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rohde&schwarz

EE World’s 2023 communications handbook is here

May 22, 2023 By Martin Rowe

Our 2023 5G, Wired, & Wireless Handbook is now available in ebook form. Download your copy today. It started on a cold January day with an editorial call. A month later, the abstracts came in. After another month, the manuscripts came in. Then came the editing and some back-and-forth with the authors. Next, it was…

Filed Under: Digital Edition Back Issue Tagged With: Achronix, keysighttechnologies, littelfuse, microchip, molex, rohde&schwarz, SiTime, teradyne, TMYTEK

Our second 5G Handbook is now available

May 18, 2022 By Martin Rowe

Featuring 15 articles, the 2022 5G Handbook looks at private networks, timing, connectivity, latency, mmWaves, test, and other topics.

Filed Under: Digital Edition Back Issue Tagged With: Benetel, CEVAdsp, Green Cubes, imec, keysighttechnologies, microchip, molex, National Instruments, Parallel Wireless, Rakuten Symphony, rohde&schwarz, SiTime, teradyne

Measurements show 5G improves latency in public networks

April 11, 2022 By Martin Rowe

Measurements on public networks at our facilities demonstrate how 5G’s lower latency compared to LTE can improve industrial applications.

Filed Under: Digital Edition Back Issue Tagged With: rohde&schwarz

DSS lets 5G and LTE share spectrum

May 10, 2021 By Martin Rowe

Dynamic spectrum sharing of 5G and LTE networks addresses the need for spectrum, particularly at mid-band frequencies. Here’s how it works.

Filed Under: Digital Edition Back Issue Tagged With: rohde&schwarz

Autotalks validates C-V2X chipsets using Rohde & Schwartz equipment

December 13, 2018 By Aimee Kalnoskas Leave a Comment

C-V2X chipsets

Autotalks and Rohde & Schwarz announced that the validation of the first-ever global C-V2X chipsets. Announced last September, Autotalks’ deployment-ready, second-generation V2X chipset is the only available solution capable of supporting both DSRC and C-V2X (also known as LTE-V2X or LTE-V) direct communications (PC5 protocol) at the highest security level. The chipset supports DSRC based on 802.11p/ITS-G5 […]

Filed Under: Applications, Automotive, microcontroller Tagged With: autotalks, rohde&schwarz

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AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

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