• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Microcontroller Tips

Microcontroller engineering resources, new microcontroller products and electronics engineering news

  • Products
    • 8-bit
    • 16-bit
    • 32-bit
    • 64-bit
  • Applications
    • 5G
    • Automotive
    • Connectivity
    • Consumer Electronics
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Security
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Resources
    • Design Guide Library
    • LEAP Awards
    • Podcasts
    • White Papers
  • Videos
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

Rugged 3U VITA SBC carries Kaby Lake processor upgrade

February 23, 2017 By Aimee Kalnoskas Leave a Comment

Abaco Systems today announced the SBC329 rugged 3U OpenVPX single board computer (SBC). It is designed as a straightforward, cost-effective ‘drop in’ technology insertion opportunity for existing users of Abaco’s mission ready systems and as a powerful, minimal SWaP solution for customers developing their own systems for demanding applications to be deployed in harsh, highly-constrained environments.

The SBC329 offers a ~10% performance improvement over its predecessors and, because it is based on Intel’s latest silicon, also delivers greater longevity – extending the life of deployed platforms. It is the third SBC from Abaco to feature the latest 7th generation Intel® Core® technology (codenamed “Kaby Lake”). Abaco had previously announced the XVB603 and XVR19 6U VME single board computers that also leverage the additional capability of Intel’s newest silicon.

The SBC329 is available in two variants, both pin-compatible with the SBC326 and SBC328. These provide mission ready systems customers with the flexibility to choose the most appropriate platform. For applications prioritizing throughput and performance, the SBC329 is configurable with the Intel Xeon E3-1505M V6 processor operating at 3.0GHz. For applications prioritizing minimal power consumption/heat dissipation, the Intel Xeon E3-1505L operating at 2.2GHz is available.

The SBC329 provides enhanced support for customers planning to implement advanced security capabilities such as anti-tamper and information assurance. This includes an inherently secure FPGA solution, and support for Intel’s Trusted Execution Technology.

It also benefits from its support for Abaco’s AXIS Advanced Multiprocessor Integrated Software development environment. AXIS enables the rapid creation and testing of sophisticated HPEC applications – reducing risk, cost and time-to-market.

“As our mission ready systems customers’ applications become increasingly demanding in terms of increased performance, every increment in processor capability can make an important difference,” said Mrinal Iyengar, VP, Product Management at Abaco Systems. “The SBC329 is the ideal response to those needs with its optimum combination of high throughput, minimal size, weight and power and Abaco’s industry-leading rugged reliability.”

The SBC329 supports a comprehensive range of on-board I/O features. It also offers an on-board mezzanine expansion site for enhanced system flexibility. Memory resources include 16 GB DDR4 SDRAM, up to 32 GB NAND Flash (SSD), 32 MB BIOS Flash and 16 MB BIOS backup Flash.

Filed Under: Applications, Industrial Tagged With: abacosystems

Reader Interactions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Primary Sidebar

Featured Contributions

Can chiplets save the semiconductor supply chain?

Navigating the EU Cyber Resilience Act: a manufacturer’s perspective

The intelligent Edge: powering next-gen Edge AI applications

Engineering harmony: solving the multiprotocol puzzle in IoT device design

What’s slowing down Edge AI? It’s not compute, it’s data movement

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Connectivity
AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

EE Learning Center

EE Learning Center

EE ENGINEERING TRAINING DAYS

engineering
“bills
“microcontroller
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Footer

Microcontroller Tips

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

Microcontroller Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy