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Maddie Lippert

Chip design IP now works with 7-nm Leading-Performance (7LP) FinFET process

June 21, 2017 By Maddie Lippert Leave a Comment

Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology. Synopsys and GF collaboration on the new process addressed several new challenges specific to the 7LP process. This process is expected to deliver 40 percent more processing power and twice the area scaling […]

Filed Under: Applications, Connectivity, Consumer Electronics, Data centers, microcontroller Tagged With: synopsys

Platform boosts I/O performance with Intel Omni-Path fabric for dense HPC

June 20, 2017 By Maddie Lippert Leave a Comment

Super Micro Computer, Inc., a global leader in compute, storage and networking technologies including green computing, delivers the Intel Omni-Path Architecture (Intel OPA) in the new generation, high-performance, X11 8U/4U SuperBlade systems supporting the upcoming Intel Xeo Processor Scalable Family (codenamed Skylake). The X11 SuperBlade is a density and performance optimized solution for high performance and Artificial […]

Filed Under: Data centers Tagged With: supermicrocomputerinc

GPU accelerator supports AI applications

June 20, 2017 By Maddie Lippert Leave a Comment

Inspur unveiled GX4, a new flexible and high scalability AI accelerating box at ISC 2017. The GX4 is able to achieve the decoupling coprocessor resources including CPU and GPU, Xeon Phi and FPGA, expand the computing power on demand, and provide highly flexible support to various AI applications in GPU-accelerated computing. This is another innovative effort […]

Filed Under: Data centers Tagged With: Inspur

Tips book for makers includes Raspberry Pi, BeagleBoard ideas

June 20, 2017 By Maddie Lippert Leave a Comment

Premier Farnell, The Development Distributor, has launched a new ‘Tips Book for Makers’, following the success of its ‘Essential Design Tips for Engineers’ series. The element14 community provides support and inspiration through a combination of articles, design challenges, roadtests and the power of close to half a million global members with their combined experienced and […]

Filed Under: Single Board Computers, Tools Tagged With: premierfarnell

Low-power 32-bit microcontrollers reduce run currrents by half

June 20, 2017 By Maddie Lippert Leave a Comment

Cryptography-enabled MCU

The latest PIC32 microcontroller family from Microchip Technology Inc. expands Microchip’s eXtreme Low Power (XLP) technology to 32-bit products. The PIC32MX1/2 XLP offers current PIC32MX customers an easy migration path to achieve higher performance at much lower power, enabling both increased functions and longer battery life in portable applications. The PIC32MX1/2 XLP family increases performance in […]

Filed Under: Wearables Tagged With: microchiptechnology

ARM design environment aids development of mixed-signal IoT designs

June 20, 2017 By Maddie Lippert Leave a Comment

Cadence Design Systems, Inc. today announced expanded support for the enhanced ARM® DesignStart™ program, including the newly added ARM Cortex®-M3 processor and the ARM CoreLink™ SDK-100 System Design Kit, which includes the fully verified CoreLink SSE-050 subsystem, enabling engineers to further accelerate the delivery of mixed-signal internet of things (IoT) designs. The Cadence® Hosted Design Solutions (HDS) design environment […]

Filed Under: IoT Tagged With: cadence

World’s smallest common-mode choke targets automotive Ethernet apps

June 20, 2017 By Maddie Lippert Leave a Comment

TDK Corporation presents the ACT1210L common-mode choke – the world’s smallest of its type for automotive Ethernet applications. Its dimensions are just 3.2 mm x 2.5 mm x 2.5 mm, making it just half the size of the existing ACT45L choke which measures in at 4.5 mm x 3.2 mm x 2.8 mm. Series production […]

Filed Under: Automotive Tagged With: tdkcorporation

Verification IP, source-code test suite works with ARM AMBA 5 Coherent Hub Interface Issue B

June 20, 2017 By Maddie Lippert Leave a Comment

Synopsys, Inc. today announced the availability of its Verification IP (VIP) and source code test suite for ARM® AMBA® 5 Coherent Hub Interface (CHI) Issue B. Synopsys VC VIP for AMBA CHI has been widely adopted by SoC leaders for successful verification closure and tape out of coherent subsystems and interconnects. Synopsys VIP for the latest AMBA CHI Issue B specification enables […]

Filed Under: Data centers Tagged With: synopsys

New embARC open software platform enhancements support ARC HS processors, ARC SecureShield features

June 9, 2017 By Maddie Lippert Leave a Comment

Synopsys, Inc. announced the expansion of the embARC open source initiative to include a more comprehensive set of open source projects that help accelerate software development for DesignWare ARC processors. In addition, Synopsys has released a new version of the embARC Open Software Platform (OSP) that extends support to ARC HS processors as well as to the latest […]

Filed Under: IoT, Tools Tagged With: synopsys

FPGAs include SRAM physical unclonable function for high security

June 2, 2017 By Maddie Lippert Leave a Comment

Microsemi Corporation today announced Intrinsic ID’s static random-access memory (SRAM) physical unclonable function (SRAM PUF) is included in Microsemi’s new PolarFire field programmable gate arrays (FPGAs). QUIDDIKEY-FLEX is a state-of-the-art high-security key generation and storage mechanism offering advanced security features based on SRAM PUF. The SRAM PUF hardware serves as a primary element in the security of Microsemi’s PolarFire […]

Filed Under: FPGA, Security Tagged With: microsemicorporation

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