TDK Corporation announces an expansion of its ultra-low noise MEMS microphone family with the ICS-40740, delivering 70 dB (A) SNR with 133 dB sound pressure level Acoustic Overload Point. The low self-noise coupled with wide dynamic range makes the ICS-40740 ideal for voice controlled IoT applications, especially those with integrated loudspeakers, as well as wearable applications like noise canceling headsets.
A microphone’s Signal to Noise Ratio (SNR) has long been recognized as a key specification to enable far-field voice capture. But as the smart speaker market has shown, the capability of these microphones to operate in a very loud environment is also critical to enable the user to interrupt loud audio with spoken commands. The ICS-40740 performs in both demanding respects.
Beyond simple SNR and dynamic range, the ICS-40740 performs across a very wide frequency band, from 80 Hz to 20 kHz. The sensitivity tolerance of ±1 dB also makes it ideal for use in an array with very consistent performance from unit to unit.
Wearable noise-canceling applications are also a fit for the ICS-40740. With a 4 mm by 3 mm by 1.2 mm package and consuming only 155 uA in operation, the ICS-40740 fits both the size and power budget of a noise-canceling headset.
The ICS-40740 is sampling now to select customers and is slated for production in the second quarter of 2018. The ICS-40740 leverages a proven, robust supply chain for fabrication, packaging and test for smooth launch into high volume consumer applications.
TDK Corporation and its group companies EPCOS, InvenSense, and TDK-Micronas will be showcasing the ICS-40740 MEMS microphone and additional innovative sensor solutions in Booth 30325, South Hall 3 of the Las Vegas Convention Center at CES® 2018, January 9-12
More information: www.invensense.com; InvenSense Sales at sa…@invensense.com. , Las Vegas, Nevada, USA.
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