Two low-power, dual-mode Bluetooth 5.0 and Bluetooth Low Energy (BLE) microcontrollers include support for Bluetooth mesh networking for the Internet of Things (IoT). The new CYW20819 and CYW20820 MCUs each provide simultaneous Bluetooth 5.0 audio and BLE connections, delivering low-power wireless solutions that enable music and voice commands for battery-powered fitness bands, health monitoring devices, […]
Wireless
RF SoCs cover sub-6-GHz spectrum, direct RF sampling
Xilinx, Inc. today announced it has extended its Zynq UltraScale+ Radio Frequency (RF) System-on-Chip (SoC) portfolio with greater RF performance and scalability. Building on the multi-market success of the Zynq UltraScale+ RFSoC base portfolio, next-generation devices can cover the entire sub-6 gigahertz (GHz) spectrum, which is a critical need for next-generation 5G deployment. They support […]
NFC chip helps comply with new EMVCo 3.0 contactless interoperability tests
The STMicroelectronics ST25R3916 NFC Universal Device contains innovative features to simplify the design of payment terminals and ease compliance with new EMVCo 3.0 contactless interoperability tests for cards, mobiles, and wearables. ST’s new NFC Universal Device builds on features of the preceding ST25R3911B, which was the first reader offering Dynamic Power Output (DPO) to keep the field strength […]
BLE modules now integrate PCB antenna
u-blox announced that its popular NINA-B3 series of stand-alone Bluetooth 5 low energy modules now includes the NINA-B306/316 modules with integrated PCB antenna. The trapezoidal printed antenna, technology licensed from Proant AB, enable superior performance transmission and reception of data in a small form factor. Bluetooth low energy is rapidly becoming the short-range wireless technology […]
Ultra-wideband chipset supports IEEE 802.15.4z standard
Decawave, the global leader in Ultra-Wideband (UWB) semiconductors, today announced the roadmap for its next generation UWB chipsets aimed at solving the global need for increased mobile transaction security. The new chipsets will be the world’s first to support the new IEEE 802.15.4z (4z) standard currently in the final stages of development. “Today’s mobile devices […]
Amazon joins Zigbee Alliance board of directors
The Zigbee Alliance, an organization of hundreds of companies creating, maintaining, and delivering open, global standards for the Internet of Things (IoT), today announced that Amazon will join its Board of Directors. As IoT growth continues to accelerate, prominent companies in the tech industry are collaborating within the Zigbee Alliance to shape the direction of […]
New ICs cut Wi-Fi power consumption in half
Designed for the specific needs of IoT applications, the Wireless Gecko portfolio cuts Wi-Fi power consumption in half compared to competitive offerings, providing ideal Wi-Fi solutions for power-sensitive connected products, including battery-operated IP security cameras, point-of-sale scanners, asset trackers and personal medical devices. Half the power of existing Wi-Fi options: The combination of industry-leading transmit […]
What’s new with Wi-Fi 6? Focus on high-efficiency
The first widespread home electrical appliance was the toaster, and 90% of homes today still have one.[i] Today, wireless connectivity to the internet is as ubiquitous as electricity was a hundred years ago. Smartphones, tablets, wearables, laptops, televisions, Nest thermostats, Alexa, Google Home, Ring video doorbell sensors, surveillance cameras, door locks, smart lighting, and anything […]
Combo chip handles both Wi-Fi 6 and AP+Bluetooth
MediaTek today announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology — Wi-Fi 6 (802.11ax) — for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home. MediaTek’s Wi-Fi 6 […]
LTE Advanced Category 20 module optimized for laptop, PC, and IIoT
Quectel Wireless Solutions announced the EM20, an LTE Advanced Category 20 module ahead of CES 2019. EM20 offers the maximum LTE throughput of 2.0Gbps Downlink and is optimized specially for laptop, PC and high-speed industrial IoT applications. Based on Qualcomm’s SDX24 chipset and fully compliant with 3GPP R13 specification, EM20 supports cutting-edge LTE wireless technologies such as up to 7 Carrier Aggregation (CA), 4×4 MIMO […]
