Microsemi Corporation today announced the availability of its Switchtec PFX PCIe switch, providing the industry’s highest density, lowest power PCIe switch for data center, communications, defense and industrial applications. Using simple hardware configuration and advanced diagnostics and debug capabilities, the PFX enables PCIe solutions for a wide variety of systems from scalable JBOFs (just a bunch of flash) to general purpose applications […]
SSD controllers integrate DDR4 DRAM on chip
Microsemi Corporation announced the production release of its Flashtec NVM Express (NVMe)2032 and NVMe2016 controllers, enabling the world’s leading enterprises and data centers to realize the highest performance solid state drives (SSDs) utilizing next-generation NAND technologies. Providing the highest capacity, performance and reliability to store critical data, the devices are the industry’s first SSD controllers to integrate DDR4 DRAM, alleviating bottlenecks […]
USBXpress controller simplifies USB connectivity for embedded designs
Silicon Labs has added a smaller, lower-power member to its family of USBXpress™ bridge devices, providing a simpler, faster way to add Universal Serial Bus (USB) connectivity to new and legacy embedded designs. Silicon Labs’ new CP2102N USB controller eliminates complex, time-consuming firmware development and provides advanced functionality in QFN packages as small as 3 […]
Top microcontroller threads on EDAboard.com – July
(editor’s note: Intrigued by the problem? Have a question or optional solution? Then click the “Read more” link and follow the conversation on EDAboard.com or log in to EDAboard and participate in the microcontroller forum thread.) Using a PIC to generate square wave sweep tones – I am trying to design a controller for a 12V […]
USB controllers work with latest Type-C specs
Fairchild announced that its FUSB302 family of USB Type-C controllers are the industry’s first to be compatible with the latest updates to the USB Type-C standard, including Power Delivery (PD) specification. This enables manufacturers using the FUSB302 to easily support all current and previous versions of the USB Type-C specifications in their products. The USB […]
PIC 16F and register banking explained
by Jon Wilder As some of you have noticed, the internal RAM in the PIC 16F appears to be arranged in “banks”. Each bank holds 128 RAM registers total. The first 128 RAM locations are in bank 0, the next 128 RAM locations are in bank 1, so on and so forth. But hold on…is […]
Demo platform speeds developments incorporating low-power BLE sensor nodes
Microchip Technology Inc. today released a demonstration platform for the world’s lowest-power Bluetooth Low Energy (BLE) sensor node. The platform comes complete with the award-winning ultra-low-power BTLC1000-certified module, a SMART SAM L21 Cortex®-M0+ MCU, Bosch sensor technology and a complete software solution. Low power, smaller form factor and quick time to market are critical factors to making the […]
Sensor-to-cloud dev kit accelerates IoT design
Silicon Labs has introduced a cost-effective prototyping vehicle that makes it easy to connect wireless sensor nodes to mobile devices and the cloud to help businesses make data-driven decisions. Silicon Labs’ new Thunderboard React developer kit features a battery-powered, sensor-rich demonstration board with Bluetooth® low energy technology and a powerful ARM®Cortex®-M4 processor for IoT connectivity, along […]
BLE chips pull just 3.6 mA in transmit mode
Toshiba America Electronic Components, Inc. (TAEC) today introduced three new integrated circuits (ICs) that support Bluetooth® Low Energy (LE)1 ver.4.1 communications for Bluetooth Smart devices2, including wearable electronics, sensors and high-end coin battery-powered devices. At 3V supply voltage, the TC35678FSG, TC35678FXG, and TC35679FSG consume just under half the power of previous Toshiba products3 – in […]
USB type-C chip layouts target 40-nm and 55-nm processes with reduced power and space requirements
Synopsys, Inc. today announced it has reduced the power and area of its DesignWare® USB 2.0 Type-C Controller and PHY IP for cost-sensitive and energy-efficient Internet of Things (IoT) edge applications targeting 40-nanometer (nm) and 55-nm ultra-low power processes. The IP cuts silicon area by up to 50 percent compared to competitive offerings, saving on average $0.03 per die. […]