Real-Time Innovations (RTI), the Industrial Internet of Things (IIoT) connectivity company, today announced the newest release of its Connext product suite, Connext 6. Connext 6 includes the first connectivity software designed to accelerate the development and deployment of highly autonomous systems. It provides autonomous vehicle developers with the advanced technology they need to address the complex data […]
Tools
Development board adds Google Cloud to embedded applications
Creating cloud-connected applications traditionally can require significant time and resources for embedded designers to develop the necessary expertise in communications protocols, security and hardware compatibility. Developers often overcome these challenges with large software frameworks and Real-Time Operating Systems (RTOS), which results in increased development time, effort, cost and security vulnerabilities. Microchip Technology Inc. today announced a […]
Probe helps program/debug STM8, STM32 MCUs
STMicroelectronics has introduced the next-generation STLINK-V3 probe for programming and debugging STM8 and STM32 microcontrollers, adding enhancements to further increase flexibility and efficiency. Now featuring mass-storage support, a virtual COM port with multipath bridge, and three-times faster write performance, the competitively priced STLINK-V3 saves development time and easily reprograms devices in the field. In addition to providing typical JTAG/Serial-Wire Debug […]
EDA, Spice software supports TSMC 7-nm FinFET Plus, 5-nm FinFET processes
Mentor, a Siemens business, today announced certification for TSMC’s 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre nmPlatform and Analog FastSPICE (AFS) Platforms. In addition, Mentor continues to expand features of both the Xpedition Package Designer and Xpedition Substrate Integrator products supporting TSMC’s advanced packaging offerings. Mentor Calibre nmPlatform for TSMC 5nm and 7nm FinFET Plus […]
Cloud-based IC design environment includes TSMC design infrastructure, process technology
Synopsys, Inc. announced it has collaborated with TSMC and leading cloud providers Amazon Web Services (AWS) and Microsoft Azure, to provide a streamlined cloud-based IC design environment on the Synopsys Cloud Solution. The Synopsys Cloud Solution provides optimized, secure infrastructure and services to enable IC design and verification teams to take full advantage of the […]
PIC IDEs now support AVR MCUs
Designers who have traditionally used Microchip’s PIC microcontrollers (MCUs) and developed with the MPLAB ecosystem can now easily evaluate and incorporate AVR MCUs into their applications. The majority of AVR MCUs are now beta supported with the release of MPLAB X Integrated Development Environment (IDE) version 5.05, available today from Microchip Technology Inc. Support for additional […]
Programmers handle magnetic Hall effect sensors
TDK Corporation expands its tool chain for the easy programming of various Micronas Hall-effect sensors with the Magnetic Sensor Programmer MSP V1.0. It replaces the APB 1.5 and complements the existing programmer line, which comprises the USB-Programming Kit V1.01 and the HAL APB V5.1. These programmers are specially designed for use in the development laboratory. TDK now offers three […]
Development kit monitors ECG, heart rate and body temperature for wrist-worn wearables
Designers seeking to enable continuous monitoring of various health parameters can now quickly create unique, highly accurate wearable solutions using Health Sensor Platform 2.0 (HSP 2.0) from Maxim Integrated Products, Inc. This next-generation rapid prototyping, evaluation and development platform, also known as MAXREFDES101#, brings the ability to monitor electrocardiogram (ECG), heart rate and body temperature to a […]
Reference design facilitates Low Power Wide Area cellular IoT apps
Renesas Electronics Corporation announced the Renesas Synergy AE-CLOUD2 kit, a complete hardware and software reference design that allows embedded developers to quickly evaluate cellular connectivity options and build Low Power Wide Area (LPWA) cellular Internet of Things (IoT) applications. The AE-CLOUD2 kit together with the new Synergy Software Package (SSP) version 1.5.0 simplifies connecting IoT […]
BLE 5 and WiFi modules include protocol stacks and software tools
Designed as a way to implement the challenging process of going from silicon all the way to cloud, Silicon Lab’s new Wireless Xpress hardware-software solution enables help developers to get IoT applications connected and running in a day, with no software development necessary. Wireless Xpress provides a configuration-based development experience with everything developers need including certified Bluetooth […]