As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth. Microchip Technology Inc. announced an expanded data center portfolio and its entrance into the memory infrastructure […]
Data centers
Beyond Moore’s Law: New solutions for beating the data growth curve
By Daniel Joseph Barry, VP Strategy and Market Development, Napatech Many of the latest innovations in cloud, enterprise, and telecom networks are predicated on the assumption that the power of server CPUs will continue to grow in line with Moore’s Law. This law predicts that the number of transistors per square inch will double every […]
Edge inference co-processor delivers high throughput for edge apps
Flex Logix Technologies, Inc. today announced that it has leveraged its core patent-protected interconnect technology from its embedded FPGA (eFPGA) line of business combined with inference-optimized nnMAX clusters to develop the InferXÔ X1 edge inference co-processor. Unveiled today in a presentation at the Linley Processor Conference in Santa Clara, the Flex Logix InferX X1 chip […]
Servers, motherboards support 2nd-gen Intel Xeon Scalable processors
TYAN announces support for 2nd generation Intel Xeon Scalable processors. TYAN’s full line of HPC, cloud computing and storage server platforms offer advanced performance and hardware-enhanced security to enterprises, cloud and hyperscale data centers. TYAN 2nd Generation Intel Xeon Scalable Processor-based Platforms to Deliver Amazing Performance for AI, HPC and Cloud Infrastructure. Powered by the […]
Server, storage systems host Intel 2nd-gen Xeon Scalable processors
Super Micro Computer, Inc. (SMCI) today announced fully optimized support for 2nd Generation Intel Xeon Scalable processors on its entire portfolio of X11 servers, storage systems and Server Building Block Solutions. Supermicro has optimized its entire X11 portfolio to fully leverage the performance advantages of the new 2nd Gen Intel Xeon Scalable processors (formerly codenamed […]
Low-profile SSDs target cloud data center uses
Toshiba Memory America, Inc. the U.S.-based subsidiary of Toshiba Memory Corporation, announced the availability of its XD5 Series NVMe SSD platform in a 2.5-inch1, 7mm low-profile form factor that is optimized for low-latency and performance consistency in read-intensive workloads. Developed for both data center and cloud environments, the new 2.5-inch form factor XD5 Series is […]
Expandable System on Module for applications with high data and network throughputs
Axiomtek has introduced the CEM700, its new COM Express Type 7 module. The high-performance CEM700 offers scalable processor options with the 16-core Intel Xeon D-1577 processor or the 4-core Intel Pentium D1519 processor. This compact form factor measures 125 x 95 mm, and is feature-rich and highly expandable. The CEM700 is designed for integration into space-constrained applications with high data […]
1 TB single-package PCIe Gen3 x4L SSDs sport 96-layer 3D Flash memory
Toshiba Memory America, Inc. will introduce the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) product line: the BG4 series. Toshiba Memory’s new lineup of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server […]
CPU server chipset improves upon ARMV8 processor
Huawei has announced the industry’s highest-performance Advanced RISC Machine (ARM)-based CPU. Called Kunpeng 920, the new CPU is designed to boost the development of computing in big data, distributed storage, and ARM native application scenarios. Huawei will join with industry players to advance the ARM industry and foster an open, collaborative, and win-win ecosystem. Kunpeng […]
Fastest wide temp DDR4 memory keys on edge apps
Innodisk is releasing the newest ruggedized DDR4 2666 Wide Temperature DRAM series which is focusing on tough conditions of edge applications. “DDR4 2666 will eventually become the standard specification on the market,” says Samson Chang, Innodisk’s Global VP of DRAM, “With this move, we have already secured a good position to supply the current and future IoT and […]
