SGET e.V. announces release 1.0 of the new OSM Computer-on-Module standard. OSM, which is short for Open Standard Module, defines one of the first standards for directly solderable and scalable embedded computer modules. It also marks a new milestone in the miniaturization of modular COM/carrier designs, replacing credit card-sized modules with postage-stamp-sized ones. The new […]
Ethernet
mGig PHY chips boast low power consumption, exceed IEEE cable reach requirements
Marvell introduced its second-generation Alaska Octal Scalable mGig PHY family, bringing industry-leading performance, cable reach, low power, and speed to enterprise networking infrastructure. The mGig PHYs are the newest additions to Marvell’s borderless enterprise portfolio, a comprehensive set of Prestera switches, and Alaska PHYs architected to address the specific requirements as emerging mobility and cloud applications […]
Fiber-optic transceiver integrates 100 Mb/sec optical port in one component
KDPOF presents the brand new integrated Fiber Optic Transceiver (FOT) KD7051. It is the first device for optical in-vehicle connectivity that incorporates the transceiver IC, optoelectronics, and optics. The integrated FOT is a 100 Mb/s optical port in one single component. KDPOF’s new KD7051 thus substantially reduces the overall expense compared to STP (shielded twisted […]
COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]
Dev kit speeds industrial Ethernet comm projects for CC-Link IE TSN systems
IAR Systems announces the availability of the new evaluation kit IAR KickStart Kit for Renesas’ R-IN32M4-CL3, assisting developers in the development and evaluation of R-IN32M4-CL3 IC for industrial Ethernet communication which supports CC-Link IE TSN targeted for smart factory applications. The CC-Link IE TSN is an open Industrial Ethernet (IE) technology from CC-Link Partner Association. […]
Ethernet PHY chip transmits 10 Mbps signals up to 1.7 km
Texas Instruments introduced a new Ethernet physical layer (PHY) capable of transmitting 10-Mbps Ethernet signals up to 1.7 km through a single pair of twisted wires. The extended cable reach of the DP83TD510E is 1.5 km more than the 200-m requirement of the Institute of Electrical and Electronics Engineers (IEEE) 802.3cg 10BASE-T1L single-pair Ethernet specification. […]
EtherNet/IP spec now includes NAMUR NE 107 diagnostics
ODVA announced today that it has published enhancements to The EtherNet/IP Specification, which outline integration of NAMUR NE 107 diagnostics for process automation into CIP architectures. The addition of this capability provides industry-standard diagnostic information for process users while leveraging the benefits of industrial Ethernet. “The integration of NE 107 diagnostics is another step in fulfilling ODVA’s […]
Ethernet/IP enhanced to integrate IO-Link devices
ODVA announced today that it has published enhancements to The EtherNet/IP Specification, which outline how to integrate devices built to the IO-Link Communication Standard into CIP architectures. The addition of this capability allows for IO-Link sensors and devices at the lowest level of the network to be better connected with EtherNet/IP controllers and devices at higher levels […]
PCIe and Gigabit Ethernet connectivity added to embedded analytics architecture
UltraSoC announced new high-speed communications capabilities within its embedded analytics architecture, supporting debug and performance optimization in datacenters, high-performance computing, AI and storage applications. The addition of PCIe and gigabit Ethernet connectivity gives developers and users access to fine-grained information about the real-world behavior of such products, both in-lab during product development, and in-life after […]
Super tiny signal transformers optimized for LAN interfaces
Würth Elektronik is expanding its extensive range of signal transformers. The new series of WE-STST Super Tiny Signal Transformers for LAN interfaces features a maximum component height of just 2.9 mm and can be used up to 1000Base-T applications with at least 350 µH inductance. The WE-STST series of signal transformers is ideally suited for […]
