element14, the development distributor, today announces exclusive global availability of the new BitScope Blade range, offering the ability to conveniently power and mount multiple Raspberry Pi’s. BitScope Blades are designed for building scalable computing solutions ranging from stand-alone servers, routers and workstations up to full compute clusters, private clouds, networked physical computing and Industrial IoT […]
Silicon Labs Acquires Wi-Fi Innovator Zentri
Silicon Labs, a leading supplier of silicon, software and solutions for a more connected world, announces the acquisition of Zentri , an innovator in low-power, cloud-connected Wi-Fi technologies for the Internet of Things (IoT). Zentri helps customers worldwide securely connect and manage their products across a wide range of industrial, commercial and consumer applications. Zentri’s unique combination […]
LTE Cat 1 embedded modems for simplified cellular integration into devices
Digi International, a leading global provider of machine-to-machine (M2M) and Internet of Things (IoT) connectivity products and services, today announced the general availability of Digi XBee Cellular. Newly developed for the North American market, this addition to the Digi XBee family of products will allow Original Equipment Manufacturers (OEM) to quickly and easily integrate LTE […]
Wireless MCUs help connect industrial, consumer and automotive applications
Delivering more available memory, Bluetooth® 5-ready hardware, automotive qualification and a new ultra-small wafer-chip-scale package (WCSP) option, Texas Instruments (TI) (NASDAQ: TXN) today announced two new devices in its scalable SimpleLink™ Bluetooth low energy wireless microcontroller (MCU) family. The new devices continue to feature advanced integration including a complete single-chip hardware and unified software solution […]
Raspberry Pi modules fit into DDR2 SODIMM connectors
Newark element14, the leading distributor and world’s largest manufacturer of the Raspberry Pi family of products and accessories, has announced the launch of 3 new products – Raspberry Pi Compute Module 3, Raspberry Pi Compute Module Lite and Raspberry Pi Compute Module Development kit. The Raspberry Pi Compute Module 3 (CM3) and Compute Module 3 […]
IC design software incorporates packaging technology for multi-chip, chip-DRAM integration apps
Mentor Graphics Corp. today announced that TSMC has extended its collaboration with Mentor Graphics on the Xpedition® Enterprise platform in conjunction with the Calibre® platform for the design and verification of TSMC’s InFO (Integrated Fan-Out) packaging technology for multi-chip and chip-DRAM integration applications. Mentor developed new Xpedition functionality specifically to support InFO and enable the […]
Bluetooth module includes antenna connections, SPI, Xtal for consumer/medical apps
Murata Americas today announced the release of its Nordic-based BLE module. The latest WSM device consists of Nordic Semiconductor’s nRF52832 IC, a 32 MHz crystal for timing, and an on-board antenna. Additionally, it contains two pins for an off-board omni-directional antenna and a NFC antenna. The module provides a Serial Port Interface (SPI) and UART interface to Nordic’s nRF52832 M4 Cortex processor. The WSM-BL241-ADA-008 module provides BLE connectivity between […]
End-to-end USB Type-C devices combine for fast charging
NXP Semiconductors N.V. introduced the industry’s best-in-class USB Type-C solution for rapid charging. The end-to-end solution is the smallest in the market, highly efficient, and includes unique rapid charging coupled with USB PD PHY for a fully compliant Type-C Port Controller (TCPC) implementation. NXP’s new offering makes it easier for manufacturers to integrate USB Type-C […]
New motherboards optimized for gaming, business apps
Super Micro Computer, Inc. , a global leader in compute, storage, and networking technologies and green computing is introducing an extensive range of next-generation desktop and gaming motherboards and solutions during CES 2017 in the Bellagio Hotel, Penthouse Suite 31063. Fueled by the latest 7th generation Intel® Core™ processor (formerly Kaby Lake) innovations, the new range of […]
Camera module & IC platform handle 3D real-time depth maps for VR, AR apps
Technology innovations spark an explosion of applications. Many emerging applications have recently have been built upon 3D depth detection technologies, such as Virtual Reality (VR) / Augmented Reality (AR), Drones, People / Object Counting, etc. The ability to detect objects and surrounding environments, 3D images, depth-map, gesture movements, obstacle avoidance, etc., are essential to the future […]