Fischer Connectors, a worldwide manufacturer in push-pull circular connectors and cable assembly solutions, launched the USB 3.0 version of its ultra-portable, miniature, lightweight and extremely tough Fischer Rugged Flash Drive. This memory stick has been specially designed for the safe transportation and storage of sensitive data in harsh environments. The USB 3.0 Fischer Rugged Flash Drive is […]
Connectivity
Reference platform speeds
connected car development efforts
Qualcomm through its subsidiary, Qualcomm Technologies, announced the Qualcomm Connected Car Reference Platform aimed at accelerating the adoption of advanced and complex connectivity into the next-generation of connected cars. As a developer in automotive connectivity with more than 340 million chips shipped so far for products for over 20 automakers, Qualcomm Technologies developed a product designed […]
SoC development environment cuts compilation time,
adds system-level profiling tools
Xilinx announced the 2016.1 release of the SDSoC development environment, enabling software defined programming for the Zynq family of SoCs and multi-processing (MP) SoCs using C and C++ languages. The new release includes support for the recently introduced 16 nm Zynq UltraScale+MPSoC. Additionally, this release enables a significant leap in productivity through system level profiling […]
World’s First WiGig USB Dongle
Peraso Technologies, a developer of Wireless Gigabit (WiGig) chipsets, announced the company will be demonstrating interoperability between its USB dongle reference design and a WiGig wireless AP. As several AP suppliers had announced products at CES 2016, it is critical for the WiGig ecosystem that consumers be able to enable legacy equipment into the WiGig ecosystem. […]
Chipset delivers 1 Gbps broadband over existing phone lines
Qualcomm announced at COMPUTEX 2016 that its subsidiary, Qualcomm Technologies, introduced end-to-end GigaDSL products that enable broadband operators to seamlessly transition deployments from VDSL to Gigabit access technologies. Designed to meet the requirements for the migration for existing VDSL by operators, especially in Korea and Japan, the new QCO5700 for multiple dwelling units (MDU) and […]
Ri-radio 802.11ac platforms boost Wi-Fi signals
Qualcomm announced at COMPUTEX 2016, that its subsidiary, Qualcomm Technologies, launched a new family of tri-radio 802.11ac platforms designed to boost the capacity of home networks and optimize its usage to deliver better consumer Wi-Fi experiences. The new platforms are designed to bring premium Wi-Fi features, like Multi-User MIMO (MU-MIMO) and Qualcomm Wi-Fi SON (Self-Organizing […]
Dual-band Wi-Fi chip consumes little power
Qualcomm announced at COMPUTEX 2016 that its subsidiary, Qualcomm Technologies, is extending its flagship QCA401x connectivity solutions with a new product. The new QCA4012 chip brings dual band Wi-Fi, enhanced security, low power and a small size at a price point that best supports the development of connected devices. Qualcomm Technologies also announced the expansion […]
Industrial IoT Starter Kit Streamlines
Smart Device and Cloud Development
Avnet, a global technology distributor, introduced the Avnet MicroZed Industrial IoT Starter Kit, an out-of-the-box system, backed by industry solutions from IBM, Wind River and Xilinx, designed to simplify customers’ prototype and development efforts, while providing an easy and quick transition to production. The MicroZed Industrial IoT Starter Kit builds on Avnet’s commitment to support […]
3U OpenVPX backplanes handle 10.3 Gbaud,
support PCIe Gen 3 and 10 GbE
Dawn VME Products, a designer and manufacturer of high-performance and reliable embedded-packaging technology products based on the VITATM and PICMG architectures, announces its newly released VPX-598x Series Gen3 3U OpenVPX Backplanes. Dawn’s Gen3 3U OpenVPX backplanes are designed for true signal integrity at up to 10.3 Gbaud performance (per VITA 68 backplane simulation models). Supporting […]
Software accelerates FPGA performance
via compile time improvements, IP integration
Altera, now part of Intel, announced the production release of the new Quartus Prime Pro design software, which further accelerates FPGA design performance and design team productivity. The Quartus Prime Pro software is architected to support the next generation of high capacity, highly integrated FPGAs from Intel, which will drive innovation across the cloud, data […]
