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Reference designs

Reference platform speeds design of Wi-Fi HaLow devices based on IEEE 802.11ah spec

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Palma Ceia SemiDesign announced the availability of the company’s Wi-Fi HaLow Reference Platform, including all necessary hardware and software, for the design of Wi-Fi HaLow devices and systems based on the IEEE 802.11ah specification.

Wi-Fi HaLow is the Wi-Fi Alliance’s designation for products based on the IEEE 802.11ah standard for wireless network transmissions commonly referred to as Wi-Fi. It operates in spectra below one gigahertz (GHz) to offer a longer range and lower power connectivity. Wi-Fi HaLow, meeting unique needs for the Internet of Things (IoT), enables a range of use cases in agricultural, industrial, smart building, and smart city environments.

The Palma Ceia Wi-Fi HaLow Reference Platform consists of all necessary hardware and software to showcase the advanced connectivity capabilities of the IEEE 802.11ah standard.

Reference design speeds MCU-based Alexa-Built-in products

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STMicroelectronics has released an Amazon-qualified reference design package for smart connected devices leveraging Alexa Voice Service (AVS) Integration for AWS IoT Core, which can be used to create Alexa Built-in products using simple microcontrollers (MCUs).

AVS Integration for AWS IoT Core has the ability to transform the way users interact with smart “things,” bringing cloud-based Alexa experiences to items such as toasters, cookers, thermostats, blinds, hairdryers, and many others with no need for significant investment in electronic hardware. This could hasten the end for traditional buttons and dials, leading to new generations of products that offer easy and natural user interactions, adaptable smart features, and access to cloud services such as cooking advice or reordering of consumables.

ST’s Amazon-qualified solution jump-starts the design of Alexa-enabled appliance controllers, with Alexa voice-user-interface software already integrated on high-performing MCUs of the STM32 family. The energy-efficient STM32, being the world’s most successful 32-bit Arm Cortex-M MCU family, is ideal for low-cost, small, and simple connected devices that require state-of-the-art features such as far-field audio capture and natural-language understanding.

ST’s AVS Integration for AWS IoT Core reference design contains a compact 36mm x 65mm main board that combines a high-performance STM32H743 MCU and Wi-Fi module.

Unlike other devices commonly used for Alexa products, such as digital signal processors (DSPs) and flashless processors, STM32 MCUs integrate all necessary system features including powerful audio front-end processing, local wake-word detection, communication interfaces, and memory, including RAM and Flash, in a single chip. This integration enables the board to have small dimensions and a simple layout for cost-effective deployment in customers’ end products.

The audio front end delivers outstanding far-field voice detection, even in noisy environments and with closely spaced microphones. Created by ST Authorized Partner DSP Concepts, distributed by ST as part of the STM32 MCU, and supported by ST channels, the front end comes with a free Audio Weaver tool license to help users easily fine-tune their designs.

Leveraging the features of the high-performance STM32 microcontrollers, users can customize and scale their designs by adding enhancements such as a second wake word, extra local commands, and a graphical display to combine with the voice-command capability for an even more compelling user experience.

Further simplifying prototyping and development, the reference design hardware includes an audio daughterboard as a separate module. This contains an ST FDA903D audio codec, user LEDs and buttons, and two MP23DB01HP MEMS microphones spaced at 36mm for size-constrained products such as power switched plugs. The hardware’s modularity lets users implement a custom daughterboard if application-specific mic spacing, acoustics, and user-interface definitions are needed.

The reference design includes fully developed software that provides the features needed to support Alexa products, including Audio-capture software; Advanced Audio Front End (AFE) with noise reduction, echo cancellation and advanced beam-forming signal processing for far-field audio detection; Amazon “Alexa” Wake Word; Connectivity to AWS IoT; Audio output software

Working with this reference design enables product designers to certify new end products with AVS faster and more easily than bringing up the entire system independently. Both the hardware and software content can be easily adapted to support individual customers’ new-product concepts.

The bill of materials (BOM) for the reference design is engineered to be less than $10 when purchasing the components in high volumes. Please contact your ST sales office for pricing options and sample requests.

Camera simultaneously monitors drivers, captures vehicle occupants for one-way videoconferencing

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OmniVision Technologies, Inc. announced in advance of AutoSens Detroit the automotive industry’s first complete solution for dual-mode camera applications. This joint solution simultaneously monitors drivers while capturing vehicle occupants for one-way video conferencing. It features OmniVision’s automotive industry-first OV2312 image sensor, with a dual-mode global shutter that captures both RGB color images and IR images under low-light conditions. These dual captures are then processed simultaneously by Ambarella’s CV22AQ CVflow computer vision processor, which runs Smart Eye’s algorithms to analyze the driver’s state and alert the vehicle to any unsafe indicators, such as drowsiness. The companies worked together to integrate and fine-tune this solution, which is available as a complete reference design, allowing automotive designers to focus on differentiating their final application while simplifying the overall design effort.

The companies are currently in discussions with automotive OEMs regarding the implementation of this reference design in upcoming car models. This joint solution enables the full range of driver and cabin monitoring implementations, from safety applications to augmented reality displays and interior sensing with deep neural networks and AI. The solution’s one-way video conferencing allows remote conference participants to see those in the vehicle, while the vehicle receives only audio to reduce driver distraction.

The OmniVision OV2312 is a dual-mode automotive image sensor, enabling single-camera driver state monitoring and viewing applications, such as the videoconferencing capability in this reference design. It remains the automotive industry’s only RGB-IR global shutter image sensor while offering the smallest size in its class of 2MP sensors. The OV2312 provides advanced ASIL functional safety and industry-leading near-infrared (NIR) light performance of 14% quantum efficiency at the 940nm wavelength, along with excellent modulation transfer function (MTF). Its power consumption is also industry-leading, consuming just 190mW in typical conditions. The end result is that the OV2312 reduces the number of image sensors in the system, saving both power and space by eliminating the need for multiple rolling shutter sensors.

The OV2312 is the latest member of OmniVision’s automotive global shutter image sensor family. It is pin-to-pin compatible with the OV2310 and OV2311 family members, which provides designers with the flexibility to choose the best feature set for their needs.

Ambarella’s scalable CVflow processor family provides a full range of systems on chip (SoCs) across multiple performance and price points. The company’s powerful image signal pipeline (ISP), with support for OmniVision’s dual-mode RGB-IR color filter arrays, enables high-accuracy detection and monitoring, even in low-light, in-cabin environments. Its high dynamic range (HDR) processing extracts maximum image detail in high-contrast scenes, further enhancing the chip’s computer vision capabilities and the performance potential of Smart Eye algorithms.

Smart Eye’s DMS solution offers eye-tracking software for integration in passenger cars and other vehicles to facilitate better safety and other functions that improve the user experience. By carefully studying eye, facial and head movement, Smart Eye’s interior vehicle algorithms can draw conclusions about a person’s alertness, attention, and focus.

This joint reference design, including a demo board equipped with the three companies’ pre-tuned devices and software, is expected to be available to qualified customers later this quarter. Customers interested in obtaining this 3-way demo should contact their local sales representative for one of the three companies.

Chip design software works with 3-nm gate-all-around process technology

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Synopsys, Inc. announced the release of the 3-nanometer (nm) gate-all-around (GAA) AMS Design Reference Flow, which provides designers a complete front-to-back design methodology for designing analog and mixed-signal circuits using the Synopsys Custom Design Platform. It has been optimized to provide maximum designer productivity for designers of advanced 5G, HPC, AI, and IoT applications using the Samsung 3nm GAA process technology.

Complexity at advanced nodes means designers are looking for new methods to shorten design cycles. Through close collaboration, Samsung and Synopsys provide a flow that is optimized to overcome design complexity and provide the best possible products for 3nm GAA design. Key features of the flow include in-design electromigration analysis, which shortens design closure time by providing accurate electromigration analysis before the layout is complete. It also includes Live design rule checking (DRC) with Synopsys’ IC Validator physical verification solution, enabling layout engineers to quickly check for design rule violations directly from the layout canvas as they work.

The AMS reference flow provides a proven methodology for designing at 3nm GAA process technology. This methodology, which has been validated by Samsung, includes a full set of documented flows and design examples. Covered topics include design entry, circuit simulation, Monte Carlo analysis, noise analysis, RF analysis, aging, and EM/IR analysis, parasitic simulation, layout, and signoff.

The Synopsys Custom Design Platform is based on the Custom Compiler design and layout environment and includes HSPICE circuit simulator, FineSim circuit simulator, CustomSim FastSPICE circuit simulator, Custom WaveView waveform display, StarRC parasitic extraction, and IC Validator physical verification. The platform features natively integrated StarRC extraction to provide early feedback on the impact of parasitics on circuit behavior, performance, and pioneering visually-assisted layout automation capabilities that simplify the creation of advanced-node layout.

Reference design covers IO-Link transceivers

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Modern smart factories need to quickly and remotely adjust a sensor’s electrical characteristics to minimize downtime and maximize throughput. The MAXREFDES177# IO-Link reference design from Maxim Integrated Products, Inc. demonstrates the flexibility of the MAX22515 IO-Link transceiver, seamlessly configuring all modes of the MAX22000 software-configurable analog IO. This chipset provides flexibility with faster reconfiguration to reduce factory downtime.

Maxim Integrated’s chipset solution of MAX22000 and MAX22515 builds upon the benefits of IO-Link’s two-way universal interface. The IO-Link interface allows every IO-Link sensor, actuator, or IO expansion module to be interchangeable to a standard hardware interface. It also provides software-defined performance parameters and selectable analog input or output performance modes. These software-selectable capabilities are combined and demonstrated in the MAXREFDES177# IO-Link reference design.

MAX22000: The software-configurable analog IO provides up to more than half the power savings and approximately half the size compared to the closest competitive solutions on the market. Key functions integrated include a 24-bit ADC analog input mode and an 18-bit DAC analog output mode, as well as operations over either a single 2-wire interface or a 4-wire resistance temperature detector (RTD)/thermocouple (TC) temperature measurement.

MAX22515: The MAX22515 is the industry’s smallest ±1.2kV/500Ω surge-protected, single-channel IO-Link transceiver. It features high integration with protection diodes, auxiliary digital input, I2C or pin control, integrated oscillator, and selectable 3.3V or 5V LDO which help to provide high configurability and reduce SKU. It enables half the power dissipation due to low 2.2Ω or 2.65Ω (type) C/Q driver on-resistance compared to the closest competitor, in the smallest 2.5mm x 2.0mm WLP package. It cuts the solution size up to 67 percent compared to the closest competitor and fits into small, space-constrained IO-Link sensors or actuators.

Key Advantages include Software-configurable IOs and the ability to adjust device parameters on-the-fly provide new ways to dynamically optimize machine performance and reduce factory downtime; MAX22000 and MAX22515 are optimized for best-in-class power savings, using up to more than half the power savings for MAX22000 and half the power dissipation for MAX22515; The MAX22515 provides the smallest IO-Link single-channel footprint at 5mm² while the MAX22000 footprint is 86mm²

The MAX22000 is available at Maxim Integrated’s website, as well as authorized distributors; Pricing available upon request

The MAX22515AWP+ and MAX22515AWP+T are available at Maxim Integrated’s website for $1.45 (1000-up, FOB USA); also available from authorized distributors

The MAXREFDES177# reference design is available at Maxim Integrated’s website for $65

The MAX22000EVKIT# evaluation kit is available at Maxim Integrated’s website for $135

Health sensor kit cuts development time for wearables

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Save at least six months of development time using the Health Sensor Platform 3.0 (HSP 3.0) from Maxim Integrated Products, Inc. Also known as MAXREFDES104#, this ready-to-wear wrist form factor reference design monitors blood oxygen saturation (SpO2), electrocardiogram (ECG), heart rate (HR), body temperature, and motion. Included algorithms provide HR, heart-rate variability (HRV), respiration rate (RR), SpO2, body temperature, sleep quality, and stress level information at clinical-grade levels. It allows wearable designers to start collecting data immediately, saving at least six months over building these devices from scratch. Designed for wrist-based form factors, HSP 3.0 can be adapted for other dry electrode form factors such as chest patches and smart rings.

Compared to its industry-leading predecessor, Health Sensor Platform 2.0 (HSP 2.0), the HSP 3.0 adds optical SpO2 measurement and dry-electrode capability to the ECG. As a result, it can enable end solutions to monitor cardiac heart and respiratory issues for the management of ailments like chronic obstructive pulmonary disease (COPD), infectious diseases (e.g. COVID-19), sleep apnea, and atrial fibrillation (AFib). Compared to its predecessor, the narrower form factor and enhanced optical architecture of HSP 3.0 improves signal acquisition quality and uses upgraded microcontroller, power, security, and sensing ICs. The reference design includes complete optical and electrode designs, along with algorithms to meet clinical requirements.

Maxim Integrated is at the forefront of the wearable healthcare and remote patient monitoring revolution, enabling personalized healthcare as well as better predictive and preventive healthcare solutions. Medical professionals and end-users are using the wealth of health insights from these wearables. They can more proactively manage chronic conditions, diagnose acute conditions like COVID-19, and also improve preventive care and overall well-being. As more sensing modalities are included in wearables, device developers can take advantage of multiple measurements to improve the accuracy of the actionable insights that are being provided to users.

HSP 3.0 or MAXREFDES104# includes the following sensor, power management, microcontroller, and algorithm products:

  • MAX86176: Lowest-noise optical photoplethysmography (PPG) and electrical ECG analog front end (AFE), which offers 110dB signal-to-noise ratio (SNR) to add SpO2 saturation capability and over 110dB common-mode rejection ratio (CMRR) for dry electrode ECG applications. The device enables synchronous acquisition of PPG and ECG measurements, even with independent sample rates, providing pulse transit time for cardiac health use cases.
  • MAX20360: Highly integrated power and battery management power management IC (PMIC) optimized for advanced body-worn health sensing devices. It includes Maxim Integrated’s high-accuracy ModelGauge m5 EZ fuel gauge, a sophisticated haptic driver, and a unique low-noise buck-boost converter that maximizes SNR and minimizes power used for optical bio-sensing.
  • MAX32666: Bluetooth (BLE)-enabled, ultra-low-power microcontroller with two Arm Cortex-M4F cores and an additional SmartDMA which permits running the BLE stack independently, leaving the two main cores available for major tasks. Moreover, the microcontroller integrates an entire security suite and error-correcting code (ECC) on the memories to significantly increase the system’s robustness.
  • MAX32670: Ultra-low-power microcontroller dedicated to Maxim Integrated’s world-class PPG algorithms of pulse rate, SpO2, HRV, RR, sleep quality monitoring, and stress monitoring. It can be configured either as a sensor hub to support firmware and algorithms or as an algorithm hub to support multiple algorithms. The MAX32670 seamlessly enables customer-desired sensor functionality, including managing the MAX86176 PPG and ECG sensor AFE as well as delivering either raw or calculated data to the outside world.
  • MAX30208: The low-power, high-accuracy digital temperature sensor comes in a small package size of 2mm x 2mm. It has a 33 percent lower operating current compared to the closest competitive solution. It reads the temperature on the top of the package and can be mounted on a flex cable or PCB, making it easier to design into wearables. With an accuracy of 0.1-degrees Celsius, the MAX30208 meets clinical temperature requirements.

Key Advantages include: Saves at least six months in development time; Accuracy meets regulatory requirements for SpO2 and ambulatory ECG (IEC 60601-2-47); Addresses the needs of advanced health wearables with SpO2, ECG, HR, HRV, RR, body temperature and motion; Empowers designers to innovate with complete access to source code and design files

HSP 3.0, also known as MAXREFDES104#, is available with hardware, firmware, and algorithms for $400 at Maxim Integrated’s website

Open-source software, hardware advances autonomous applications with GNSS

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Septentrio announces two important open-source resources for its GPS/GNSS module receivers. The first, ROSaic, is a ROS (Robot Operating System) driver for the mosaic-X5 module as well as other Septentrio GNSS receivers. The second project, mosaicHAT, is an open-source hardware reference design combining mosaic-X5 with a Raspberry Pi single-board computer. Both projects facilitate the integration of centimeter-level reliable positioning into robotic and other machine automation applications.

ROSaic driver operates on ROS, a widely-used programming environment within the industry as well as academics, commonly used for integrating robot technology and developing advanced robotics and autonomous systems. ROS allows data from numerous sensors to be combined allowing high levels of autonomy.

The mosaicHAT project facilitates accurate and reliable GNSS positioning for robotics and automation on a hardware level. Numerous engineers today use Raspberry Pi for prototyping and initial integrations. The mosaicHAT board is an easy way for integrators to get started with Septentrio’s mosaic-X5 GNSS module. By plugging mosaicHAT into a compatible Raspberry Pi, users have access to high-accuracy positioning with a high update rate, ideal for machine navigation and control. The small 56×65 mm board exposes basic interfaces such as USB, serial, and general-purpose communication pins. The reference design, footprint, and documentation are available for easy board printing or further customization.

Raspberry Pi compute module 4 boasts smaller footprint, more memory

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Newark launched the new Compute Module 4 (CM4) from Raspberry Pi. The CM4 brings the power of the Raspberry Pi 4 to the compute module family and is accompanied by two accessories, the Compute Module 4 I/O (CM4IO) Board and the Compute Module 4 Antenna Kit.

CM4 is a faster and more powerful System on Module (SoM) than previous models, offering a greater range of connectivity and memory options for design engineers building embedded solutions. Key features include a small form-factor, greater power efficiency, PCle support, and a variety of multimedia interfaces. The power and versatility of CM4 make it an ideal solution for Artificial Intelligence, the Internet of Things (IoT), and a wide range of home and industrial automation applications. Raspberry Pi products are increasingly being used in product design with an estimated 40-50 percent of Raspberry Pi boards now being sold to industrial customers and Original Equipment Manufacturers (OEMs). As the highest volume manufacturing partner of Raspberry Pi, Newark has heavily invested in stock to ensure availability for volume orders, meaning that design engineers can integrate CM4 and other Raspberry Pi Compute Modules into new products with confidence.

CM4 is based on the acclaimed Raspberry Pi Model 4B single-board computer, with an updated form factor accommodating new interfaces such as dual HDMI, PCIe, and Gigabit Ethernet, in a reduced footprint. Access to the processor interfaces and GPIO pins is provided via dual 100 pin high-density connectors. For maximum flexibility, CM4 is available with different eMMC flash and DRAM density options, and with optional dual-band wireless connectivity. A “lite” variant is available without the eMMC fitted, making it an ideal solution for cost-sensitive applications.

The CM4 is packed with performance and connectivity features including Processor: a Broadcom BCM2711 quad-core ARM Cortex-A72 64-bit processor clocked at 1.5GHz, offering industry-leading performance and power efficiency; Memory: from 1GB to 8GB of LPDDR4-3200 SDRAM and up to 32GB of eMMC Flash memory depending on the model; Multimedia: hardware codec support for H.265 (up to 4kp60 decode) and H.264 (up to 1080p60 decode and 1080p30 encode); Connectivity: optional fully certified radio module, supporting dual-band IEEE 802.11 b/g/n/ac wireless networking and Bluetooth 5.0. An on-board electronic switch selects between an external or PCB antenna.

The CM4IO Board has been designed to simplify the development of new products using the CM4. It is suitable for the evaluation and prototyping of new products, serving as a reference design to interface external devices to the CM4, and can also be embedded directly into end products. The CM4IO Board can be used with the complete range of CM4 modules and features: Gigabit Ethernet connectivity with PoE support (requires separate Raspberry Pi PoE HAT); Two full-size HDMI connectors; Two USB 2 sockets, with a header for two more sockets; A micro-USB socket for updating the CM4 and a micro SD card socket for CM4Lite modules; A PCIe Gen 2 x1 socket

Also available, for use with CM4 variants with an on-board wireless module, is the Compute Module Antenna Kit. The Kit includes an external antenna which has been pre-certified or uses with the CM4, reducing additional compliance requirements when an external antenna is required within the design. It is supplied with a bulkhead fixture and a cable with a U.FL connector.

Newark stocks a market-leading range of SBCs from over 100 supplier franchises and offers 24/5 technical support to ensure customers can take advantage of the latest technology innovations for experiments and embedded solutions. Newark can also support customers as they take ideas from specification through to production with end-to-end product development solutions offered via the Avnet ecosystem.

The Raspberry Pi’s Compute Module 4 and accessories including the Compute Module 4 I/O Board and Compute Module 4 Antenna Kit are available from Newark in North America.

CMOS sensors provide detailed imaging with up to 45 Mp

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ON Semiconductor has expanded its XGS family of image sensors with high performance, low noise products that offer 12-bit image quality at a high frame rate. The new offerings include the XGS 45000, the XGS 30000, and the XGS 20000, which provide detailed imaging with up to 45 Mp for resolution critical applications and up to 60 fps in 8K video mode. Also available is the new XGS 5000, designed with low power performance and state-of-the-art image quality for compact 29 x 29 mm2 camera designs. Alongside the XGS 5000, 3 Mp and 2 Mp variants have been released for production.

All XGS devices feature a 3.2 μm pixel size giving high resolution while the advanced pixel design ensures low noise performance and image quality that is essential in challenging IoT applications such as machine vision and Intelligent Transportation Systems (ITS). A global shutter ensures that moving objects can be captured without any motion artifacts. To simplify and accelerate time-to-market, the XGS devices offer a common architecture that allows one camera design to be developed easily with multiple resolutions.

Proving the ease-of-use and image quality of the XGS family, several leading manufacturers have successfully integrated the technology into their designs. Teledyne Imaging, a global leader in digital imaging technology, recently announced the availability of its new GenieTM Nano-5G M/C8100  area scan camera, designed using the XGS 45000.

JAI A/S has integrated the XGS 45000 into its new 45 Mp industrial camera. The SP-45000M-CXP4 provides 44.7-megapixel monochrome resolution at a market-leading 52 frames per second and supports full 8K resolution at over 60 frames per second.

Basler also newly announced that they will integrate the XGS sensors into their boost platform which is based on the latest CoaXPress 2.0 machine vision standard.

ON Semiconductor offers a wide range of development tools to support the design process. A demo kit includes a hardware platform with DevSuite software. This allows full sensor evaluation with access to all register settings. The X-Celerator platform includes public FPGA code and provides a direct interface to standard FPGA development environments including Xilinx and Altera. Supporting XGS devices up to 16 Mp, the X-Cube platform is a full 29 x 29 mm2 reference design that offers HiSPi-to-MIPI conversion via a Lattice FPGA as well as image capture, processing, and analysis using the DevSuite software.

Software modem and reference design simplify design complexity for IoT apps

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Semtech Corporation announced two new enabling solutions for its LoRa Edge platform: LoRa Basics Modem-E, a LoRaWAN-based software modem for the LoRa Edge platform that runs inside the LoRa Edge transceiver, and the LoRa Edge Tracker Reference Design, a device-to-cloud commercial-grade reference solution for asset tracking applications.
 
LoRa Basics Modem-E, which forms part of the LoRa Basics library of software tools and solution accelerators, is fully compliant with the LoRaWAN protocol and designed specifically to run on the LoRa Edge hardware platform. The LoRa Edge Tracker Reference Design incorporates LoRa Edge hardware with the LoRa Basics Modem-E software modem in a streamlined industrial sensor design integrated with LoRa Cloud services to provide a ready-to-deploy reference solution for asset tracking.
 
LoRa Basics Modem-E embedded software, which will be tested and maintained by Semtech along with the latest versions of the LoRaWAN protocol, supports AES-128 bit encryption and enables the secure connection of sensors to any LoRaWAN compliant gateway. In addition, as a fully-certified production-ready LoRaWAN protocol-based modem, LoRa Basics Modem-E fast tracks the LoRa Alliance certification process, further accelerating time-to-market. LoRa Basics Modem-E also has APIs to easily integrate with Semtech’s LoRa Cloud Geolocation and LoRa Cloud Device & Application Services, including GNSS almanac updates, further simplifying solution development.
 
The LoRa Edge Tracker Reference Design has been developed in collaboration with Actility and Tago.IO, leveraging both companies’ expertise in the asset tracking space, and includes LoRa Cloud Geolocation capabilities and Tago.IO’s Cloud-based dashboards and analytics to support the rapid deployment of POCs. Actility will also provide a complete tracking kit including the LoRa Edge Tracker Reference Design and a pre-provisioned gateway based on the LoRaWAN protocol to enable customers to quickly evaluate a complete end-to-end IoT tracking system.
 
To learn more, visit the LoRa Developer Portal. The software is available on GitHub.