface that enables a new generation of chiplet products. OptiCORE100 is a 112Gbps PAM4 optical Serialiser-Deserialiser (“SerDes”) that enables direct drive of optics and includes advanced DSP techniques for receiving optical waveforms. Alphawave IP’s portfolio of […]
