Wirepas and Silicon Labs today announced they have joined forces to deliver a combined hardware and software solution that unleashes the potential of multiprotocol connectivity for mesh networks. Building on their growing relationship and success in the smart metering market, Wirepas and Silicon Labs have collaborated to create an industry first: a truly concurrent multiprotocol switching solution with one ERF32 […]
New Standard Interface for Advanced SPICE capabilities handles complex physics for digital, RF designs
The Silicon Integration Initiative Compact Model Coalition has released the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions. OMI allows circuit designers to simulate and analyze such important physical effects as self-heating and aging, and perform extended design optimizations. It is based on TMI2, the TSMC Model Interface, which […]
Twelve-inch color E-paper display includes integrated controller electronics
Pervasive Displays (PDi) today announced the launch of a new high resolution three color 12-inch Electronic Paper Display (EPD) module featuring an internal timing controller (iTC), the E2B98FS081. ( http://www.pervasivedisplays.com/products/122 ) The energy efficient, multi-colored display is a good fit for retail ESL (electronic shelf labeling), Point of Sale, office automation, and healthcare market applications. “These new […]
SoCs handle camera processing, machine learning for IoT apps
Qualcomm Incorporated through its subsidiary, Qualcomm Technologies, Inc., today announced the Qualcomm Vision Intelligence Platform, featuring the Company’s first family of system-on-chips (SoCs) purpose-built for the Internet of Things (IoT) using advanced 10nm FinFET process technology. The QCS605 and QCS603 SoCs are engineered to deliver powerful computing for on-device camera processing and machine learning, with exceptional power and thermal efficiency, […]
Integrated RF + Linux module simplifies wireless product development
Epiq Solutions, an engineering company dedicated to developing flexible radio modules and wireless sensing solutions, has introduced Sidekiq Z2, an industrial grade highly integrated wideband RF transceiver plus Linux computer on a tiny module measuring just 30mm x 51mm x 5mm. Sidekiq Z2 radically simplifies the typical RF product development cycle, allowing engineering teams to focus their […]
DSP-based ASICs now in 7-nm FinFET technology
MediaTek announced a new addition to its ASIC lineup with a 56G SerDes IP chip available with silicon-proven 7nm FinFET process technology. MediaTek’s 56G SerDes is a high-performance DSP-based solution with PAM4 signaling. Altogether, it demonstrates best-in-class power efficiency, performance and die-area. By developing 7nm and 16nm silicon-proven IP it can integrate easily into cutting-edge […]
Emulation platform handles up to 1.25 billion gates for data center designs
Mentor, a Siemens business, today introduced the Veloce® StratoT, which expands the footprint choices and configuration options available from its Veloce Strato™ emulation platform family. The Veloce Strato platform is a third-generation, data-center friendly emulation platform, and the only emulation platform on the market with full scalability across both software and hardware. In addition, the […]
Sensor options expand for extreme low-level light imaging
ON Semiconductor has announced the latest additions to its portfolio of Interline Transfer Electron Multiplying CCD (IT‑EMCCD) image sensors that target extreme low-light applications such as medical and scientific imaging, as well as commercial and military applications for high-end surveillance. The new KAE-08152 shares the same 8.8-megapixel resolution and 4/3 optical format as the existing KAE-08151, but incorporates an enhanced pixel […]
Chipsets speed development of data center SSD projects
Marvell today announced that it is launching innovative NVM Express (NVMe)-based chipset solutions that will accelerate the time to market for application-optimized data center SSD implementations. These new, highly-versatile building blocks can optimally address current and emerging workload storage requirements, spanning capacity, latency, performance, power and cost, to enable tailored SSD solutions for specific cloud and […]
LTE Tracker platform connects and locates objects
Sequans Communications S.A. and STMicroelectronics today introduced CLOE, a new LTE-connected tracker platform based on the integration of Sequans and ST technologies. An acronym of Connecting and Locating Objects Everywhere, CLOE combines the Internet-of-Things (IoT) technologies of two industry leaders into one comprehensive platform that simplifies the development of LTE-based IoT tracker devices for the […]
