Fairchild announced that its FUSB302 family of USB Type-C controllers are the industry’s first to be compatible with the latest updates to the USB Type-C standard, including Power Delivery (PD) specification. This enables manufacturers using the FUSB302 to easily support all current and previous versions of the USB Type-C specifications in their products. The USB […]
Consumer Electronics
BLE chips pull just 3.6 mA in transmit mode
Toshiba America Electronic Components, Inc. (TAEC) today introduced three new integrated circuits (ICs) that support Bluetooth® Low Energy (LE)1 ver.4.1 communications for Bluetooth Smart devices2, including wearable electronics, sensors and high-end coin battery-powered devices. At 3V supply voltage, the TC35678FSG, TC35678FXG, and TC35679FSG consume just under half the power of previous Toshiba products3 – in […]
USB type-C chip layouts target 40-nm and 55-nm processes with reduced power and space requirements
Synopsys, Inc. today announced it has reduced the power and area of its DesignWare® USB 2.0 Type-C Controller and PHY IP for cost-sensitive and energy-efficient Internet of Things (IoT) edge applications targeting 40-nanometer (nm) and 55-nm ultra-low power processes. The IP cuts silicon area by up to 50 percent compared to competitive offerings, saving on average $0.03 per die. […]
Dual-mode BLE SoCs bring wireless streaming to speakers, headsets and gaming headphones
Microchip Technology Inc. today announces the next generation of dual-mode Bluetooth® audio products. The IS206X family builds on Microchip’s successful IS202X portfolio of highly integrated system-on-a-chip (SoC) devices and modules by introducing Bluetooth Low Energy (BLE) capability. Uniquely engineered for speakers, headsets and gaming headphones, this Flash-based platform offers ample flexibility and powerful design features, allowing audio manufacturers […]
Self-refresh 64 Mb DRAMs use HyperBus interface
Cypress Semiconductor Corp. today announced sampling of a new high-speed, self-refresh Dynamic RAM (DRAM) based on Cypress’s low-pin-count HyperBus™ interface. The 64Mb HyperRAM™ serves as an expanded scratchpad memory for rendering of high-resolution graphics or calculations of data-intensive firmware algorithms in a wide array of automotive, industrial and consumer applications. The devices operate with a […]
Reference design speeds development of digital headsets
Cirrus Logic has announced the availability of its MFi Headset Development Kit, a reference platform that is designed to help OEMs quickly develop new Lightning®-based digital headsets. “New digital connectivity in mobile devices, including the Lightning-based interface, is creating opportunities for OEMs to innovate in product design and is accelerating the transition from analog- to […]
Miniature enclosures optimized for USB interconnect
When USB3.0 was introduced, offering theoretical data signaling rates of 5 Gbits/s compared with the 480 Mbits/s available from USB2.0, the protocol became significantly more useful across a variety of applications. The latest standard to be published, USB3.1, further increases performance to 10 Gbits/s and reduces line encoding overhead. All flavors use a Type A […]
MPPSoCs now can run Android 5.1 and RTOS
Xilinx, Inc. today announced Android 5.1 (Lollipop) support for the Zynq UltraScale+Multi-Processor SoC (MPSoC). Through its Hardware Enablement Program, Mentor Graphics has used its extensive Android experience on heterogeneous multi-core platforms to successfully port the Android Open Source Project (AOSP) code to run on the Zynq UltraScale+ MPSoC. The resulting solution is the first to […]
World’s First WiGig USB Dongle
Peraso Technologies, a developer of Wireless Gigabit (WiGig) chipsets, announced the company will be demonstrating interoperability between its USB dongle reference design and a WiGig wireless AP. As several AP suppliers had announced products at CES 2016, it is critical for the WiGig ecosystem that consumers be able to enable legacy equipment into the WiGig ecosystem. […]
Ri-radio 802.11ac platforms boost Wi-Fi signals
Qualcomm announced at COMPUTEX 2016, that its subsidiary, Qualcomm Technologies, launched a new family of tri-radio 802.11ac platforms designed to boost the capacity of home networks and optimize its usage to deliver better consumer Wi-Fi experiences. The new platforms are designed to bring premium Wi-Fi features, like Multi-User MIMO (MU-MIMO) and Qualcomm Wi-Fi SON (Self-Organizing […]