Linx Technologies has introduced the Splatch SP610 surface-mount embedded antenna for LTE cellular applications, including LTE-M (Cat-M1) and NB-IoT cellular Internet of Things (IoT) uses. Measuring a compact 10 mm by 40 mm and just 2.8 mm high, the surface-mount SP610 antenna achieves exceptional performance in the more challenging 700 MHz bands as well as […]
Tiny RGB projector handles AR/VR display tasks
ColorChip introduces a highly innovative, ultra-compact, efficient RGB Pico-Projector based on a patented PLC SystemOnGlass (SOG) platform, advancing the core-technology eco-system required for Tethered and Standalone AR/VR SmartGlasses, where stringent demands on power efficiency and compactness are paramount. The Augmented and Virtual reality market (AR/VR) is poised to pass a potential market inflection point in […]
MCU-based system handles offline face recognition/expression ID
NXP Semiconductors N.V. unveiled today the world’s first microcontroller (MCU) -based solution for adding offline face and expression recognition capabilities to smart home, commercial and industrial devices. Built on NXP’s latest crossover MCU, the i.MX RT106F, running FreeRTOS, the new MCU-based face recognition solution enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively incorporate […]
RFSoC dev kit for antenna to digital wireless design
Avnet announced the availability of the Avnet RFSoC Development Kit using the Zynq UltraScale+ from Xilinx, Inc., enabling system architects to explore the entire signal chain from antenna to digital. Using MATLAB and Simulink from MathWorks, and RF components from Qorvo, the kit enables users to quickly deploy systems for 5G wireless communication, including for […]
Reusable solderless robotics kit allows students to build embedded systems
Texas Instruments introduced the newest addition to the TI Robotics System Learning Kit (TI-RSLK) family, the TI-RSLK MAX, a low-cost robotics kit and curriculum that is simple to build, code and test. Designed for the university classroom, the solderless assembly allows students to have their own fully functioning embedded system built in under 15 minutes. […]
Enhanced GNSS constellation simulator helps field satellite navigation systems
Spirent Communications plc announced the launch of its enhanced GSS9000 Series GNSS constellation simulator. Providing significantly-improved capability, flexibility and performance, the GSS9000 Series has been updated to meet the ever-more-demanding test needs of high-performance satellite navigation systems. Spirent already leads the market in multi-frequency, multi-GNSS RF constellation simulators, and the enhanced GSS9000 Series’ enriched features […]
WPC Ki cordless kitchen standard addresses interoperable, safe kitchen appliances
The Wireless Power Consortium (WPC) revealed the name and logo of its wireless power standard for kitchen appliances. The Ki (pronounced “key”) Cordless Kitchen standard is represented by a logo that will distinguish standard-compliant products such as rice cookers, toasters, blenders, coffee makers, air fryers, and more. The Ki Cordless Kitchen logo and mark represent safety […]
Triple redundant IMU assists in developing navigation and localization for autonomous vehicles
Acienna announced the new ACEINNA OpenIMU330B, a MEMS-based, small form factor high-performance 6-DOF inertial measurement unit that enables autonomous vehicles to accurately stay on track during turns and complicated maneuvers. Measuring only 11mm x 15mm x 3mm, the ACEINNA OpenIMU330B is designed for use in automotive ADAS and autonomous systems as well as for electronic […]
Failsafe exFAT file system guards against data loss
HCC Embedded (HCC) has introduced SafeexFAT, its failsafe, RTOS-independent exFAT file system implementation that provides easy integration for device manufacturers who demand the utmost in storage reliability for their deeply embedded applications. This is particularly important for manufacturers of devices where loss of data could be detrimental, such as in automotive, industrial, and medical applications. HCC […]
Flash CMOS image sensors tailored for 3D laser profiling/displacement apps
Teledyne e2v announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high-resolution inspection. The new Flash sensors feature a 6μm CMOS global shutter pixel which effectively combines high resolution and fast frame rate. They are available in a 4k or 2k horizontal resolution, with respective frame rates […]