Renesas Electronics Corporation introduced the magnet-free IPS2200 inductive position sensor. Featuring high accuracy and speed, total stray field immunity, and efficient motor integration in a thin and lightweight form factor, the IPS2200 is ideal for use as an absolute position sensor in a wide range of industrial, medical, and robot applications. The sensor allows customers […]
Sensor modules
Ultra-low power AI sensor board speeds machine learning tasks
Eta Compute Inc. announced the debut of the world’s first integrated, ultra low power AI Sensor Board, the ECM3532 AI Sensor Board. Designed specifically for machine learning at the edge, the board reduces the initial phase of smart sensor development using its TENSAI SoC, including feasibility, proof of concept, and board design, from several months […]
On-chip thermal sensor takes up 7x less IC space
Moortec announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy measurement across a wide temperature range at enhanced conversion speeds. With over […]
Sensor platform uses AI for smart odor sensing in ventilation systems
Renesas Electronics Corporation expanded its popular ZMOD4410 Indoor Air Quality (IAQ) sensor platform with the power of embedded artificial intelligence (e-AI), enabling smart odor sensing for ventilation systems, bathroom monitoring and controls, and air quality monitors. The enhanced platform combines neural network-trained firmware on various microcontrollers (MCUs), such as the Renesas RL78 MCU, to provide higher resolution measurement […]
License for 3D stacked image sensor technology supports ToF, advanced sensor manufacturing
Xperi Holding Corporation and Tower Semiconductor announced Tower’s license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies. This technology complements Tower’s manufacturing of its state of the art stacked wafer BSI sensor platforms for time of flight (ToF), industrial global shutter and other CMOS image sensors on 300mm and 200mm wafers. In addition, Tower […]
Multi-function, mesh-sensor unit simplify IoT position tracking and sensor data collection
Fujitsu Component America, Inc. has released a series of battery-powered Wirepas Mesh technology mesh units and mesh-sensor units. The devices simplify construction of large-scale decentralized networks to allow scalable, reliable and cost-effective IoT solutions for position tracking and sensor data collection. In addition to deploying large-scale networks, the mesh units (FWM8BLZ07P) and mesh-sensor units (FWM8BLZ07Y) […]
Automotive wafer-level camera modules, 140dB HDR image sensors highlight flicker mitigation
OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip module—the world’s first automotive-grade, wafer-level camera. This 1 megapixel (MP) module has a compact size of 6.5 x 6.5mm to provide driver monitoring system (DMS) designers with maximum flexibility on placement within the cabin while remaining hidden from view. […]
Six-DOF XYZ-axis gyroscope/accelerometer with SPI Interface targets autonomous vehicle apps
Murata has developed a new MEMS (Micro-Electro-Mechanical Systems) 6DoF (Six Degrees of Freedom) inertial sensor that realizes high performance for safety-critical automotive applications. The sensor enables new ADAS (Advanced Driver-Assistance Systems) functionality and AD (Automated Driving) through data fusion with GNSS (Global Navigation Satellite System) and various perception sensors such as camera, radar, and LiDAR. […]
Haptic drivers provide immersive touch experiences in PCs, wearables, automotive and gaming/VR
With the goal of elevating the user experience for a wide range of consumer devices, Cirrus Logic is developing an advanced product portfolio of haptic and sensing integrated circuits (ICs). Cirrus Logic’s haptic products and sophisticated haptic feedback technology enable sleeker, more robust end products with fewer mechanical controls for new responsive and immersive user […]
Time-of-flight sensors measure objects down to 2.5 cm
STMicroelectronics has extended the capabilities of its FlightSense ToF ranging sensors by introducing the VL53L3CX with patented histogram algorithms that allow measuring distances to multiple objects as well as increasing accuracy. The VL53L3CX measures object ranges from 2.5cm to 3m, unaffected by the target color or reflectance, unlike conventional infrared sensors. This allows designers to introduce […]
