TDK Corporation announces worldwide availability of the InvenSense SmartBug, a compact, wireless multi-sensor solution designed for a plethora of commercial and consumer IoT applications. The out-of-the-box solution enables quick and easy access to reliable and smart sensor data without the need for programming, soldering or extra modifications. SmartBug is an all-in-one sensor module that integrates […]
Sensor modules
Dual-photodetector optical sensor module in 0.88mm package enables thinner wearable designs
Maxim Integrated Products’ MAXM86146 dual-photodetector optical sensor drop-in module includes built-in algorithms for heart-rate and oxygen-saturation (SpO2) monitoring, as well as advanced activity classification. Its small size and ease of design enable innovative biosensing features in less space and support the rapid development of accurate, continuous health-monitoring devices. The MAXM86146 offers designers of advanced wearable […]
Redundant angle sensors support ASIL D requirements
TDK Corporation has announced the expansion of its tunnel-magnetoresistance (TMR) angle sensor portfolio with the new digital TAD4140 sensor. Designed for demanding automotive and industrial applications, compared to TDK’s existing digital angle sensor – the TAD2141 – the new TAD4140 features full redundancy with two signal processor units and 2×2 TMR bridges in a single […]
Inductive position sensor targets absolute position apps in industrial motors
Renesas Electronics Corporation introduced the magnet-free IPS2200 inductive position sensor. Featuring high accuracy and speed, total stray field immunity, and efficient motor integration in a thin and lightweight form factor, the IPS2200 is ideal for use as an absolute position sensor in a wide range of industrial, medical, and robot applications. The sensor allows customers […]
Ultra-low power AI sensor board speeds machine learning tasks
Eta Compute Inc. announced the debut of the world’s first integrated, ultra low power AI Sensor Board, the ECM3532 AI Sensor Board. Designed specifically for machine learning at the edge, the board reduces the initial phase of smart sensor development using its TENSAI SoC, including feasibility, proof of concept, and board design, from several months […]
On-chip thermal sensor takes up 7x less IC space
Moortec announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy measurement across a wide temperature range at enhanced conversion speeds. With over […]
Sensor platform uses AI for smart odor sensing in ventilation systems
Renesas Electronics Corporation expanded its popular ZMOD4410 Indoor Air Quality (IAQ) sensor platform with the power of embedded artificial intelligence (e-AI), enabling smart odor sensing for ventilation systems, bathroom monitoring and controls, and air quality monitors. The enhanced platform combines neural network-trained firmware on various microcontrollers (MCUs), such as the Renesas RL78 MCU, to provide higher resolution measurement […]
License for 3D stacked image sensor technology supports ToF, advanced sensor manufacturing
Xperi Holding Corporation and Tower Semiconductor announced Tower’s license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies. This technology complements Tower’s manufacturing of its state of the art stacked wafer BSI sensor platforms for time of flight (ToF), industrial global shutter and other CMOS image sensors on 300mm and 200mm wafers. In addition, Tower […]
Multi-function, mesh-sensor unit simplify IoT position tracking and sensor data collection
Fujitsu Component America, Inc. has released a series of battery-powered Wirepas Mesh technology mesh units and mesh-sensor units. The devices simplify construction of large-scale decentralized networks to allow scalable, reliable and cost-effective IoT solutions for position tracking and sensor data collection. In addition to deploying large-scale networks, the mesh units (FWM8BLZ07P) and mesh-sensor units (FWM8BLZ07Y) […]
Automotive wafer-level camera modules, 140dB HDR image sensors highlight flicker mitigation
OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip module—the world’s first automotive-grade, wafer-level camera. This 1 megapixel (MP) module has a compact size of 6.5 x 6.5mm to provide driver monitoring system (DMS) designers with maximum flexibility on placement within the cabin while remaining hidden from view. […]