This second part of the FAQ discusses the three upper layers of the IoT architecture, which extend beyond the physical and network layers. The middleware layer processes and manages raw IoT data from connected devices. The application layer provides user interfaces and visualization tools. The business layer converts technical capabilities into actionable business outcomes. Part […]
What are the different key layers of IoT architecture? part 1
A layered Internet of Things (IoT) architecture provides modularity, scalability, and flexibility, allowing each layer to focus on specific tasks and technologies. This FAQ series covers the five-layer IoT architecture and explains why it is a commonly used framework. This first part focuses on the first two layers. IoT Architecture provides a structured framework for […]
A survey of Wi-Fi connectivity modules for IoT applications: part 4
This last FAQ in this series will cover Broadcom, Telit Cinterion, and Renesas’s latest innovations in Wi-Fi connectivity solutions for IoT applications. These innovations continue to focus on Wi-Fi 6 and 7 technologies, which offer improved speed combined with other features. Broadcom: BCM43740/43720/47722/6765/6726/67263 Broadcom’s BCM43740/43720/47722/6765/6726/67263 are the latest versions of the company’s Wi-Fi modules, featuring […]
A survey of Wi-Fi connectivity modules for IoT applications: part 3
In this third of the multipart FAQ, we continue to survey three more Wi-Fi modules for IoT applications manufactured by Silicon Labs, NXP Semiconductors, and MediaTek. All three modules support advanced Wi-Fi standards, starting with Wi-Fi 6, which aligns with the current developments in the Wi-Fi industry. ©Silicon Labs: SiWG917 The SiWG917 SoC from Silicon […]
A survey of Wi-Fi connectivity modules for IoT applications: part 2
This second part of the multipart FAQ will focus on Wi-Fi modules from u-blox and Microchip Technology. u-blox, a Swiss company primarily known for GPS and cellular technologies, has recently expanded into Wi-Fi modules. Microchip Technology is based in the US and is known for developing low-power connectivity options for IoT applications. u-blox: MAYA-W4 Series […]
A survey of Wi-Fi connectivity modules for IoT applications part 1
Wi-Fi connectivity has become important for many IoT ecosystems, enabling data exchange with cloud servers and facilitating real-time monitoring. This multipart FAQ on Wi-Fi connectivity for modules for IoT applications will focus on 10 prominent manufacturers and their modules that every electronics engineer should know. This first part focuses on Expressif Systems and Texas Instruments, […]
A survey of Bluetooth connectivity modules for IoT applications: part 4
This final part of the FAQ covers the Bluetooth connectivity modules from Nordic Semiconductor and STMicroelectronics. The modules covered are based on higher processing power and advanced versions of ARM Cortex processors. Nordic Semiconductor: nRF54L Series The nRF54L series (Figure 1) from Nordic Semiconductor features a 128 MHz Arm Cortex-M33, providing sufficient processing power for […]
A survey of Bluetooth connectivity modules for IoT applications: part 3
Microchip Technology and Qualcomm have their own proprietary SoC in their Bluetooth modules. In this third part of the FAQ series, we discuss the RNBD350 and QCC711 Bluetooth low-energy (BLE) modules and explore their development kits. Microchip Technology: RNBD350 The RNBD350 is a compact BLE 5.2 module based on Microchip Technology’s PIC32CX-BZ3 SoC, designed to […]
A survey of Bluetooth connectivity modules for IoT applications: part 2
This second part of the FAQ series will cover Bluetooth modules from Texas Instruments and Quectel, focusing on ARM processors. Despite having a common processor with different processing speeds, these modules have unique features that make them suitable for different IoT applications. Texas Instruments: CC2745R-Q1 The CC2745R-Q1 Bluetooth module from Texas Instruments features a powerful […]
A survey of Bluetooth connectivity modules for IoT applications: part 1
Bluetooth connectivity continues to gain traction for IoT applications because of its unique features, such as Bluetooth Low Energy (BLE), effectiveness in short-range communications, and lower cost deployment. This multipart FAQ series will cover several manufacturers, including Silicon Labs and Infineon Technologies, characterized by ARM Cortex processors. Silicon Labs: EFR32BG26 Series 2 Bluetooth SoC The […]
