The Tessent Multi-die software solution helps designers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

As demand for smaller, more power efficient and higher performing ICs continues to challenge the global IC design community, next-generation devices increasingly feature complex 2.5D and
3D architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so that they behave as a single device. However, these approaches can present significant challenges for IC test,
since most legacy IC test approaches are based on conventional two-dimensional processes.

To address these challenges, Siemens today introduces Tessent Multi-die software — the industry’s most comprehensive DFT automation solution for highly complex DFT tasks associated with 2.5D and 3D IC designs. The new solution works seamlessly with Siemens’ Tessent TestKompress Streaming Scan Network software and Tessent IJTAG software, which optimize DFT test resources for each block without concern for impacts to the rest of the design, thereby streamlining DFT planning and implementation for the 2.5D and 3D IC era.

Using Tessent Multi-die software, IC design teams can rapidly generate IEEE 1838-compliant hardware featuring 2.5D and 3D IC architectures.

“IC design organizations are seeing dramatic spikes in IC test complexity due to the rapid adoption and deployment of designs featuring densely packed dies in 2.5D and 3D devices,” said Ankur Gupta, vice president and general manager of the Tessent business unit for Siemens Digital Industries Software. “With Siemens’ new Tessent Multi-die solution, our customers can be ready for the designs of tomorrow, while slashing test implementation effort and simultaneously optimizing manufacturing test cost today.”

In addition to supporting comprehensive test for 2.5D and 3D IC designs, the Tessent Multi-die solution can generate die-to-die interconnect patterns and enable package level test using the
Boundary Scan Description Language (BSDL). Further, Tessent Multi-die supports integration of flexible parallel port (FPP) technology by leveraging the packetized data delivery capabilities of
Siemens’ Tessent TestKompress Streaming Scan Network software. Introduced two years ago, Tessent TestKompress Streaming Scan Network decouples core-level DFT requirements from the chip-level test delivery resources. This enables a no-compromise, bottom-up DFT flow that can dramatically simplify DFT planning and implementation, while reducing test time up to 4X.

Siemens Digital Industries Software, 200 Fifth Avenue, 5th floor, Waltham, MA 02451, fax +1 781 250 6801, Email info.plm@siemens.com, www.sw.siemens.com