With the SHDSL standard, data can be transmitted over extremely long copper cables. This makes this technology the first choice in applications where Power over Ethernet and DSL technologies like G.FAST, VDSL are not possible. With its SHDSL Evaluation Kit, Würth Elektronik now offers developers the possibility to test applications with the SHDSL transceiver from Intel. […]
Ethernet
Dev kit simplifies development of 3D machine control and guidance systems
ACEINNA announced the general market availability of ACEINNA OpenRTK330LI EVK, a complete evaluation, and a development kit for the OpenRTK330LI GNSS/INS module. The OpenRTK330LI EVK accelerates development and reduces time to market of custom navigation and guidance systems fusing inertial measurements and multi-band RTK/GNSS positioning. The OpenIMU330LI Module is a very compact, low cost, state-of-the-art, […]
Open standard module release defines postage-stamp-sized computer PCBs
SGET e.V. announces release 1.0 of the new OSM Computer-on-Module standard. OSM, which is short for Open Standard Module, defines one of the first standards for directly solderable and scalable embedded computer modules. It also marks a new milestone in the miniaturization of modular COM/carrier designs, replacing credit card-sized modules with postage-stamp-sized ones. The new […]
mGig PHY chips boast low power consumption, exceed IEEE cable reach requirements
Marvell introduced its second-generation Alaska Octal Scalable mGig PHY family, bringing industry-leading performance, cable reach, low power, and speed to enterprise networking infrastructure. The mGig PHYs are the newest additions to Marvell’s borderless enterprise portfolio, a comprehensive set of Prestera switches, and Alaska PHYs architected to address the specific requirements as emerging mobility and cloud applications […]
Fiber-optic transceiver integrates 100 Mb/sec optical port in one component
KDPOF presents the brand new integrated Fiber Optic Transceiver (FOT) KD7051. It is the first device for optical in-vehicle connectivity that incorporates the transceiver IC, optoelectronics, and optics. The integrated FOT is a 100 Mb/s optical port in one single component. KDPOF’s new KD7051 thus substantially reduces the overall expense compared to STP (shielded twisted […]
COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]
Dev kit speeds industrial Ethernet comm projects for CC-Link IE TSN systems
IAR Systems announces the availability of the new evaluation kit IAR KickStart Kit for Renesas’ R-IN32M4-CL3, assisting developers in the development and evaluation of R-IN32M4-CL3 IC for industrial Ethernet communication which supports CC-Link IE TSN targeted for smart factory applications. The CC-Link IE TSN is an open Industrial Ethernet (IE) technology from CC-Link Partner Association. […]
Ethernet PHY chip transmits 10 Mbps signals up to 1.7 km
Texas Instruments introduced a new Ethernet physical layer (PHY) capable of transmitting 10-Mbps Ethernet signals up to 1.7 km through a single pair of twisted wires. The extended cable reach of the DP83TD510E is 1.5 km more than the 200-m requirement of the Institute of Electrical and Electronics Engineers (IEEE) 802.3cg 10BASE-T1L single-pair Ethernet specification. […]
EtherNet/IP spec now includes NAMUR NE 107 diagnostics
ODVA announced today that it has published enhancements to The EtherNet/IP Specification, which outline integration of NAMUR NE 107 diagnostics for process automation into CIP architectures. The addition of this capability provides industry-standard diagnostic information for process users while leveraging the benefits of industrial Ethernet. “The integration of NE 107 diagnostics is another step in fulfilling ODVA’s […]
Ethernet/IP enhanced to integrate IO-Link devices
ODVA announced today that it has published enhancements to The EtherNet/IP Specification, which outline how to integrate devices built to the IO-Link Communication Standard into CIP architectures. The addition of this capability allows for IO-Link sensors and devices at the lowest level of the network to be better connected with EtherNet/IP controllers and devices at higher levels […]
