Shanghai Huali Microelectronics Corporation (HLMC) and Cypress Semiconductor Corp.announced a new milestone for the combination of HLMC’s 55-nanometer low-power (LP) process technology and Cypress’ SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP). HLMC’s customers have started early production of low-power embedded Flash aimed at Bluetooth Low Energy and Internet of Things […]