Cypress Semiconductor Corp. today announced a new addition to its Traveo™ automotive microcontroller (MCU) family with more memory for program code and graphics to support hybrid instrument cluster applications. The new, highly integrated devices in the S6J32xE series provide a single-chip solution that can drive graphics on head-up displays or traditional gauges, but also provides […]
Automotive
COTS hardware-in-the-loop simulators target auto and aerospace apps
NI, the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, today announced turnkey HIL Simulators built on an open, modular architecture to help automotive and aerospace embedded software testers maintain quality while handling the demands of shortened schedules, constantly changing test requirements and reduced manpower. NI systems […]
FPGA card supports camera/image processing development efforts
Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new imaging/video solution for the development of low power and reliable video processing applications. The new platform is comprised of a field programmable gate array (FPGA) mezzanine card (FMC), a comprehensive intellectual property (IP) suite and […]
Self-refresh 64 Mb DRAMs use HyperBus interface
Cypress Semiconductor Corp. today announced sampling of a new high-speed, self-refresh Dynamic RAM (DRAM) based on Cypress’s low-pin-count HyperBus™ interface. The 64Mb HyperRAM™ serves as an expanded scratchpad memory for rendering of high-resolution graphics or calculations of data-intensive firmware algorithms in a wide array of automotive, industrial and consumer applications. The devices operate with a […]
Reference platform speeds
connected car development efforts
Qualcomm through its subsidiary, Qualcomm Technologies, announced the Qualcomm Connected Car Reference Platform aimed at accelerating the adoption of advanced and complex connectivity into the next-generation of connected cars. As a developer in automotive connectivity with more than 340 million chips shipped so far for products for over 20 automakers, Qualcomm Technologies developed a product designed […]
1-Gbit DDR3 RAMs carry ECC
Integrated Silicon Solution, a developer of advanced memory solutions, announced it has begun sampling production units of its new 1-gigabit (1Gbit) DDR3 DRAMs with ECC. The new product has an embedded Error Correcting Code (ECC), which detects and corrects bit errors on-the-fly. It requires no monitoring, nor intervention to use, yet it is backward compatible with […]
Dual-band Wi-Fi chip consumes little power
Qualcomm announced at COMPUTEX 2016 that its subsidiary, Qualcomm Technologies, is extending its flagship QCA401x connectivity solutions with a new product. The new QCA4012 chip brings dual band Wi-Fi, enhanced security, low power and a small size at a price point that best supports the development of connected devices. Qualcomm Technologies also announced the expansion […]
NOR flash chips work over automotive temperature range
Microchip Technology Inc. has announced the introduction of automotive-grade NOR Flash products with wider voltage and a larger temperature range. With the SST26VF SQI product family, Microchip becomes the only vendor in the industry to offer an extended-voltage Serial Quad I/O Flash device in automotive temperature grades. The new family of products, available in densities […]
Development platform handles AVB switching for auto Ethernet apps
Marvell (NASDAQ: MRVL) has announced a new automotive Ethernet reference platform integrated with TE Connectivity’s (TE) MATEnet modular and scalable connector for automotive Ethernet. Marvell’s new development platform supports audio video bridging (AVB) switching solutions with 100BASE-T1 and 1000BASE-T1 Ethernet physical layer (PHY) capability. The platform also enables car manufacturers to quickly prototype automotive systems […]
FoMoCo to field next-gen infotainment systems using Automotive Audio Bus
Analog Devices, Inc. (NASDAQ: ADI) announced today that the Ford Motor Company has selected the Automotive Audio Bus (A2B) as its primary infotainment network technology with in-vehicle deployments starting in 2016. ADI’s A2B technology is capable of distributing audio and control data together with clock and power over a single, unshielded twisted-pair wire, enabling advanced, […]