Murata Manufacturing Co., Ltd. announced that it collaborated with Cypress Semiconductor Corp. to develop the Type 1LV (CYW43012) solution that is the lowest power, small form factor Wi-Fi and Bluetooth module. This product improves battery life in wearables, smart home products, and portable audio applications. When comparing Type 1LV (CYW43012) to the Type 1DX (CYW4343W), power usage in the previous is approximately 54 percent lower in DTIM 1, 60 percent in DTIM 3, up to 50 percent for 2.4 GHz RX, and 28 percent for 2.4 GHz TX.
Based on the Cypress CYW43012 combo chipset, the ultra-small dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly) +Bluetooth 5.0 module provides data transference rates up to 78Mbps on Wi-Fi and 3Mbps on Bluetooth. The Type 1LV supports a broad range of popular processors including PSoC6, i.MX RT, STM32, i.MX, and IP Camera platforms, as well as Linux and RTOS based applications.
The Type 1LV uses highly sophisticated and enhanced hardware mechanisms and algorithms to ensure that Wi-Fi and Bluetooth coexistence is optimized for maximum performance. An embedded Ipv6 network stack can be used to keep the host processor in sleep mode while maintaining network connections. The module also supports BLE 2Mbps, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The device operates seamlessly in dual-band networks with increased energy efficiency and enhanced security providing optimal performance in Wi-Fi 5 networks. The module size is 10.0mm(L) x 7.2mm(W) x 1.4mm(H). It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.