Embedded memory FPGAs highlight low power and small package size

GOWIN Semiconductor Corp. announces 2 new additions to the current families of embedded memory FPGA devices, the GW1NR-LV4MG81 and GW1NSR-LX2CQN48.  As computing functions are being distributed to edge locations, the need for silicon to adapt to these new uses is becoming prevalent.  The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind.

Adopting an edge to cloud infrastructure is challenging.  Each portion of the chain has its own unique characteristics in design.  For the edge, size of sensor or data gatherer affects product real estate; power consumption affects the power source, especially battery life.  The new embedded memory FPGA devices solve these issues by enhancing the integration of multiple devices into a nice, single package device.

“GOWIN’s vision has always been one of developing new products for customer’s needs,” said Jason Zhu, CEO of GOWIN Semiconductor.  “We saw a lack of product integration at the edge and aimed to fix this with easy to use solutions at cost-effective price points.”

The GW1NR-LV4MG81 is a 4K LUT FPGA fabric with 64Mb internal high-speed memory.  The package size is ultra-small, 4.5mm x 4.5 mm PBGA and .83mm thick.  A great logic device for applications where the thickness is an issue.  Power consumption has been optimized to the lowest possible using TSMC’s 55nm LP process.  And up to 69 user IO’s are available supporting GOWIN’s flexible IO structures.

In a 5mm x 5mm QFN package, the GW1NSR-LX2CQN48 is GOWIN’s first device that combines a 2K LUT FPGA fabric with 32Mb internal high-speed memory and an Arm Cortex M3 microprocessor.  With additional user programmable flash, internal SRAM, ADC, and both USB2.0 and MIPI D-PHY interfaces, this makes the GW1NSR-LX2CQN48 a true SoC to solve low power requirements at the edge and elsewhere.

GOWIN offers a complete all-in-one toolchain for both FPGA fabric programming and Cortex M3 programming.  In addition, a complete library of IP cores and reference designs are available to assist in developing platform solutions.  All of these resources are available for download on GOWIN’s website, www.gowinsemi.com.