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Telecommunications

PA module, adaptive aperture tuner and filters optimized for 600 MHz LF band

October 17, 2017 By Aimee Kalnoskas Leave a Comment

2x2 802.11ax-ready solution

Qualcomm Technologies’ additions to the RF Front-End (RFFE) portfolio are designed to allow original equipment manufacturers (OEMs) to rapidly build mobile devices that support new operator deployments of Band 71, a 600 MHz low-frequency band. This prime spectrum brings greater capacity to mobile operators’ networks, in addition to enhanced outdoor coverage and indoor penetration. Smartphones, […]

Filed Under: Applications, Telecommunications, Wireless Tagged With: QualcommTechnologies

1U rackmount, multi-domain Ethernet switch/router uses Intel Xeon E5 server CPU

October 9, 2017 By Aimee Kalnoskas Leave a Comment

General Micro Systems, Inc. announced the S1U401-MD “Cyclone,” a 1U rackmount, multi-domain server and multi-port Ethernet switch/router based on the Intel Xeon E5 server CPU. Designed for lowest price, space efficiency and ultimate battlefield network security, the product is a rugged packaging marvel. Each of the two isolated domains (Red/Black) in S1U401-MD boasts six times the functionality […]

Filed Under: Applications, Telecommunications Tagged With: generalmicrosystemsinc

Nanosecond-accurate Ethernet switches target 5G apps

October 4, 2017 By Aimee Kalnoskas Leave a Comment

Microsemi Corporation announced its new Serval-T Ethernet switch product family delivering nanosecond accurate IEEE 1588 solutions that can meet next-generation 5G network as well as location-based service requirements. This unique device family, which includes Serval-T (VSC7415), Serval-TE (VSC7435) and Serval-TE10 (VSC7437), integrates Microsemi’s Carrier Ethernet Switch capabilities with an on-chip phase-locked loop (PLL), expanding the company’s portfolio of access networking and timing solutions. The […]

Filed Under: Applications, Telecommunications Tagged With: microsemicorporation

Cache coherent interconnect for accelerators test chip will use 7-nm FinFET process technology

September 14, 2017 By Aimee Kalnoskas Leave a Comment

Xilinx, Arm, Cadence Design Systems, Inc., and TSMC announced a collaboration to build the first Cache Coherent Interconnect for Accelerators (CCIX) test chip in TSMC 7nm FinFET process technology for delivery in 2018. The test chip aims to provide a silicon proof point to demonstrate the capabilities of CCIX in enabling multi-core high-performance Arm® CPUs […]

Filed Under: Applications, Connectivity, Data centers, Telecommunications Tagged With: ARM, cadencedesignsystems, tsmc, xilinx

Voice-over-powerline module targets public address, security systems

September 14, 2017 By Aimee Kalnoskas Leave a Comment

Renesas Electronics Corporation announced a new voice-over-power line communication (PLC) solution that enables both data communication and voice communication capabilities over existing power networks. The PLC solution reduces the amount of internal wiring required in buildings, enabling reduced implementation and maintenance costs for public address (PA) systems and security systems. The new solution consists of Renesas’ PLC software modem […]

Filed Under: Applications, Telecommunications Tagged With: renesaselectronicscorporation

LTE-connected tracker platform simplifies developed of IoT tracker devices

September 7, 2017 By Aimee Kalnoskas Leave a Comment

Sequans Communications S.A. LTE chipmaker and STMicroelectronics introduce CLOE, a new LTE-connected tracker platform based on the integration of Sequans and ST technologies. An acronym of Connecting and Locating Objects Everywhere, CLOE combines two Internet-of-Things (IoT) technologies into one comprehensive platform that simplifies the development of LTE-based IoT tracker devices for the full range of vertical markets, […]

Filed Under: Applications, Connectivity, Industrial, Industry News, IoT, microcontroller, Telecommunications Tagged With: sequanscommunications

Next-gen cellular modems include BLE, USB facilities

September 6, 2017 By Aimee Kalnoskas Leave a Comment

Digi International a leading global provider of machine-to-machine (M2M) and Internet of Things (IoT) connectivity products and services, today unveiled the innovative features and capabilities powering the newest Digi XBee Cellular modems. Digi will be introducing three new variants to its lineup: Digi XBee Cellular gen 2 modem designed for the AT&T Cat 1 cellular network, […]

Filed Under: Applications, Connectivity, Telecommunications Tagged With: digiinternational

SoCs deliver LTE connections, power efficiency, support for next-gen dual-camera features

August 29, 2017 By Aimee Kalnoskas Leave a Comment

MediaTek Inc. today introduced the newest members of the Helio chipset family, the Helio P23 and Helio P30 system-on-chips (SoCs). The new chipsets, designed to deliver performance and power efficiency, dual camera photography, dual SIM and dual 4G VoLTE capabilities, support the explosion of innovation in the mid market.  “Reaching the mid market means bringing […]

Filed Under: Applications, Connectivity, Telecommunications Tagged With: mediatek

LTE-Advanced Mini Card supports download speeds of up to 600 Mbps

August 22, 2017 By Aimee Kalnoskas Leave a Comment

Telit announced the LM940, the world’s first global Full PCI Express Mini Card (mPCIe) module for the router and gateway industry supporting LTE Advanced Category 11 (Cat 11) with speeds of up to 600 Mbps, available with various mobile network operator approvals in the fourth quarter of 2017.  The only enabling technology in an mPCIe […]

Filed Under: Applications, Connectivity, Data centers, IoT, Telecommunications Tagged With: qualcommincorporated, telit

Modulating 5G

April 21, 2017 By Lee Teschler Leave a Comment

The IoT will make heavy use of fifth-generation mobile networks that use a yet-to-be-determined modulation scheme. Here are the major contenders. LEE TESCHLER | EXECUTIVE EDITOR Fifth-generation mobile networks, abbreviated 5G, will form the telecommunications standards for the internet of things. Planners say 5G will have a higher capacity than the current 4G equipment partly […]

Filed Under: Embedded, FAQ, Featured, IoT, Telecommunications Tagged With: basics, FAQ

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