• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Microcontroller Tips

Microcontroller engineering resources, new microcontroller products and electronics engineering news

  • Products
    • 8-bit
    • 16-bit
    • 32-bit
    • 64-bit
  • Applications
    • 5G
    • Automotive
    • Connectivity
    • Consumer Electronics
    • EV Engineering
    • Industrial
    • IoT
    • Medical
    • Security
    • Telecommunications
    • Wearables
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Resources
    • Design Guide Library
    • LEAP Awards
    • Podcasts
    • White Papers
  • Videos
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

AI-on-module integrated NXP NPU, VPU, and GPU computing

March 18, 2021 By Redding Traiger Leave a Comment

ADLINK Technology Inc. has launched the LEC-IMX8MP SMARC module, the first SMARC rev. 2.1 AI-on-Module (AIoM) that uses NXP’s next-generation i.MX 8M Plus SoC for edge AI applications. The LEC-IMX8MP integrates NXP NPU, VPU, ISP, and GPU computing in a compact size for future-proof AI-based applications across industrial AIoT/ IoT, smart homes, smart cities, and beyond.

The powerful quad-core Arm Cortex-A53 processor runs up to 1.8 GHz with an integrated neural processing unit (NPU), delivering up to 2.3 Terra Operations Per Second (TOPS) for machine learning inference at the edge, suited for applications that require machine learning and vision systems paired with smart sensors to enable industrial decision-making.

The LEC-IMX8MP SMARC module features: LVDS/DSI/HDMI graphic output, dual CAN bus/USB 2.0/USB 3.0, dual GbE ports (one with TSN), and I2S audio interface – in a low power envelope that is typically below 6W; Rugged design can sustain operating temperatures of -40°C to +85°C, and high shock and vibration environments for reliability in harsh industrial applications; Standard BSP support for Debian, Yocto and Android, including MRAA hardware abstraction layer (HAL), allows engineers to substitute modules, sensor HATs and port code written in Raspberry Pi or Arduino environments to the I-Pi; NXP eIQ machine learning software with consecutive inference on CPU cores, GPU cores, and NPU; Support for Caffe, TensorFlow Lite, PyTorch and ONNX models; Enablement for models such as MobileNet SSD, DeepSpeech v1, and segmentation networks. Arm NN fully integrated into Yocto BSP, supporting i.MX 8

Delivering edge intelligence, machine learning, and vision for a smart world, the LEC-IMX8MP SMARC 2.1 module is an excellent platform for AI-based applications, removing cloud dependency and preserving individual privacy. Targeted uses include smart homes and home automation, smart cities, logistics, healthcare diagnostics, smart buildings, smart retail, and industrial IoT including machine vision, robotics, and factory automation.

A ready-to-run I-Pi SMARC prototyping platform based on the LEC-IMX8MP module can be ordered online at ADLINK’s I-Pi SMARC theme and support site.

You may also like:

  • FPGAs
    What are the application considerations when selecting FPGAs?
  • smart home devices
    Tips on designing smart home devices – Part 2
  • DDR SDRAM
    What is DDR (Double Data Rate) memory and SDRAM memory?

  • What is an SoC?

Filed Under: Artificial intelligence/ML, Industrial, IoT, Machine learning, Medical, Products, Robotics/Drones, Tools Tagged With: adlink

Reader Interactions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Primary Sidebar

Featured Contributions

Designing for functional safety in robotics: key considerations for engineers

Can chiplets save the semiconductor supply chain?

Navigating the EU Cyber Resilience Act: a manufacturer’s perspective

The intelligent Edge: powering next-gen Edge AI applications

Engineering harmony: solving the multiprotocol puzzle in IoT device design

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Electronic Design Automation
This Tech ToolBox helps to clear the path to faster time-to-market by digging into AI-enhanced design, hardware-assisted verification, parasitic extractions, PCB-to-harness integration, and more.

EE Learning Center

EE Learning Center

EE ENGINEERING TRAINING DAYS

engineering
“bills
“microcontroller
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Footer

Microcontroller Tips

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

Microcontroller Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy